Apple has informed its upstream partners it will stop paying non-recurring engineering (NRE) fees for the development of new iPhones' chassis and metal frames, according to industry...
While SiP substrates are increasingly needed to support function upgrades on wearables, TWS earbuds and other devices, rigid-flex PCBs will firmly stay as mainstream applications...
Global shipments of wearable devices totaled 84.5 million units in the third quarter of 2019, an on-year increase of 94.6% and a new record for shipments in a single quarter, according...
Smart glasses enabled by AR/MR technologies may gradually replace smartphones, with such a trend beginning to emerge in 2023 according to Tom Liang, chairman for both Taiwan-based...
As 5G penetration rate is expected to reach 50% in 2023, smart augmented reality (AR) glasses will begin entering the consumer market, according to Digitimes Research.
Taiwan-based Nan Ya PCB is expected to double its 2020 capex from NT$3.5 billion (US$114.8 billion) in 2019 to expand capacity for ABF substrates for 5G network applications and SiP...
Germany-based Covestro, spun off from the Bayer Group in September 2015, is now among the world's leading makers of premium polymers with 30 production bases and around 16,000 employees...
Chinese handset vendors are keen on utilizing anylayer HDI boards as mainboards for high-end smartphones adopting 7nm APs, and Taiwan-based PCB makers including Compeq Manufacturing...
Foxconn Technology Group will step up transforming into a provider of technology services by deepening deployments in electric vehicle, smart heath care and robot industries while...
Inventec expects to post a significant increase in its server business revenues next year when server shipments worldwide are expected to rebound by 4-6%, according to company president...
Acer has announced consolidated revenues of N$62.87 billion (US$2.05 billion) for the third quarter of 2019, growing 14% sequentially with gross margin of 10.6%. Net profit for the...
Taiwan's Kinsus Interconnect Technology and Nan Ya PCB are both reportedly among SiP (system in package) substrate suppliers for Apple's just-unveiled AirPods Pro series, which adopt...
Shipments of wearable devices in Europe grew 154.4% on year to 13.4 million units in the second quarter of 2019, with earwear accounting for 52.3% of shipments in the region, followed...
Taiwan-based Holtek Semiconductor has developed its first AI chip solution to tap smart living application opportunities and has also launched a spate of new MCU products for automotive,...
