Vivo has announced the establishment of a joint laboratory with Arm, marking a historic partnership that makes Vivo the first end-device brand to collaborate with Arm in this capacity...

Reports suggest that Qualcomm will wait until after the US presidential election to decide whether to make an acquisition offer for Intel. Any transaction affecting Intel's business...

At Lenovo Tech World 2024, Intel and AMD announced an unexpected alliance to protect the future of the x86 architecture. This rare partnership highlights how even long-time rivals...

Many manufacturers are optimistic about liquid cooling solutions as artificial intelligence (AI) applications push cooling needs to the limits of current air-cooling systems. However,...

The vast business opportunities in AI have attracted numerous companies eager to capitalize on these prospects.

Global CoWoS and CoWoS-like packaging capacity demand will surge 113% on year in 2025 as AI accelerators remain popular and the need for wafers is growing exponentially.

According to Chinese news outlets, Arm is allegedly attempting to bypass Arm China in its IP licensing business and sell directly to Chinese customers. Although Arm has not confirmed...

Lenovo showcased its latest AI technologies and solutions at its annual Tech World event, demonstrating its strong position in the global technology industry with the presence of...

Even though a true AI PC sales boom has yet to materialize, both supply chain firms and end-user brands are already innovating in terms of AI PC functions and designs. For Taiwanese...

Intel and AMD's surprise alliance has stirred industry discussions, given their history of rivalry.

According to industry speculation, Nvidia CEO Jensen Huang will return to Taiwan on or around January 17, 2025, if no unexpected events occur. Aside from attending Nvidia's annual...

L&T Semiconductor Technologies aims to roll out its products by 2024, targeting the automotive, industrial, and energy sectors.

Samsung Electronics reportedly will use third-party SoC chips for its forthcoming FE smartphone line.

Taiwan-based LCD panel maker AU Optronics (AUO) has dismissed speculation that it is planning to establish a foothold in semiconductor packaging by developing FOPLP.

OmniVision and other Chinese CMOS image sensor (CIS) makers have expanded their foothold in the premium smartphone-use camera segment, mounting strong challenges for market leader...