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Global supply chain: Key components
Key components news coverage
IN THE NEWS
Wednesday 25 September 2024
Samsung foundry struggles intensify: Yield issues prompt exodus of key components
Samsung Electronics' foundry division is reportedly struggling to attract major customers due to low yield rates and persistent quality issues. These challenges are affecting the...
Wednesday 25 September 2024
Likelihood of Qualcomm acquiring Intel
On September 20, news of Qualcomm's intentions to acquire Intel sent a shock wave through Silicon Valley and Wall Street.
Wednesday 25 September 2024
UK showcases compound semiconductor prowess, Wales leads growing partnership with Taiwan
Each year, SEMICON has become a platform for industry players to showcase their advancements and evolved into a stage for nations participating in the global chip war to demonstrate...
Wednesday 25 September 2024
Foxconn-backed automotive IC design house to set up R&D center in India
Foxconn-backed SiliconAuto established a new R&D center in Bengaluru that will specialize in designing semiconductor products and developing SoC solutions for the automotive industry...
Wednesday 25 September 2024
Samsung splits from Naver on AI accelerator project, pursues independent development
Samsung Electronics and Naver previously announced a collaboration to develop artificial intelligence (AI) accelerators for servers. However, recent reports suggest that the two companies...
Wednesday 25 September 2024
IC design house Ene sees robust demand for gaming MCUs
Microcontroller unit (MCU) specialist Ene Technology has seen good inventory stocking demand for MCUs by gaming customers and expects overall performance in the fourth quarter to...
Wednesday 25 September 2024
Innolux expands FOPLP focus beyond automotive, PMIC
Innolux is expanding its fan-out panel level packaging (FOPLP) technology focus beyond automotive and power management ICs (PMIC) to include high-end applications.
Wednesday 25 September 2024
Taiwan IC design houses urged to accelerate migration to advanced nodes
Taiwan's government is urging local IC design houses to speed up their migration to advanced semiconductor manufacturing processes to avoid cut-throat pricing competition from China...
Wednesday 25 September 2024
AMD's next-gen AI GPU to intensify competition in 4Q24
AMD will launch a new generation of MI325X chips utilizing HBM3E in October to enhance its standing in the AI GPU market, aiming to secure orders from AI server clients seeking to...
Wednesday 25 September 2024
Chinese chipmakers gearing up for Huawei's next flagship launch despite hefty cost
Huawei is preparing to launch its latest flagship Mate 70 series, a product bolstered by substantial government support and suppliers, particularly SMIC, who are reportedly sacrificing...
Tuesday 24 September 2024
China's mature chip dominance looms, Taiwan IC designers urged to prioritize sub-7nm
China is poised to take the lead in the global market for mature semiconductor manufacturing processes as it continues to expand its production capacity. Industry experts warn that...
Tuesday 24 September 2024
Global semiconductor sales hit US$162.1 billion in 2Q24; Nvidia shines
Omdia has recently released a report that indicates that the total semiconductor revenue reached a record high of US$162.1 billion in the second quarter of 2024, representing a 6.7%...
Tuesday 24 September 2024
IC design houses pin hopes on short lead-time orders amid tepid PC chip demand
IC design firms report a sharp slowdown in PC shipments in the third quarter of 2024, following a surge in the second quarter. While the decline is not drastic, the usually robust...
Tuesday 24 September 2024
Huawei acknowledges chip manufacturing limitations in pursuit of advanced computing solutions
Huawei's rotating chairman, Zhijun Xu, has publicly recognized for the first time that China's limited chip manufacturing capabilities hinder the company's ability to develop advanced...
Tuesday 24 September 2024
Vietnam unveils semiconductor policy for 2050
Vietnam has unveiled its semiconductor roadmap for 2025-2050, aiming to establish three fabs, 20 integrated circuit (IC) backend houses, and 300 IC design houses as part of its goal...