Acer has introduced a new lineup of Chromebooks, gaming and ultra-thin notebooks targeted at users working and learning from home.

Taiwan ABF substrate makers have been running their production lines at full capacity, with new orders unlikely to be fulfilled until 2023, according to industry sources.

Chinese vendors have yet to release mmWave 5G models and corresponding infrastructure construction in China remains slow, according to industry sources.

Semiconductor manufacturers worldwide are on track to boost 200mm fab capacity by 950,000 wafers, or 17%, from 2020 through 2024 to reach a record high of 6.6 million wafers per month,...

Backend house ASE Technology will have its in-house developed embedded die technology, dubbed "Advanced Embedded Active System Integration (aEASI)," mainly applied to processing automotive...

Taiwan-based IC testing houses including King Yuan Electronics (KYEC), Sigurd Microelectronics and Ardentec have all kicked off R&D for more advanced 3nm-made chips, while also...

TSMC and other Taiwan-based pure-play foundries intend to carry out their capacity expansion projects cautiously and progressively to avoid the risk of overcapacity.

Solidworks, a developer of 3D engineering CAD software under Dassault Systemes, expects its sales from cloud computing-related businesses in 2021 to surge 6- to 7-fold from a year...

Taiwan's CCL makers Iteq and Elite Material (EMC) are gearing up to build additional capacity as demand from clients has outstripped their maximum capacity supply since the start...

To counter the geopolitical challenge and reduce its dependence on the US, China is accelerating investment in next-generation enabling technologies. Against this backdrop, the country...

Radio component revenue reached an all-time high in 2020, according to Strategy Analytics, which expects revenue to grow through 2025.

Orient Semiconductor Electronics (OSE) is looking to scale up its EMS business beyond the electronics sector, while strengthening its collaboration with backend house Chipbond Technology...

Taiwan's leading OSAT ASE Technology and its affiliate Siliconware Precision Industries (SPIL) reportedly will offer backend services for Qualcomm's newly-released Snapdragon 778G...

Qualcomm's just-unveiled Snapdragon 778G chipset with integrated X52 5G modem is manufactured using TSMC's 6nm process technology, and is designed mainly for midrange 5G-capable Android...

First-quarter 2021 smartphone AP shipments to China-based vendors amounted to 212 million units, maintaining a similar level to the prior quarter and soaring 56.9% from a year ago.