Qualcomm has contracted both Amkor Technology and Siliconware Precision Industries (SPIL) to provide backend services for its just-unveiled flagship smartphone SoC, according to industry...
Taiwan-based RichWave Technology, which specializes in Wi-Fi FEM (front-end module) solutions, expects a substantial pick-up in customer orders as early as the first half of 2023.
Despite Wi-Fi core chips recently starting to show signs of a slowdown, leading chipmakers like Broadcom, Qualcomm and MediaTek are still in full swing for the deployment of Wi-Fi...
China-based IC design houses, such as Espressif Systems, have stepped up their deployment in the Wi-Fi chip market by targeting a wide range of IoT device applications.
The first smartphones supporting much faster Wi-Fi 7 connections may debut as early as the second half of 2024, according to sources at IC backend houses and inspection labs.
Taiwan's IC design houses including MediaTek, Novatek Microelectronics and Realtek Semiconductor have sharply increased their new development projects for the next 1-2 years despite...
Taiwan's IC test interface specialists have seen strong demand for networking chips applications thanks to mounting penetration of Wi-Fi 6/6E solutions, compensating for the order...
Taiwan's IC inspection and certification labs including Sporton International, Audix and BTL continue to enjoy strong demand for Wi-Fi and other network chips, with order visibility...
Upstream core chips suppliers and downstream system makers of the networking communications segment are all optimistic that market demand remains very strong in the short or longer...
Taiwan's WinWay Technology, which provides high-end test sockets and other IC test interface solutions, expects its new probe card plant in Kaohsiung, southern Taiwan to come online...
Taiwan-based epiwafer suppliers and gallium arsenide (GaAs) foundries have cut into the supply chain for Qualcomm's recently-announced Wi-Fi 7 frontend module (FEM) solutions designed...
Qualcomm Technologies has announced new RFFE modules designed for Bluetooth, Wi-Fi 6E, and the next-generation standard, Wi-Fi 7. The modules are designed for a wide array of device...
Despite lingering handset sales uncertainty, mobile SoC vendors MediaTek and Qualcomm continue to roll out new high-end offerings, while Apple remains keen on developing high-performance...
Taiwan-based gallium arsenide (GaAs) foundries and epi-wafer suppliers have started delivering epi-wafer samples, which are used in power amplifiers (PA) for Wi-Fi 7 radio-frequency...
