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Global supply chain: Key components
Key components news coverage
IN THE NEWS
Tuesday 20 September 2022
Smartphones supporting Wi-Fi 7 may arrive as early as 2H24
The first smartphones supporting much faster Wi-Fi 7 connections may debut as early as the second half of 2024, according to sources at IC backend houses and inspection labs.
Tuesday 20 September 2022
Taiwan analog IC firms step up transition to 12-inch wafer manufacturing
Taiwan-based analog IC design houses have stepped up their transition to 12-inch wafer manufacturing, and are actively developing 12-inch chip designs, according to industry source...
Monday 19 September 2022
MediaTek to mass produce HPC chips with CoWoS tech in 2023
MediaTek is set to mass produce its new HPC chips at TSMC in 2023 using advanced process node and CoWoS (chip on wafer on substrate) packaging technology, according to backend supply...
Monday 19 September 2022
LCD monitor panel shipments down in August, says Discien
Global LCD monitor panel shipments reached 10.8 million units in August, decreasing 8% sequentially and 28% on year, according to Discien Consulting.
Monday 19 September 2022
Taiwan IC design houses keen to develop new chips, defying headwinds
Taiwan's IC design houses including MediaTek, Novatek Microelectronics and Realtek Semiconductor have sharply increased their new development projects for the next 1-2 years despite...
Monday 19 September 2022
Suppliers set to enter production race for 3D NAND with 200+ layers
Global NAND flash makers are on track to start a new round of competition in producing 3D NAND chips with over 200 layers after Micron Technology announced commercial production of...
Monday 19 September 2022
China gearing up to mass purchase IC equipment and materials
Chinese semiconductor firms are moving at full throttle to purchase as many semiconductor equipment and materials as possible from abroad as the US is expected to take tougher measures...
Monday 19 September 2022
Semiconductor manufacturing not affected by strong earthquake in Taiwan
A Richter 6.8 magnitude scale earthquake and aftershocks hit Taiwan on September 18, but as the epicenter was located off the southeastern coast of the island, semiconductor manufacturing...
Friday 16 September 2022
PCB maker Eiso steps into production of own-brand e-bikes
Niche-market PCB maker Eiso Enterprise is tapping overseas markets mainly in Europe for its own-brand Dosun electric bicycles (e-bikes), which it started developing and producting...
Friday 16 September 2022
TSMC urges companies to build automotive IC buffer stock now
Cars will require more chips as they become electrified and intelligent. A TSMC executive on Thursday said companies should build their inventory for automotive ICs now as the chip...
Friday 16 September 2022
CMOS image sensor sales to suffer first drop in 13 years
CMOS image sensor sales are expected to suffer their first sales decline in 13 years because of a smartphone slump, low camera growth in handsets, and weak global economy, according...
Friday 16 September 2022
APCB expects revenue growth in 2H22
Advanced Printed Circuit Board (APCB), which specializes in niche-market PCBs, expects sales growth to resume in the second half of 2022 thanks to its fulfillment of short lead-time...
Friday 16 September 2022
RISC-V Taipei event shows stunning growth potential, with automotive as next market to conquer
At the RISC-V Taipei 2022 event held on September 19, industry leaders are pronouncing strong confidence in the exponential growth of RISC-V's share in the automotive space within...
Friday 16 September 2022
Touch panel maker GIS diversifying target markets
Touch solution provider General Interface Solution (GIS) has made efforts to diversify its target markets to include interactive display systems, automotive, and the metaverse.
Friday 16 September 2022
Equipment demand for advanced packaging stays robust
Equipment demand for mid- to high-end flip-chip (FC) and other advanced packaging remains robust, while demand for conventional wirebonding packaging is slowing down, according to...