China's fabless chipmaker Unisoc has used Imagination's Series3NX neural network accelerator (NNA) IP in its Tanggula T770 and T760 system-on-chips (SoC) for 5G smartphones, according...
China IC designer Unison has entered volume production of two 5G smartphone SoCs fabricated using 6nm EUV process, dubbed T770 and T760, looking to expand its presence in the 5G handset...
China's Unisoc will see shipments of its smartphone application processors hike over 100% on year in the second half of 2021, according to Digitimes Research.
Unisoc will see shipments of its smartphone application processors for use by China-based handset companies climb 152% on year to 68.2 million units in 2021, enabling it to unseat...
Shipments of smartphone application processors for use by China-based handset vendors reached 212 million units in the first quarter of 2021, increasing 0.2% from a quarter earlier,...
China-based SoC solution provider Unisoc has made significant gains in China's mid-tier 5G SoC chip market after local IT product vendor Hisense launched its 5G phone, the F50 5G,...
Unit prices for SoC chips used in true wireless stereo (TWS) earbuds have fallen below US$1.50 recently, down from US$2.50-3 in the first quarter of 2019, amid growing presence of...
The entry-level to mid-tier SoC solution segment has become the main battlefield for winning 5G SoC orders as major chip players including Qualcomm, MediaTek and Unisoc are gearing...
Apart from Samsung and Huawei, both of which rely heavily on chips developed in-house, other first-tier China-based smartphone vendors including Oppo, Vivo, Xiaomi and OnePlus are...
Chipset suppliers, including Qualcomm, MediaTek and Unisoc Technologies, are facing increasing pressure to slash prices of their 5G solutions in order to make a preemptive presence...
Tsinghua Unigroup's chipmaking arm Unisoc expects to have its Ivy 510-series 5G solution featured in customers' terminal devices that are slated for launch by the end of 2019.
Unisoc has rolled out its new Bluetooth 5.0-certified solution, dubbed RDA5882, to support dual-mode BLE module designs for true wireless stereo (TWS) headsets.
