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Global supply chain: CE, IPC, automotive
CE, IPC, automotive trends
IN THE NEWS
Friday 15 June 2018
Ventec to apply for listing on TWSE mainboard
Copper clad laminate (CCL) supplier Ventec International plans to apply for listing on the Taiwan Stock Exchange (TWSE) mainboard in the first quarter of 2019, according to company...
Thursday 14 June 2018
Wireless technologies to comprise 55% of connectivity IC shipments in 2018, IHS says
Driven by the colossal Internet of Things (IoT) opportunity, wireless technologies - including wireless local area network (WLAN), Bluetooth, cellular and low-power wireless - will...
Thursday 14 June 2018
Diode maker HYE enters into car vendor supply chain
Taiwan-based HY Electronic (HYE) with its automotive diodes has entered into the supply chain of Mercedes-Benz, according to industry sources. A ramp-up of orders for car electronics...
Wednesday 13 June 2018
IBM expects third exponential tech shift to be driven by AI
In bracing for the advent of the AI era, IBM has focused its efforts on developing AI and cloud application solutions, seeking to explore immense application opportunities ranging...
Wednesday 13 June 2018
LGD starts shipping OLED TV panels to Hisense
LG Display (LGD) has started shipping OLED TV panels to Hisense, which will roll out OLED TVs in the third quarter of 2018 at the earliest, according to a Korea-based Yonhap News...
Wednesday 13 June 2018
Chengdu Shuangliu District developing new economy, unicorns
The Shuangliu District of Chengdu, the capital city of Sichuan Province, is actively developing tech innovations and new economy, seeking to nurture 1-2 startup unicorns and over...
Tuesday 12 June 2018
Yageo not to drop production of commodity MLCCs, says chairman
Taiwan leading passive component maker Yageo will still do its best to satisfy customer demand for standard-type MLCCs for consumer devices despite its enhanced deployments in niche-type...
Tuesday 12 June 2018
Winbond to break ground for new fab in southern Taiwan
DRAM and flash memory maker Winbond Electronics will start constructing a new fab in Kaohsiung, southern Taiwan in September followed by equipment move-in slated for 2020.
Tuesday 12 June 2018
Computex reviving on multiple AI, gaming applications
Computex, which had been gradually losing its luster along with the rise of e-commerce and the slowdown of the PC industry in recent years, seems to start showing signs of revival...
Monday 11 June 2018
Pegatron gearing up to develop AI solutions as new growth driver
Taiwan-based ODM Pegatron will speed up deployments in emerging sectors such as AIoT (artificial intelligence IoT), AI, AR/VR and machine learning to brace for the advent of the AOE...
Monday 11 June 2018
Backend house Kingpak enjoys robust orders for auto CIS
IC backend service provider Kingpak Technology has enjoyed a ramp-up of orders for automotive CMOS image sensors (CIS), and will cut into the supply chain of China's first-tier electric...
Monday 11 June 2018
Acer reports mild increase in May revenues
Acer has announced consolidated revenues of NT$18.74 billion (US$628.16 million) for May, up 4.31% on year. Consolidated revenues from January to May reached NT$89.79 billion, up...
Monday 11 June 2018
Winbond intros new high-performance serial NAND flash for automotive
Winbond Electronics has announced the introduction of the W25N01JW, a high-performance, 1.8V serial NAND flash memory IC delivering a new high in data-transfer rates: 83MB/s via a...
Friday 8 June 2018
TSMC accelerating 7nm process production plan to meet demand
Taiwan Semiconductor Manufacturing Company (TSMC) is likely to move its 7nm process technology to mass production ahead of schedule to meet growing demand from its fabless clients...
Friday 8 June 2018
Winbond responds to market challenge with high performance serial NAND tapping into explosive growth in demand for automotive memory
Demand for automotive memory is showing explosive growth in recent years as a result of maturing ADAS technology, increasing demand for in-vehicle infotainment systems and automotive...