Synopsys has disclosed extensive EDA and IP collaboration with TSMC for advanced node designs, which have been used in a wide range of AI, high-performance computing, and mobile applications...
At the 2024 North America Technology Symposium, TSMC demonstrated its latest semiconductor process, advanced packaging, and 3D IC technologies, which will drive the next wave of AI...
AI Expo Taiwan 2024 was opened on April 24, with more than 20,000 people visiting the event on the first day. Jack Sun, who retired as the Chief Technology Officer (CTO) of TSMC and...
Intel has formed alliances with second-tier foundries including UMC and Tower Semiconductor to reduce costs and optimize production utilization, among other reasons, which may enhance...
Nvidia is arguably the biggest "beneficiary" of Artificial Intelligence (AI) so far, but the recent 10% plunge in Nvidia's stock price and the evaporation of its market capitalization...
TSMC continues to beef up its workforce to support the Taiwan-based foundry's fab expansion projects, and its global number of employees will exceed 80,000 by the end of this year,...
In the dynamic realm of AI, TSMC has secured the vast majority of customer orders, and foundry quotes now surpassing US$10,000 per wafer are primarily centered on the lucrative process...
Taiwan's Hsinchu Science Park (HSP) is set to expand after a new phase of preliminary evaluation was eventually approved by appropriate government bodies.
Although Samsung has been the subject of market rumors regarding Nvidia's placement of its 2.5D packaging orders, industry sources recently said there is no information regarding...
Noticeable earthquakes hit Taiwan in the early morning of April 23. Especially at 8:04 a.m., a Richter scale 5.8 earthquake occurred again off Hualian.
Novatek Microelectronics, a specialist in Display Driver ICs (DDI), has recently revealed a list of Board of Directors (BOD) who will be reelected. Nevertheless, United Microelectronics...
Upon TSMC Arizona's signing of a Preliminary Memorandum of Terms (PMT) with the Biden Administration, the decision to manufacture 2nm chips in its third fab and part of the second...
TSMC's advanced packaging CoWoS capacity continues to have strong demand. Even after doubling its capacity in 2024 and collaborating with OSAT companies, it can still not fully meet...
As the AI boom gains momentum, the High Bandwidth Memory (HBM) sector emerges as a pivotal battleground, with three major memory chipmakers vying to reshape the industry landscape...
On April 19, SK Hynix announced that it had recently signed a memorandum of understanding (MOU) with TSMC. The two companies will collaborate closely on producing next-generation...
