TSMC confirmed that a CoWoS advanced packaging factory will be set up in Chiayi, a farming county and mid-sized city combined (with a 700,000 population), located north of Tainan.
Intel CFO David Zinsner recently told investment bank analysts that Intel is still one of the big customers of TSMC and will continue to outsource chip production to TSMC in a conference...
US chip design startup Cerebras Systems has announced its Wafer Scale Engine 3 (WSE-3) processor, which uses TSMC's 5nm process. Compared to its predecessor, the WSE-2, the WSE-3...
Marvell Technology recently announced an expansion of its collaboration with TSMC to develop the industry's first 2nm silicon intellectual property (IP) technology platform designed...
Samsung Electronics, which aims to become the world's leading semiconductor foundry by 2030, still faces challenges breaking through TSMC's high market share in customer competitio...
Experts from key industries and government officials from Japan and Taiwan gathered at the 2024 Taiwan-Japan (Kyushu) Economic and Trade Forum to discuss strengthening collaboration...
TSMC is miles ahead of its competitors in foundry services and Intel has been trying to hit the Taiwanese rival where it hurts by frequently emphasizing the risks of concentrating...
AblePrint Technology (APT), a company specializing in pneumatic and thermal process solutions for semiconductor packaging, is optimistic about the growing demand for advanced packaging...