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IN THE NEWS
Thursday 5 March 2020
China smartphone AP shipments, 4Q 2019
Smartphone AP shipments to China-based vendors came to 197 million units, down 5.9% on year and 7.7% on quarter.
Thursday 5 March 2020
Global monitor panel shipments set to grow in 2020
Global shipments of monitor panels are expected to reach 166 million units in 2020, increasing 15.2% from a year earlier, according to market research firm All View Cloud (AVC).
Thursday 5 March 2020
Apple PCB suppliers see orders deferred
Taiwan-based flexible PCB makers in the supply chain of Apple devices will see their shipments for the upcoming entry-level iPhone SE2 deferred from the first quarter to the second,...
Thursday 5 March 2020
Huawei enhancing in-house IC design capability
Huawei has been strengthening its in-house chip design capability aiming to further reduce its dependence on US technology, according to industry sources.
Thursday 5 March 2020
Server BMC chipmaker Aspeed expects 15% revenue rise in 2020
Taiwan-based server management SoC solution provider Aspeed Technology expects its second-quarter revenues to see a double-digit sequential increase thanks to robust orders from cloud...
Thursday 5 March 2020
New entry-level LCD iPhone reportedly enters final verification stage
Apple's new entry-level LCD iPhone, tentatively dubbed iPhone SE2, has entered the final stage of engineering validation in Zhengzhou, China, where the vendor's major manufacturing...
Thursday 5 March 2020
SEMICON SEA 2020 postponed
SEMI has announced that it is postponing SEMICON Southeast Asia 2020 from May 12-14 to August 11-13 out of concern over the coronavirus outbreak.
Wednesday 4 March 2020
BOE making headway in flexible AMOLED
BOE Technology is expected to continue to enhance its presence in the flexible AMOLED panel sector as handset brands including Samsung Electronics and Huawei remain committed to rolling...
Wednesday 4 March 2020
Taiwan MCU firms ramping up wafer starts at foundries
Taiwan-based MCU specialists have enjoyed an influx of short lead-time orders for healthcare applications, mainly ear thermometers, since February, and are ramping up wafer starts...
Wednesday 4 March 2020
HannStar Board looks to networking, servers for 2020 growth
HannStar Board will put increased focus on its deployments in the networking device and server segments in 2020 as part of its efforts to further improve its product mix and boost...
Wednesday 4 March 2020
Lam Research introduces Sense.i etch platform
Lam Research has announced the launch of Sense.i with core technology evolved from Lam's Kiyo and Flex process module. The Sense.i platform enables the etch capabilities required...
Tuesday 3 March 2020
Highlights of the day: Coronavirus may affect IT supply outside of China
With the coronavirus starting to widely spread in many countries outside of China, the semiconductor industry has...
Tuesday 3 March 2020
TSMC, Broadcom enhance CoWoS platform with 2X reticle size interposer
TSMC announced on March 3 the foundry has collaborated with Broadcom on enhancing the chip-on-wafer-on-substrate (CoWoS) platform to support the industry's first and largest 2X reticle...
Tuesday 3 March 2020
RichWave expects revenue growth in 2020
RF component specialist RichWave Technology expects to post an impressive revenue increase this year, driven by growing demand for 5G phones, AIoT and wireless, and sensor related...
Tuesday 3 March 2020
Taiwan IC designers eyeing shipments upturn in March
With labor return rates recovering in China, Taiwan-based IC design houses are expected to see shipments start picking up in March as the impact pressure of the coronavirus outbreak...