Taiwan-based second-tier packaging and testing houses have enjoyed a pick-up of orders for flash memory, and 3D sensing and other optical components recently as their downstream clients...
Image sensor packaging specialist Xintec saw its net losses widen to NT$733 million (US$25.1 million) in 2017 from losses of NT$636 million in 2016. EPS stayed negative at NT$2.71.
MediaTek has announced its next-generation Wi-Fi chipset portfolio for connected smart home, office and other IoT applications. The MediaTek MT7686, MT7682, and MT5932 will deliver...
Specialty-IC packaging specialist XinTec has reported a seventh consecutive quarterly loss in the first quarter of 2017, in which net losses came to NT$248 million (US$8.23 million)...
Image sensor packaging house Xintec will have its 12-inch wafer-level chip-scale package (WL-CSP) line ready for volume production in the second half of 2015, according to company...
Advanced Semiconductor Engineering (ASE), Siliconware Precision Industries (SPIL) and Amkor Technology will continue to commit heavy investments for ramping their high-end backend...
Handheld devices incorporating functionality such as Bluetooth, FM radio, GPS and Wi-Fi have become the market driver for wafer-level packaging (WLP), Taiwan's Advanced Semiconductor...
Image sensor and MEMS-chip packaging house XinTec is expected to ship 300,000 wafer-level chip-scale packaging (WL-CSP) wafers in 2008, with shipments to gain more momentum in 2009,...
