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Global supply chain: CE, IPC, automotive
CE, IPC, automotive trends
IN THE NEWS
Friday 25 June 2021
Lead times for aluminum capacitors prolonged to over 20 weeks
Delivery lead times for aluminum electrolytic capacitors have been prolonged to over 20 weeks, as demand continues to strengthen for applications ranging from power supply units,...
Friday 25 June 2021
Huawei to run foundry biz
Huawei will set up its first wafer fab in Wuhan, China's Hubei province, with production expected to kick off in phases starting 2022, according to industry sources.
Friday 25 June 2021
Notebook ODMs see chip supply improve
Improving chip supply will allow notebook ODMs to fulfill more of their orders in hand in the third quarter of 2021, according to industry sources.
Friday 25 June 2021
High ground of the supply chain: Japan and China
DIGITIMES has planned a series of special research projects, targeting the changes in the Asia market and supply chain. For the research, DIGITIMES has picked 100...
Friday 25 June 2021
More China firms looking to develop EV power modules in-house
More China-based companies are looking to follow in the footsteps of BYD, developing IGBT and SiC-base power modules for electric vehicles (EV) in-house, according to industry sources...
Thursday 24 June 2021
BT substrate suppliers kicking off shipments for new Apple devices
BT substrate vendors in the supply chain of Apple devices are all gearing up shipments for next-generation Apple Watch, AirPods and iPhone devices, which will all massively adopt...
Thursday 24 June 2021
Taiwan LCD TVs – 1Q 2021
Taiwan's TV shipments went down 34.2% sequentially to reach only 6.26 million units, due to seasonal factors and shortages of driver ICs, SoCs and panels.
Thursday 24 June 2021
Taiwan OSATs see car ICs demand promising for next 3-4 years
Taiwan-based OSATs and chip probing service providers are upbeat about backend demand for automotive chips over the next three to four years, as international IDMs such as Renesas...
Thursday 24 June 2021
New Apple Watch reportedly to adopt double-sided SiP for PMICs
The upcoming Apple Watch series reportedly will massively adopt double-sided SiP packaging for power management ICs, with ASE Technology as the main backend partner, according to...
Thursday 24 June 2021
KLA launches new portfolio of automotive products
KLA has announced the launch of four new products for automotive chip manufacturing: the 8935 high productivity patterned wafer inspection system, the C205 broadband plasma patterned...
Wednesday 23 June 2021
Taiwan leadframe makers land new orders from China
Taiwan-based lead frame makers including SDI and Jih Lin Technology have obtained new orders for intelligent power modules from China, according to industry sources.
Wednesday 23 June 2021
Chromebook sales to remain strong in Asia Pacific
Chromebook sales are expected to stay strong in the Asia-Pacific region in the second half of 2021, according to sources at brand notebook vendors.
Wednesday 23 June 2021
Automotive chip suppliers gearing up for output ramp-up
International automotive IC vendors have notified customers they can expect 30% more in shipments during the second half of 2021 compared to previous estimations, with their delivery...
Wednesday 23 June 2021
Actron to see SiC MOSFET validated by European carmakers in 3Q21
Automotive diode specialist Actron Technology has expanded its offerings to include SiC MOSFETs for electrical vehicles (EV), which are expected to obtain certification from first-tier...
Wednesday 23 June 2021
Taiwan IC design houses remain upbeat about 3Q21
Taiwan-based IC design houses remain upbeat about their sales growth in the third quarter of 2021, despite a recent cutback in orders from the notebook sector, according to industry...