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Wednesday 10 September 2025
Compal partners with ZutaCore to redefine AI server cooling with waterless direct liquid technology
Taiwan's Compal Electronics has announced a strategic collaboration with US-based ZutaCore, a leader in waterless direct chip liquid cooling, to bring transformative cooling technology...
Wednesday 10 September 2025
AI infrastructure investment may enter adjustment phase in 2026, with small-and medium-sized business demand driving new momentum
At the SEMICON Taiwan event held in September, key international figures from the semiconductor, robotics, and future vehicle sectors convened, highlighting Taiwan's rising importance...
Wednesday 10 September 2025
Switzerland launches open-source AI model Apertus developed by top research institutes
Switzerland has unveiled Apertus, an open-source large language model created through collaboration between the Swiss Federal Institute of Technology in Lausanne (EPFL), the Swiss...
Wednesday 10 September 2025
Taiwan pushes immersion cooling, CoWoS tech into US AI server supply chain
Taiwan's Ministry of Economic Affairs has approved a NT$250 million (US$8.2 million) project spearheaded by Aewin Technologies, Kenmec Mechanical Engineering, and I-Chiun Precision...
Tuesday 9 September 2025
DDI supply chain shakeup for Apple's iPhone puts LX Semicon at risk

China's BOE Technology is moving to diversify Apple's iPhone display driver IC (DDI) supply chain, a shift that threatens South Korea's...

Tuesday 9 September 2025
Five years on, Taiwan's G2C positions local equipment makers at center of AI packaging shift
Soaring demand for AI computing is ushering the semiconductor sector into a fresh cycle of high-speed growth, pushing advanced packaging requirements to new heights. From infrastructure...
Tuesday 9 September 2025
Czech Minister of Research and Innovation visits Taiwan; NSTC highlights complementary technologies
Czech Minister for Science, Research and Innovation Marek Ženíšek recently visited Taiwan to meet with National Science and Technology Council (NSTC) minister Cheng-wen...
Tuesday 9 September 2025
PBA released their latest nano-precision dual gantry stage platform series for heterogeneous semiconductor advanced packaging and metrology equipment
The age of AI greatly boosts Semiconductor manufacturing demands in advanced packaging. As packaging complexity increases (more I/O, smaller bump pitches, higher density), making...
Tuesday 9 September 2025
Kakao to integrate ChatGPT into KakaoTalk in strategic partnership with OpenAI
South Korean internet giant Kakao has announced a partnership with OpenAI to embed the ChatGPT chatbot into its messaging app, KakaoTalk. The integration aims to provide seamless...
Tuesday 9 September 2025
Chroma to showcase advanced AI chip test solutions at SEMICON Taiwan 2025
Chroma ATE Inc. will participate in SEMICON Taiwan 2025, presenting a full suite of breakthrough semiconductor test solutions. The showcase will focus on applications in AI chips,...
Tuesday 9 September 2025
Samsung Electronics sees growth in Taiwan despite market challenges
Samsung Electronics has reported strong performance in Taiwan across smartphones, tablets, and wearables in 2025, overcoming challenges such as tariffs, exchange rate fluctuations,...
Tuesday 9 September 2025
Over 50 Taiwan IC design houses compete for govt subsidies
The government has long provided research and development subsidies to share the risks of innovation among manufacturers, a key strategy driving Taiwan's industry. As many as 53 companies...
Tuesday 9 September 2025
HBM race intensifies: Micron’s yield confidence fuels supply chain bets
The high bandwidth memory (HBM) market has become one of the most competitive arenas in the semiconductor industry, with Micron Technology signaling its confidence in its position...
Tuesday 9 September 2025
Samsung to double GDDR7 output following Nvidia B40 order
Nvidia has reportedly placed an order with Samsung Electronics for GDDR7 graphics memory, with the supply volume doubling compared to previous orders. Samsung's GDDR7 was previously...
Tuesday 9 September 2025
L&T Semiconductor Technologies acquires Fujitsu General Electronics' power module design assets
India-based IC design firm L&T Semiconductor Technologies (LTSCT) announced on Friday that it has acquired the power module design assets of Japan's Fujitsu General Electronics...