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Global supply chain: Key components
Key components news coverage
IN THE NEWS
Tuesday 25 April 2023
Automotive chip vendors to cut orders for semiconductor parts in 2Q23
Some Taiwan-based IC design houses and other chip vendors in Japan and the US may cut their orders for semiconductor parts by 10-20% in the second quarter on top of weak demand in...
Tuesday 25 April 2023
Foundries experience order cuts from automotive IC design houses
China- and Taiwan-based foundries have experienced cutbacks in automotive IC orders from not only their domestic fabless chipmakers but also customers in the US and Japan during the...
Tuesday 25 April 2023
Tougher conditions for US CHIPS Act may discourage Taiwan, Korea chipmakers from investing
The details of the US CHIPS and Science Act (also known as the CHIPS Act) subsidies, which aims to rebuild the country's local semiconductor supply chain, have been released, but...
Tuesday 25 April 2023
Samsung mobile AP shipments buck trend increasing 15% in 1Q23
Samsung Electronics saw shipments increase 15% on year in the first quarter of 2023, benefitting from good midrange mobile application processor (AP) sales performance.
Tuesday 25 April 2023
Apple ranked biggest mobile PC display purchaser throughout 2022, says Omdia
Total mobile PC (include notebook and tablet) panel shipments reached 479 million units in 2022, according to Omdia. This is the first time since 2020 that annual shipments came below...
Tuesday 25 April 2023
China-based VeriSilicon became the world's 7th largest silicon IP vendor, says IPnest
Global IC design IP sales grew 20.2% in 2022, achieving US$6.6 billion in total revenues compared to the US$5.56 billion in 2021, according to the "Design IP Report" published by...
Tuesday 25 April 2023
Black Sesame to supply SoC for Baidu's smart driving technology
China-based semiconductor company Black Sesame has become Baidu's latest chip partner to support the latter's auto-navigation and valet parking solution. The chip unicorn has been...
Tuesday 25 April 2023
Chromebook, gaming notebook demand picking up, says IC design houses
Peripheral IC demand for Chromebooks and gaming notebooks have picked up since the first quarter of this year, according to sources at IC design houses.
Tuesday 25 April 2023
TSMC lands advanced chip orders shifted from China
Taiwan Semiconductor Manufacturing Company (TSMC) has gained advanced chip orders shifted from Semiconductor Manufacturing International (SMIC) and other China-based foundries, which...
Monday 24 April 2023
Chinese automakers lower chip specs to cut production cost
Some Chinese automakers reportedly are using the terms "vehicle grade" and "vehicle use" to adjust their automotive chip procurements to press down chip prices amid the current cutthroat...
Monday 24 April 2023
IC design houses say visibility for 2H23 still unclear
Order visibility for the traditional peak season in the second half of this year is still unclear going into the second quarter, according to a number of IC design houses.
Monday 24 April 2023
Chinese automaker reportedly lowers chip requirements
Cut-throat competition in China's car market reportedly is prompting a major Chinese automaker to lower the requirements for car-use chips in a bid to reduce production costs, according...
Monday 24 April 2023
Automotive market disrupted by three major environmental factors; low-end chips pressured but high-end CIS holds strong
Although automotive chips are relatively stable in the semiconductor supply chain, the uncertainty of the overall economic environment has already impacted the purchasing power of...
Monday 24 April 2023
Wi-Fi chip prices under downward pressure in the short term
Demand for Ethernet chips and Wi-Fi chips are picking up on rush replenishment orders for PC and other consumer applications, but whether the recovery momentum can last into the second...
Monday 24 April 2023
Different chip segments vary in inventory depletion speed
Inventory depletion paces vary with different supply chains, with panel, notebook, motherboards and graphic card sectors taking the lead to bottom out while memory and handset IC...