Taiwan Semiconductor Manufacturing Company (TSMC) is planning to carry out the first-ever expansion of its CoWoS (Chip on Wafer on Substrate) packaging and testing capacity to fill...

Chip suppliers engaged in Apple's supply chain started to see orders pick up in June. On the other hand, chip demand from the non-Apple camp has been slow, according to sources at...

The prices of large-size and small- to medium-size panels are likely to be polarized in the second half of 2017 during which quotes for large-size panels are expected to trend downward...

With China's local governments looking to set up data centers, chip demand for data centers locally is set to surge, according to industry sources.

Samsung Electronics, Dongbu HiTek and SK Hynix have stepped up their foundry business expansions, which will as a group pose a threat to the existing major dedicated foundry houses...

STMicroelectronics has dismissed recent reports indicating the company will suspend taking orders for microcontrollers (MCU) until 2018 due to strong demand. "ST continues to manage...

Four Taiwan-based hardware production partners of Apple, namely Foxconn Electronics, Compal Electronics, Wistron and Pegatron, have jointly filed a countersuit against Qualcomm in...

The second largest China-based solar-grade monocrystalline silicon wafer maker Zhonghuan Semiconductor has decreased quotes for a wafer with 190-micron) thickness to CNY5.90 (US$0.87)...

Qualcomm has announced revenues for its fiscal third quarter ended June 25, 2017 decreased 11% on year to US$5.4 billion, while net profits fell 40% from a year ago to US$900 million...

Powerchip Technology and Zentel Electronics will file an appeal against a Taiwan IP court patent dispute ruling in favor of Toshiba, according to the Taiwan-based companies.

STMicroelectronics has extended delivery lead times for 32-bit MCUs due to strong demand, according to industry sources. The MCU vendor has also informed its customers that it plans...

While today's mobile devices use either UFS (Universal Flash Storage) or eMMC (embedded multi-media card)-based NAND flash solutions to store information, eMMC5.1 chips are becoming...

Taiwan Semiconductor Manufacturing Company's (TSMC) integrated fan-out (InFO) wafer-level packaging technology is about to enter its second generation, which will bring more competitiveness...

Though still a global bellwether in many areas of semiconductor technologies, Japan's semiconductor industry is significantly losing ground in world markets, as most Japanese players,...

Meizu is scheduled to introduce its new Pro 7 and Pro 7 Plus smartphone series on July 26. The Pro 7 model is expected to feature MediaTek's 16nm Helio P25 SoC chip while the Pro...