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IN THE NEWS
Thursday 30 May 2024
Skymizer enters chip IP market with ET2 LPU and LLM system platform
AI compilers service provider, Skymizer has announced a strategic pivot by launching the ET2 LPU chip hardware IP and the Skymizer LLM System platform, entering the chip IP solutions...
Thursday 30 May 2024
Himax announces strategic investment in Obsidian Sensors
Himax Technologies has made a strategic investment in Obsidian Sensors, a thermal imaging sensor maker based in San Diego, according to the Taiwan-based IC design house.
Thursday 30 May 2024
HBM competition (1): advanced packaging technology divergence explained
High Bandwidth Memory (HBM) is a graphic memory with high bandwidth. Its main function is to support High-Performance Computing (HPC) or high-speed parallel computing with CPU/GPU...
Thursday 30 May 2024
Malaysia plots US$5.3 billion roadmap to build advanced chip ecosystem
Malaysian Prime Minister Anwar Ibrahim announced the National Semiconductor Strategy (NSS), with the government allocating MYR25 billion (US$5.3 billion) to foster industry develop...
Thursday 30 May 2024
Intel CEO to meet with key suppliers and partners in Taiwan
The list of companies attending Intel's gala dinner event, which will take place during CEO Pat Gelsinger's visit to Taiwan, has been leaked.
Thursday 30 May 2024
Speculation grows about MediaTek gearing up for AI PCs
MediaTek's recent comment has fueled speculation that the Taiwanese IC design house may unveil a new Arm processor platform for AI PCs at the upcoming Computex next week.
Thursday 30 May 2024
Chinese AI chipmakers face US ban but remain optimistic
Top Chinese AI chipmakers SenseTime, iFlytek, and Biren have all been included in the US Department of Commerce's Entity List.
Wednesday 29 May 2024
Nvidia jumps to FOPLP for AI server chips amid CoWoS capacity strain
Nvidia is reportedly planning to adopt Fan-Out Panel Level Packaging (FOPLP) technology for its GB200 AI server chips ahead of schedule, aimed at addressing the tight production capacity...
Wednesday 29 May 2024
Semiconductor industry co-opetition between Taiwan and South Korea
The semiconductor industry is the lifeblood of South Korea, a country that heavily depends on its exports. In 2023, South Korea exported US$131 billion of semiconductors and imported...
Wednesday 29 May 2024
Taiwan PCB makers gear up for AI PC era, replacement demand to emerge in 2H24
With 2024 widely regarded as the inaugural year for the AI PC era, Taiwanese PCB manufacturers are revving up to meet the upcoming replacement demand for AI PCs and notebooks, expected...
Wednesday 29 May 2024
EgisTec steps up IP and IC design service deployment
IC design house Egis Technology (EgisTec) has stepped up its deployment in the IP and IC design service sector, looking to capitalize on the potential of the AIoT market.
Wednesday 29 May 2024
With AI driving demand for passive components, IC distributors prepare for surge in orders
As AI technology increasingly moves from the cloud to edge devices, the use of passive components—in particular Multilayer Ceramic Capacitors (MLCC)—will rise exponentially...
Wednesday 29 May 2024
Malaysia to attract US$107 billion of semiconductor investments
Amid the global shifts in the chip industry, Malaysia is promoting its neutrality, non-alignment, and established IC backend industry as key advantages to advance and build a more...
Wednesday 29 May 2024
TechInsights: Semiconductor production capacity in China to grow by 40% in next five years
Key Takeaway: Fabs located in China have been purchasing equipment at a rapid pace during the past three years leading to expanding capacity.
Wednesday 29 May 2024
Nan Ya PCB expects substantial demand recovery in 2H24
Nan Ya Printed Circuit Board (Nan Ya PCB), one of Taiwan's largest IC substrate suppliers, expects business will pick up in the second half of 2024, after a slow start in the first...