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Friday 17 January 2020
Compal expects non-notebook shipments to surge in 2020
Compal Electronics expects its notebook shipments to register only flat growth on year in 2020, but shipments of its non-notebook products such as wearables, smart home devices, automotive...
Friday 17 January 2020
Taiwan PCB makers urged to widen tech lead in 5G applications
Taiwan's PCB industry ended 2019 with better-than-expected performance thanks to robust demand for 5G infrastructure and TWS (true wireless stereo) headsets applications offsetting...
Friday 17 January 2020
Taiwan needs to step up EDA development, says MOST
Taiwan's Ministry of Science and Technology (MOST) is urging the local industry and academy to devote more efforts to R&D on electronic design automation (EDA) to fill Taiwan's...
Thursday 16 January 2020
TSMC showcases InFO_PoP packaging tech at Nepcon Japan 2020
Nepcon Japan 2020 running January 15-17 in Tokyo saw its first-day semiconductor forum steal the show with heavyweight firms TSMC and Micron shedding light on latest packaging technologies...
Thursday 16 January 2020
Taiwan completes 5G spectrum auction
Taiwan's auction of 5G spectrums came to an end on January 16 after 261 rounds of bidding with total bids reaching NT$138.08 billion (US$4.604 billion), according to an announcement...
Thursday 16 January 2020
New Kinpo Group expects over 10% on-year growth in 2020 operation
The New Kinpo Group expects its operation to see a double-digit percentage growth on year in 2020 and many of the group's subsidiaries will be going public beginning this year, according...
Thursday 16 January 2020
PCB maker GCE to reap from more server, 5G applications in 2020
Gold Circuit Electronics (GCE) is expected to resume growth momentum in 2020 from a rebound in shipments for server applications after ending 2019 with revenues falling 7.65% on year...
Thursday 16 January 2020
IC substrate makers to gain from AiP modules for Apple 5G devices
Taiwan-based IC substrates suppliers are poised to benefit from Apple's move to adopt both TSMC's InFO_AiP (antenna in package) technology and ASE's FC_AiP process to package its...
Thursday 16 January 2020
TSMC 7nm lead time remains extended, with Intel reportedly looking to place orders
TSMC 7nm process lead time remains at about six months, with tight supply expected to last through 2020, or even worsened in the second half of the year if speculation about Intel...
Thursday 16 January 2020
Worldwide semiconductor revenue drops 11.9% in 2019, says Gartner
Worldwide semiconductor revenue totaled US$418.3 billion in 2019, down 11.9% from 2018, according to Gartner. Intel regained the No. 1 position in the market as the downturn in the...
Wednesday 15 January 2020
Highlights of the day: ASE reportedly enters Apple 5G supply chain
Taiwan's backend service provider ASE reportedly will be packaging mmWave 5G antenna modules for Apple's products to be launched this year. The iPad is said to be in Apple's...
Wednesday 15 January 2020
Cloud gaming streaming to highlight 5G services in 2020, says Digitimes Research
More mobile operators worldwide are enhancing their deployments in the cloud gaming streaming market to highlight the differentiated value that 5G networks will bring forth.
Wednesday 15 January 2020
PCB maker HannStar Board improving product mix
PCB maker HannStar Board continues to put increased focus on the higher-end notebook segment while stepping up its deployments in the segments of servers and network devices, seeking...
Wednesday 15 January 2020
Taiwan IC design houses ramping up output for 1Q20
Taiwan-based IC design houses have started ramping up their output for their customers' new products slated for launch mainly in China during the end of the first quarter and the...
Wednesday 15 January 2020
Flexium boosts 2020 capex to deepen 5G antenna deployment
Flexible PCB specialist Flexium Interconnect has set aside a capex of NT$6.7 billion (US$260 million) for 2020, more than double the figure of NT$3 billion for 2019, aiming to strengthen...