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Global supply chain: CE, IPC, automotive
CE, IPC, automotive trends
IN THE NEWS
Friday 13 December 2019
AMS puts increased focus on non-mass market applications
Austrian sensor chipmaker AMS will move to enhance its focus on non-mass market applications including automotive, industrial and healthcare, according to Daniel Lee, country manager...
Thursday 12 December 2019
HP eyeing bigger share in Taiwan notebook market
Hewlett-Packard (HP) is looking to expand its share in Taiwan's notebook market in 2020 to a double-digit percentage, according to Wendy Wang, chairman of HP Taiwan.
Thursday 12 December 2019
Backend firms to gain from robust high-spec auto CIS demand
Global makers of CMOS image sensors (CIS) are expected to embrace explosive demand for higher-specs CIS devices for application to autonomous vehicles in addition to handsets, which...
Wednesday 11 December 2019
Intel introduces Horse Ridge for quantum computers
Intel Labs has unveiled a cryogenic control chip, code-named "Horse Ridge," for speeding up development of full-stack quantum computing systems.
Wednesday 11 December 2019
TV panel prices likely to rebound in 1Q20 amid reduced inventories
Overall inventory of LCD TV panels has been brought down to healthy levels recently signaling that TV panel prices are likely to stage a rebound in the first quarter of 2020, according...
Wednesday 11 December 2019
AirPods 2 to drive growth at Unitech in 1H20
Taiwan-based PCB maker Unitech, having registered impressive revenues so far this year, expects stable shipments of HDI rigid-flex boards for AirPods 2 to persist into the first half...
Wednesday 11 December 2019
Taiwan handsets – 3Q 2019
Taiwan makers shipped 14.21 million handsets in third-quarter 2019, up 3% sequentially but down 34.8% on year.
Wednesday 11 December 2019
Worldwide wearables shipments surge 94.6% in 3Q19, says IDC
Global shipments of wearable devices totaled 84.5 million units in the third quarter of 2019, an on-year increase of 94.6% and a new record for shipments in a single quarter, according...
Tuesday 10 December 2019
Ibase to cross into energy storage business with Powin and Murata
Taiwan-based IPC maker Ibase Gaming has announced it will partner with US-based Powin Energy and Japan-based Murata Manufacturing to develop energy storage solutions.
Tuesday 10 December 2019
Backend partners to gain from Sony CIS capacity expansion in 2020
Taiwan's CMOS image sensor (CIS) packaging specialists including Kingpak Technology, Xintec,VisEra Technologies and Tong Hsing Electronic Industries are expected to benefit significantly...
Tuesday 10 December 2019
AVY expands into automotive component business via Japan affiliates
AVY Precision Technology is expanding its automotive component business to cover products including electric parking braking (EPB) system module and electric vehicle motor, and expects...
Tuesday 10 December 2019
Macronix gearing up for 3D NAND flash
Macronix International is poised to kick off commercial shipments of 48-layer 3D NAND flash chips in the second half of 2020, followed by volume shipments of 96-layer 3D NAND products...
Monday 9 December 2019
ASE reportedly grabs SiP orders for new Qualcomm PC processor
Qualcomm has launched new Arm-based processors for notebooks. Among the chips, the new Snapdragon 7c series designed for entry-level devices reportedly adopts ASE Technology's system-in-package...
Friday 6 December 2019
Smart AR glasses shipments to rise significantly in 2023, says Digitimes Research
As 5G penetration rate is expected to reach 50% in 2023, smart augmented reality (AR) glasses will begin entering the consumer market, according to Digitimes Research.
Thursday 5 December 2019
Lian Hong sees opportunity in notebook hinge business
Although the global notebook market's annual shipments have remained at around 160 million units for the past several years, Taiwan-based notebook hinge maker Lian Hong still sees...