According to data from a consultative council of the Japanese government, subsidies provided to the semiconductor industry by the Japanese government over the past three years have...
Since the introduction of Nvidia's Blackwell processor platform, liquid-cooling heat dissipation has been seen as a trend in heat dissipation technology.
TSMC and Samsung Electronics stand to gain from subsidies provided by the US government to a lesser extent, according to sources at semiconductor equipment companies.
The US Department of Commerce (DOC) and Samsung Electronics signed a non-binding preliminary memorandum of terms (PMT) on April 15 to provide up to US$6.4 billion in direct funding...
Rapidus has announced the formation of a US subsidiary, Rapidus Design Solutions (RDS), the establishment of an Americas office in Santa Clara, California, and the appointment of...
The US is a standout destination for investors in artificial intelligence because of its push to develop more advanced chipmaking at home, according to Silicon Valley-based Celesta...
Taiwan's Ministry of Finance (MOF) released preliminary import and export trade statistics for March 2024 and found that under the strong global demand for AI servers, Taiwan's overall...
In a landmark bilateral summit, the United States and Japan have solidified a groundbreaking partnership to spearhead the global transition towards clean energy. As reported by Nikkei,...
SK Siltron, a silicon carbide (SiC) wafer manufacturer in the United States, is set to receive a US$77 million subsidy from the state of Michigan, following a US$544 million loan...
As the US seeks to increase its share of production capacity, inviting Asian companies to invest and expand in the US, shifting new wafer fab projects from the Asian continent to...
DIGITIMES Research analyzed the US CHIPS Act grant program for TSMC and found that although TSMC received US$6.6 billion compared to Intel's US$8.5 billion, the US government still...
