With the standards for the 5G protocols largely established, wireless communication providers in the US and Korea started to offer the service in select major cities starting third-quarter...

China with its 14th 5-year Plan (2021-2025) will be stepping up the development of the country's homegrown third-generation semiconductor industry supply chain, according to industry...

Taiwan's makers of RF and PA devices hope MediaTek can lead the local supply chain to meet competition from Qualcomm in tapping the mmWave 5G market, according to industry sources...

The global cellular baseband processor market grew 16% on year to US$7.2 billion in the second quarter of 2021, according to Strategy Analytics. Qualcomm capitalized on iPhone 12...

Supply of high-end CCLs continues to fall short of demand, and suppliers in Taiwan are likely to further hike their quotes in 2022 to reflect higher copper foil costs, according to...

Speculation has been circulating in the chipmaking market that AMD and MediaTek are in talks to form a joint venture that will be dedicated to developing SoC solutions combining Wi-Fi,...

GaAs device and foundry company Transom expects military-use radars and other defense systems to emerge as niche application outlet for GaN-on-SiC RF components and modules including...

Total foundry sales this year will surpass the US$100-billion mark for the first time, and continue increasing at a strong 11.6% average annual growth rate through 2025 when total...

NAND flash prices are expected to stay stable in 2022, but the supply of such chips is likely to turn tight in the second half of next year, according to Wallace Kou, president of...

MixComm, a provider of millimeter-wave (mmWave) and front-end solutions for 5G and Satcom applications, has recently announced a collaboration with SiTune, an innovator of multiple...

China-based Yangtz Memory Technologies (YMTC) has shipped over 300 million 64-layer 3D NAND flash memory chips and is ready to volume produce 128-layer QLC (quad-level cell) NAND,...

For the sixth straight quarter, the global smartphone applications processor (AP) market clocked a double-digit on-year revenue increase in the second quarter of 2021, according to...

Fabless chipmakers are looking to step up their deployments in the 5G RF front-end module (RF FEM) and other device markets by working closely with their manufacturing partners, according...

With the new-generation iPhones equipped with more antenna-in-package (AiP) modules, AiP packaging demand will be rising along with the iPhone sales, according to industry sources.

Taiwan's suppliers of high-speed transmission chips, which have obtained commitments from foundries to provide sufficient capacity support next year, are gearing up for a boom in...