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CE, IPC, automotive trends
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Wednesday 15 September 2021
Xiaomi unveils concept smart glasses
China-based Xiaomi has unveiled a pair of concept smart glasses featuring microLED micro-display matched with optical waveguide technology and weight of only 51g.
Wednesday 15 September 2021
TI, Onsemi raise analog chip prices, peers in Taiwan to follow suit
Analog chip vendors Texas Instruments (TI) and Onsemi have both made upward adjustments in their chip prices as delivery lead times have been prolonged to over six months, and their...
Wednesday 15 September 2021
Apple unveils new iPad with A13, iPad mini with A15
Apple has introduced its new iPad mini and new iPad (9th generation). The new iPad mini has a larger 8.3-inch Liquid Retina display in a new array of finishes, such as pink, starlight,...
Tuesday 14 September 2021
Highlights of the day: US chip vendors shift orders from China foundries
The US-China trade tensions are driving US chip vendors away from Chinese foundry houses, which neveretheless still...
Tuesday 14 September 2021
US notebook vendors stepping up pace of chip orders
US notebook vendors have stepped up their pace of chip orders, demanding more available supplies for the fourth quarter and next year, according to industry sources.
Tuesday 14 September 2021
SMIC to build additional, considerable 28nm and above process capacity
China's Semiconductor Manufacturing International (SMIC) will be expanding production capacity for 28nm and above process technologies by 2024, which will considerably boost its overall...
Tuesday 14 September 2021
Taiwan makers increasingly immune to sharp TV panel price falls, says AUO chair
Chances are slim for LCD TV panel prices to plunge to the cash cost level and Taiwan panel makers are now much more immune to the ongoing round of price falls amid changing industrial...
Monday 13 September 2021
IDMs, Foxconn, BYD deepening deployments in GaN, SiC devices
International IDMs, Taiwan's EMS leader Foxconn and China's semiconductor and EV vendor BYD Group are all keenly deepening their deployments in third-generation semiconductors GaN...
Friday 10 September 2021
Foxconn to make SiC components at 6-inch fab for EV, solar apps
Foxconn (Hon Hai) Technology Group has disclosed that at its newly-acquired 6-inch wafer fab in Hsinchu, northern Taiwan, the company will be making SiC components and IR MEMS sensors...
Friday 10 September 2021
Taiwan OSATs install additional wire-bonding equipment
Taiwan OSATs, including ASE Technology, Greatek Electronics, Lingsen Precision Industries and Orient Semiconductor Electronics (OSE), have all begun to install additional wire-bonding...
Friday 10 September 2021
BLU maker Coretronic sees increased August revenues
Coretronic saw consolidated revenues of NT$4.137 billion (US$148 million) for August increase 2.92% on month and 6.11% on year and those of NT$29.831 billion for January-August grow...
Thursday 9 September 2021
Highlights of the day: Taiwan IC vendors set to raise prices
Tight supply has pushed up foundry costs, fueling pressure on IC design clients. First-tier IC design houses are now...
Thursday 9 September 2021
Wire-bonding to be increasingly needed to process car-use IGBT, SiC modules, says K&S VP
As the relatively mature wire-bonding technology continues to advance, it has become fully suitable for processing automotive silicon-based IGBT modules, and SiC (silicon carbide)...
Thursday 9 September 2021
Taiwan PCB output value up 19.7% in 1H21
Taiwan-based PCB manufacturers saw their combined output value reach NT$355.7 billion (US$12.62 billion) in the first half of 2021, up 19.3% on year and the highest-ever record for...
Thursday 9 September 2021
Wistron, Inventec enjoy shipment growth in August but may post disappointing performance in 3Q21
Notebook ODMs such as Wistron and Inventec may experience lower-than-expected shipments in the third quarter of 2021, due mainly to the ongoing IC shortages disrupting their deliveries,...