Compound semiconductor firms are conservative about order visibility for the first quarter of 2019 due partly to Apple cutting orders amid weaker-than-expected sales of new iPhones,...

Samsung Display reportedly plans to convert one of its 8.5G LCD fabs, the L8-1, into a production base for the development of QD-OLED (quantum dot-OLED) panels with the transition...

Taiwan-based Global Mixed-mode Technology (GMT), a supplier of analog and power management (PWM) ICs, has announced plans to launch a tender offer for fellow company Advanced Analog...

Apex International, a provider of PCBs mainly for TVs and other home appliances, saw its cumulative 2018 revenues through November exceed the NT$10 billion (US$326 million) mark.

Taiwan Semiconductor Manufacturing Company (TSMC) is unlikely to see its 7nm process capacity fully utilized in the first half of 2019, due to a cutback in orders placed by Apple,...

Infineon Technologies has recently released its CoolGaN devices, which have attracted orders from Eltek, a Delta Electronics Group company, for datacenter and server applications,...

China-based touch panel maker Shenzhen O-film Tech is facing increasing pressure of rising inventories and dwindling orders due to a weak rebound of the handset market in China, according...

Qualcomm has unveiled its Snapdragon 855 mobile platform to enable commercial 5G networks and mobile devices in early 2019.

Trade tensions between the US and China may not seem to have a direct impact on the semiconductor industry, but subsequent developments of the row - if the two giants fail to make...

The trade war between the world's two economic giants has lasted over a year since the US Trade Representative Office initiated in August 2017 a Section 301 investigation into imports...

Worldwide sales of semiconductors reached US$41.8 billion for the month of October 2018, up 12.7% compared to year-ago levels and 1% sequentially, according to the Semiconductor Industry...

Smartphone vendors intend to promote their all-screen models in 2019 to boost their unit sales amid stagnant global demand for smartphones. With all-screen smartphones adopting TDDI...

Dai Nippon Printing (DNP) has announced it is teaming up with Winbond Electronics to develop eSIM and other secure elements for IoT devices.

Corning and SCH Electronics (Shanghai) have jointly announced they have signed a sales agency agreement focused on semiconductor glass carriers in China.

Samsung is expected to have the largest capex budget of any IC supplier again in 2018, according to IC Insights. After spending US$24.2 billion for semiconductor capex in 2017, Samsung...