MediaTek is expected to complete development of its 5G prototype chip by the end of 2017, and is gearing up for trials of its 5G solutions in 2018, according to industry sources.

China-based SJ Semiconductor has started the qualification of 10nm ultra-high density wafer bumping for Qualcomm, according to the companies. This represents SJSemi's further improvement...

After scoring impressive achievements at the end of its first implementation year in early September 2017, the Taiwan government's Asia Silicon Valley Development Plan (ASVDP) is...

CEVA, a licensor of signal processing IP for smart connected devices, has announced that Nextchip, a fabless company specializing in embedded vision applications for ADAS systems,...

A number of new features that come along with Apple's newly released iPhone X such as 3D sensing are likely to become new standards for next-generation smartphones launched by Android-based...

Fab toolmaker Marketech International has seen its backlog of orders reach a record NT$13.6 billion (US$452 million), according to a recent Chinese-language Economic Daily News...

M31 Technology will start trading on the Emerging Stock Board of the Taiwan Stock Exchange (TSE) on September 20, according to the Taiwan-based silicon IP provider.

Specialty materials provider Entegris has announced an expansion for its R&D center in Hsinchu, Taiwan. The expansion adds a new microcontamination control lab that focuses on...

Advanced Semiconductor Engineering (ASE) has cut into the supply chain for Amazon's datacenter construction set to begin between 2017 and 2018, by providing 2.5D IC packaging services...

IC testing solution provider Chunghwa Precision Test Technology (CHPT) expects to start mass shipments of solutions for the manufacture of 7nm chips in the second half of 2018. Shipments...

With the semiconductor-manufacturing industry needing the high computing power that can only be achieved through advanced node logic and memory, as well as the heterogeneous-integration...

Gudeng Precision Industrial has obtained front opening unified pod (FOUP) orders from a number of 12-inch foundries including United Semiconductor (Xiamen), Huali Microelectronics...

MediaTek is unlikely to roll out mobile chips built using more advanced 10nm and 7nm process technologies in 2018, as it has moved to focus on the mid-range smartphone market segment,...

Just one year after acquiring US-based flexible PCB maker Multi-Fineline Electronix (MFLX), China-based Suzhou Dongshan Precision Manufacturing is proceeding with a CNY3 billion (US$459.7...

Semiconductor Manufacturing International (SMIC) and QuickLogic have announced the availability of QuickLogic's ArcticPro embedded FPGA (eFPGA) technology on SMIC's 40nm low leakage...