AMD CEO Lisa Su's Asia tour in July to secure its supply chain became the focal point for analysts during the company's 2Q23 financial earnings call. In particular, discussions on...
Taiwanese audio IC manufacturers continue to increase high-end product deployments, targeting gaming and commercial PCs, according to industry sources.
Taiwan-based power diode makers including Eris Technology, Panjit International, and Taiwan Semiconductor (TSC) are cautious about their market prospects for the second half of 2023,...
Glass substrates may see tight supply starting from the third quarter of 2023 till the second half of next year, with major Japanese vendors axing their production despite signs of...
Following the publication of the revised Foreign Exchange and Foreign Trade Act in March 2023, the Japanese government on May 23 announced to impose export restrictions on 23 items...
Chinese foundries including CanSemi Technology, GTA Semiconductor, and Nexchip Semiconductor have stepped up enhancing their mature-node manufacturing capability for automotive ICs,...
Japan-based Rohm Semiconductor saw its operating profits decline by 21.5% in April–June 2023. Its automotive sales increased by 14.9% year-over-year, the only segment that enjoyed...
The Japanese government on May 23 announced to impose export restrictions on 23 items of semiconductor manufacturing equipment, effective July 23. Although the list includes various...
Innolux expects an 8% growth rate in size for panels to be shipped in 2024, driven by large sports events such as the Paris Olympics, the European Cup, and the Copa América,...
Inventec has successfully developed its AI accelerator IP in-house and already has interest from two IC design house customers, according to industry sources. Tapeout is expected...
With mobile phone stockpiles in channels stabilizing, the likelihood of a conclusion to the SoC price war has increased, according to industry sources.
TSMC has recently initiated a new round of orders with advanced packaging equipment suppliers including Apic Yamada, Disco, Gudeng Precision Industrial and Scientech, according to...
AMD plans to incorporate TSMC's 3D SoIC (system on integrated circuits) stacking and chiplet packaging technology into its gaming notebook processors, following the company's implementation...
IC testing houses Ardentec, King Yuan Electronics (KYEC) and Sigurd Microelectronics have all seen their fab utilization rates pick up slightly in the third quarter, despite the gloomy...
