Major printed circuit board (PCB) manufacturer Zhen Ding Technology (ZDT) held its year-end party on February 13, where chairman Charles Shen announced that full-year 2025 revenue...
PCB giant Zhen Ding Technology (ZDT) reported that despite the traditional consumer electronics off-season in the first quarter of 2026, strong demand for advanced AI products propelled...
Thailand's Board of Investment (BOI) recently approved a major investment plan led by Zhen Ding Tech (ZDT), the world's largest printed circuit board (PCB) manufacturer, in partnership...
Looking ahead to 2026, PCB industry leader Zhen Ding Tech. (ZDT) said demand remains solid across high-end applications such as AI servers, optical communications, and IC substrates,...
The PCB industry is making large upgrades. The largest beneficiaries of the AI boom are IC substrate makers that are part of the advanced chip packaging supply chain, such as Unimicron...
Zhen Ding Technology said next-generation AI server platforms entering mass production will drive a major revenue lift in 2026 and set up a doubling growth phase in 2027. The company...
Zhen Ding Technology (ZDT) has signed a strategic cooperation agreement with drill-bit supplier Topoint Technology, creating a partnership centred on high-end PCB precision drilling,...
The development of artificial intelligence (AI) chips has brought the printed circuit board (PCB) and semiconductor industries closer together. Zhen Ding Technology chairman Charles...
Zhen Ding Technology Group (ZDT), the world's largest printed circuit board (PCB) manufacturer, returned to SEMICON Taiwan 2025 to highlight how the AI boom is reshaping PCBs from...
Despite facing global end-market inventory adjustments and rising geopolitical uncertainties, Taiwan's printed circuit board (PCB) supply chain is shifting its capital expenditure...
Zhen Ding Technology, the world's largest printed circuit board (PCB) manufacturer, announced that its Chinese subsidiary, Avary Holding, has approved a major investment plan for its...
Nvidia is reportedly collaborating with its supply chain to develop an advanced packaging architecture called Chip-on-Wafer-on-PCB (CoWoP) for its Rubin GPU platform. This new design...
To advance its digital transformation strategy and embody the CA-PDCA continuous improvement philosophy, ZDT (Zhen Ding Technology Group) successfully hosted the 2025 H1 Lean &...
