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Thursday 29 August 2019
Cooling solutions providers to expand capacities on 5G smartphone demand
Cooling module makers including Auras Technology, Chaun-Choung Technology (CCI) and Taisol Electronics are all moving to expand their capacities for vapor chambers (VCs) to cash in...
Wednesday 28 August 2019
MediaTek gearing up for volume production of single-chip 5G chips
MediaTek has started delivering samples of its first single-chip 5G solution designed for sub-6GHz networks, and expects volume production of the chip to kick off in the first quarter...
Wednesday 28 August 2019
Micron on track to kick off 1znm DRAM production in Taiwan
Micron Technology is already engaged in risk production of DRAM chips built using 1z-nanometer process technology at its Hiroshima fab in Japan, according to the US memory chip vendor...
Tuesday 27 August 2019
AMS positive about demand from 3 major upgrades in smartphones in 2019
Upgrades in smartphone specs and features such as facial recognition, all-screen design and enhanced camera capabilities continue to drive related chip and component demand this year,...
Tuesday 27 August 2019
Competition in 5G phone market heating up
Competition in the 5G phone market is set to heat up as more handset vendors have launched 5G-enabled models in line with the inauguration of commercial 5G networks around the globe,...
Monday 26 August 2019
Highlights of the day: Semiconductor industry on a rise
With 5G business opportunities starting to emerge, CCL makers have been keenly increasing their capacity to satisfy...
Monday 26 August 2019
Memory backend firms see bright revenue prospect for 2H19
Taiwan-based memory modules packagers Orient Semiconductor Electronics (OSE) and ChipMos Technologies are expected to see their revenues pick up month by month in the second half...
Monday 26 August 2019
CCL, IC substrate and flexible PCB demand to boom in 5G era
Chip and component demand for 5G related applications, including network equipment, and antennas for handsets and IoT devices, is set to grow robustly starting 2020. In the PCB industry...
Monday 26 August 2019
CCL makers keen on capacity expansion to brace for 5G-driven demand
With CCL (copper clad laminate) deemed as the most crucial material for high-end PCBs for 5G applications, major CCL makers in Taiwan and China are actively proceeding with capacity...
Friday 23 August 2019
Samsung EUV process reportedly facing hurdles
Speculation has started circulating in the chipmaking industry that Samsung's 7nm EUV manufacturing yield rates are still lower than expected and may interrupt production for Qualcomm's...
Friday 23 August 2019
PCB makers to gain from enlarged mainboards for 5G smartphones
As mainboards for 5G smartphones will surely be enlarged significantly to accommodate many more RF (radio frequency) modules, Taiwan-based PCB makers including Zhen Ding Technology,...
Friday 23 August 2019
8-inch fab utilization rates may not rebound until 2020
Eight-inch fab utilization rates continue to fall on weak demand for automotive and consumer ICs and are unlikely to rebound until the first half of 2020, according to industry sou...
Friday 23 August 2019
Worldwide 5G network infrastructure revenues to reach US$4.2 billion in 2020, says Gartner
In 2020, worldwide 5G wireless network infrastructure revenues will reach US$4.2 billion, an 89% increase from 2019's US$2.2 billion, according to Gartner.
Thursday 22 August 2019
IC test board maker Keystone sees orders surge on 5G applications
Taiwan-based IC testing solutions providers including Keystone Microtech have seen a drastic pickup in 5G-driven orders from chipmakers in Taiwan and China for test interfaces such...
Thursday 22 August 2019
ABF substrate demand to stay robust through 2020
ABF substrates have seen robust demand for processing 5G networking chips and high-performance computing chips since the start of 2019, but shipments of BT substrates for mobile chips...