CONNECT WITH US
5G
The imminent arrival of the 5G era promises great business opportunities for various sectors
IN THE NEWS
Tuesday 10 December 2019
Backend partners to gain from Sony CIS capacity expansion in 2020
Taiwan's CMOS image sensor (CIS) packaging specialists including Kingpak Technology, Xintec,VisEra Technologies and Tong Hsing Electronic Industries are expected to benefit significantly...
Tuesday 10 December 2019
TSMC revenues up in November, UMC and VIS down
Taiwan Semiconductor Manufacturing Company (TSMC) saw its November revenues increase 1.7% sequentially, while revenues at United Microelectronics (UMC) and Vanguard International...
Tuesday 10 December 2019
Is designated 5G band feasible in Taiwan?
While the Taiwan government has designated frequency band of 4.8-4.9GHz with bandwidth of 100MHz for the public organizations and private enterprises to implement their dedicated...
Tuesday 10 December 2019
Flexible PCB makers gearing up for 5G iPhone antenna orders
Taiwan-based flexible PCB makers including Zhen Ding Technology and Flexium Interconnect are gearing up to capture orders for flexible antenna boards for 5G iPhones, especially those...
Tuesday 10 December 2019
Macronix gearing up for 3D NAND flash
Macronix International is poised to kick off commercial shipments of 48-layer 3D NAND flash chips in the second half of 2020, followed by volume shipments of 96-layer 3D NAND products...
Monday 9 December 2019
ASE reportedly grabs SiP orders for new Qualcomm PC processor
Qualcomm has launched new Arm-based processors for notebooks. Among the chips, the new Snapdragon 7c series designed for entry-level devices reportedly adopts ASE Technology's system-in-package...
Monday 9 December 2019
Smart glasses may replace smartphones, says Jorjin chairman
Smart glasses enabled by AR/MR technologies may gradually replace smartphones, with such a trend beginning to emerge in 2023 according to Tom Liang, chairman for both Taiwan-based...
Friday 6 December 2019
LTCC to be mainstream packaging material for mmWave modules
The market for packaging materials for 5G mmWave transmission modules is set to heat up in 2020, with LTCC (low temperature co-fired ceramic) likely to replace LCP (liquid crystal...
Friday 6 December 2019
Taiwan assigns 4.8-4.9GHz as dedicated 5G band for special purposes
The Taiwan government has decided to designate frequency band of 4.8-4.9GHz with bandwidth of 100MHz as a 5G band dedicated to use by the public and private sectors for special purposes...
Friday 6 December 2019
Taiwan IC backend sector to see growth in 2H19 thanks to 5G, says Digitimes Research
Despite the ongoing US-China trade tensions, Taiwan's IC packaging and testing industry is still expected to see second-half 2019 revenues grow from the first half thanks to rising...
Friday 6 December 2019
Prospects bright for silicon wafer suppliers, fab toolmakers
Taiwan-based silicon wafer suppliers and fab toolmakers, particularly those in the supply chain of TSMC, have enjoyed a ramp-up in orders recently and become optimistic about their...
Friday 6 December 2019
Smart AR glasses shipments to rise significantly in 2023, says Digitimes Research
As 5G penetration rate is expected to reach 50% in 2023, smart augmented reality (AR) glasses will begin entering the consumer market, according to Digitimes Research.
Friday 6 December 2019
AUO loses Motorola foldable Razr OLED orders to Chinese peers
Motorola has switched orders for flexible AMOLED panels for its new foldable smartphones to Chinese suppliers BOE Technology and China Star Optoelectronics Technology (CSOT) from...
Thursday 5 December 2019
Highlights of the day: 5G to see intense competition in midrange phone segment
Qualcomm has introduced its new 5G SoC lineup - the Snapdragon 865 series for smartphone vendors' flagship models...
Thursday 5 December 2019
Nan Ya may double capex in 2020 to hike ABF, SiP substrate capacity
Taiwan-based Nan Ya PCB is expected to double its 2020 capex from NT$3.5 billion (US$114.8 billion) in 2019 to expand capacity for ABF substrates for 5G network applications and SiP...