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Global supply chain: CE, IPC, automotive
CE, IPC, automotive trends
IN THE NEWS
Friday 3 January 2020
KYEC starting 2020 with robust test orders for 5G, AI, CIS chips
Taiwan-based testing house King Yuan Electronics (KYEC) is expected to see its first-quarter 2020 revenues hit the highest record ever for the same quarter with monthly revenues to...
Friday 3 January 2020
SJSemi strengthens presence in wafer-level 3D packaging segment
SJ Semiconductor (SJSemi), a joint venture between China-based foundry SMIC and backend house JCET, has started implementing its second-phase development looking to strengthen its...
Friday 3 January 2020
Lessdo introduces home soap maker
With the launch of the world's first smart home soap maker Soapmaker 1.0, Taiwan-based Lessdo raised over NT$1 million (US$33,275) on the first day its crowdfunding campaign went...
Friday 3 January 2020
TSMC, KYEC reportedly grab orders for automotive AI chips from Intel
Foundry house TSMC and testing house KYEC have both obtained orders for automotive AI chips from Intel, with the orders set to generate revenues starting the second half of 2020,...
Friday 3 January 2020
Memory-centric solutions for next 20 years: Q&A with Macronix chairman Miin Wu
Taiwan-based Macronix International has developed into the world's largest supplier of ROM chips and second biggest maker of NOR flash memory chips after experiencing ups and downs...
Tuesday 31 December 2019
Supply chain continues moving out of China despite trade truce
The US-China trade tensions seem to be easing with both sides set to sign an agreement soon, but there is still so much uncertainty lying ahead that many IT supply chain players have...
Tuesday 31 December 2019
Ability Enterprise shifting focus to commercial, high-end consumer cameras
Digital camera ODM Ability Enterprise, to cope with decreasing demand arising from widespread use of smartphone cameras, has been shifting focus to commercial and high-end consumer...
Monday 30 December 2019
Highlights of the day: Taiwan CIS packagers to merge into heavyweight player
Two major Taiwan-based CMOS image sensor packagers Tong Hsing and Kingpark have agreed a merger deal that will make turn them into one of the world's largest packaging firms for the...
Monday 30 December 2019
Tong Hsing, Kingpak to merge into heavyweight CIS packager in Taiwan
A heavyweight CMOS image sensor (CIS) packaging firm will be born in Taiwan soon, as Tong Hsing Electronic Industries, a handset CIS backend and wafer reconstruction specialist, has...
Monday 30 December 2019
China-based Loongson unveils new CPUs
China-based CPU developer Loongson has announced its in-house developed 3A4000 series processors, which the company claimed were created without using intellectual properties (IPs)...
Friday 27 December 2019
ITTS listed on Taiwan OTC
Information Technology Total Services (ITTS), Teco Electric & Machinery's subsidiary provider of outsourced ERP-based IT and business process services, was listed on the Taipei...
Thursday 26 December 2019
Highlights of the day: Foldable-screen notebooks unlikely at CES
Foldable phones are already a commerical reality, and the market can expect to see more from multiple vendors in 2020. But those who are looking forward to foldable-screen notebooks...
Thursday 26 December 2019
LCD TV panel prices likely to rise 20% in 1H20
LCD TV panel prices may stage a rally in early 2020 thanks to an improved supply-demand balance, with the upward spiral to continue into the second quarter and quotes for mainstream...
Thursday 26 December 2019
Xintec profit soars in November
Niche-market IC packaging house Xintec has disclosed its net profit surged 252% from a year ago to NT$74 million (US$2.46 million) in November 2019. EPS for the month came to NT$0....
Thursday 26 December 2019
Intel not yet ready to promote foldable-screen notebooks
Intel is unlikely to promote foldable-screen notebooks until after issues such as insufficient flexible panel supply and immature OS support are solved in mid 2020, according to sources...