While today's mobile devices use either UFS (Universal Flash Storage) or eMMC (embedded multi-media card)-based NAND flash solutions to store information, eMMC5.1 chips are becoming...

Taiwan Semiconductor Manufacturing Company's (TSMC) integrated fan-out (InFO) wafer-level packaging technology is about to enter its second generation, which will bring more competitiveness...

Though still a global bellwether in many areas of semiconductor technologies, Japan's semiconductor industry is significantly losing ground in world markets, as most Japanese players,...

Meizu is scheduled to introduce its new Pro 7 and Pro 7 Plus smartphone series on July 26. The Pro 7 model is expected to feature MediaTek's 16nm Helio P25 SoC chip while the Pro...

Speculation has circulated in the industry that Taiwan-based Chipbond Technology plans to sell part of its stake in its China-based subsidiary Chipmore Technology to BOE Technology...

Backend houses Chipbond Technology and ChipMOS Technologies have both cut into the supply chains of US and Korea smartphone brands with their gold bumping services, and are set to...

Panel makers have been aggressively making investments in 10.5G or 11G LCD production lines anticipating that demand for 65-inch and above applications and 8K displays will surge...

A number of China- and Taiwan-based IC design houses are ramping up their production of speaker solutions, MEMS microphones and other chips to meet increasing demand for voice assistant...

Globalfoundries' fully-depleted silicon-on-insulator FD-SOI process technology targeted at Internet of Things (IoT), artificial intelligence (AI) and Big Data applications has started...

Taiwan Semiconductor Manufacturing Company (TSMC) is expanding the number of suppliers of equipment for its 7nm process in a bid to maintain an ecosystem pricing balance, according...

Installed 8-inch (200mm) fab capacity has increased since 2009, and will reach close to 5.4 million wafers per month (wpm) by the end of 2017, according to SEMI. By 2020, 200mm capacity...

Taiwan should strive to become an exporter of AI (artificial intelligence) system products and to develop niche-type integrated smart system chips that could reach a production value...

Macronix International has launched an AEC-Q100 Grade 2/3 compliant NAND flash memory product. The company added its NAND flash memory has passed all the stringent AEC-Q100 reliability...

Globalfoundries and VeriSilicon have announced a collaboration to deliver a single-chip IoT solution for next-generation Low Power Wide Area (LPWA) networks. Leveraging GF's 22FDX...

Insyde Software, a provider of UEFI BIOS and systems management software, has announced that its BIOS and BMC firmware solutions offer full support for the latest Intel Xeon Skylake-SP...