Taiwan-based Xintec, a WLCSP (wafer level chip scale package) specialist under TSMC, has approved a capital expense of NT$2.5 billion (US$83.33 million) to expand capacity at existing...
Taiwan-based OSAT providers including ASE Technology, King Yuan Electronics (KYEC) and Tong Hsing Electronic Industries have posted on-year revenue increases for February 2021, and...
TSMC-invested backend house Xintec expects to enjoy a particularly strong first-quarter 2021 and stable revenue and profit increases for the entire year, thanks to brisk wafer-level...
The supply of display driver ICs has fallen short of demand, while capacities at 8-inch foundries stay tight. Backend houses are mulling raising their quotes to reflect the tight...
Display driver IC backend specialist Chipbond Technology and memory modules backend and EMS service provider Orient Semiconductor Electronics (OSE) have formed a long-term strategic...
Display driver IC backend specialist Chipbond Technology is constructing a new plant designed mainly for processing RF and PA components for use in 5G devices, which will significantly...
Winbond Electronics Corporation, a leading global supplier of semiconductor memory solutions, today announced the introduction of new HyperRAM products with WLCSP, which reaches an...
