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IN THE NEWS
Monday 28 October 2024
TSMC Arizona chip yields surpass Taiwan's, a win for US push
Taiwan Semiconductor Manufacturing Co. has achieved early production yields at its first plant in Arizona that surpass similar factories back home, a significant breakthrough for...
Friday 25 October 2024
SK Hynix dismisses HBM oversupply concerns, deepens TSMC partnership for HBM4 development
SK Hynix delivered a record-breaking performance in the third quarter of 2024 with both revenue and operating profit reaching all-time highs, driven largely by its dominance in high...
Friday 25 October 2024
iPhone 16 sales surge in China and Taiwan, but challenges persist
Following the iPhone 16's release, robust sales reports have emerged from China and Taiwan, with market analysts anticipating continued growth driven by upcoming e-commerce holiday...
Friday 25 October 2024
Qualcomm's new Snapdragon 8 Elite boosts Samsung's competitiveness while raising questions about Exynos future
Qualcomm's newly unveiled mobile application processor (AP), the Snapdragon 8 Elite, demonstrates significant performance improvements over its predecessor and reportedly surpasses...
Friday 25 October 2024
Kioxia and Nanya join forces to develop next-gen DRAM
Japanese NAND flash leader Kioxia has partnered with Taiwan's Nanya Technology to develop groundbreaking DRAM technology that reduces component size by two-thirds. This milestone...
Friday 25 October 2024
Kioxia delays IPO amid stakeholder valuation concerns
Kioxia has postponed its IPO due to valuation concerns. Bain Capital, a major shareholder, is hesitant to proceed with the IPO at the current valuation, while Toshiba, the second-largest...
Friday 25 October 2024
PCB top players gather at TPCA 2024, eye AI-driven growth
TPCA Show 2024, Taiwan's premier PCB manufacturing event, spotlights the theme "Innovative AI in PCB," reflecting the transformative impact of generative AI technologies like ChatGPT...
Friday 25 October 2024
TSMC to see handset chip orders exceed NT$1 trillion in 2024
Despite a rumored drop in iPhone 16 orders, TSMC's handset chip revenue is expected to exceed NT$1 trillion (US$31 million) in 2024, according to supply chain sources.
Thursday 24 October 2024
Micron anticipates AI demand boost as EUV-based DRAM enters production in 2025
Micron Technology, which has fully allocated its HBM production capacity for calendar 2025, indicated that demand for AI will increase as it expands from cloud servers to consumer...
Thursday 24 October 2024
Electric bus fire puts spotlight on battery safety and management
Taiwan's push to electrify all public buses by 2030, with 11,700 diesel buses slated for replacement, has fueled rapid growth in the electric bus industry. However, safety concerns...
Thursday 24 October 2024
SK Hynix maintains edge in HBM3E, but HBM4 certification and Samsung's pursuit pose risks
SK Hynix will announce its financial results for the third quarter of 2024 on October 24. During its previous earnings call, the company indicated that shipments of its HBM3E products...
Thursday 24 October 2024
Wolfspeed halts EUR3bn SiC wafer plant, throwing Germany's semiconductor plans off track
Wolfspeed has suspended the construction of its SiC wafer plant in Ensdorf, Germany, as Europe's electric vehicle market faces a slowdown. This comes on the heels of Intel's halted...
Thursday 24 October 2024
Amid HBM3E supply challenges, Samsung appeals to Nvidia with GDDR7, foundry
As Samsung Electronics (Samsung) faces delays in the mass production of HBM3E, the company is looking to enter Nvidia's supply chain through its competitive GDDR DRAM offerings. Recent...
Thursday 24 October 2024
Dekra pours NT$1bn into Taiwan expansion for IoT, AI testing
Dekra, the world's largest independent testing, inspection, and certification organization, officially opened its new Taiwan headquarters in Linkou, New Taipei City, on October 23,...
Thursday 24 October 2024
PIDA seminar insights: Silicon photonics key to next-gen communication, AI and autonomous driving development
The integration of silicon photonics co-packaged optics (CPO) technology into network communication chips has become inevitable**, driven by its ability** to enable high-speed, low-latency...