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IN THE NEWS
Friday 30 June 2017
Digitimes Research: Taiwan IC design industry output value to rise 3% in 2017
The production value of Taiwan's IC design industry will grow only 3.3% on year to NT$637.3 billion (US$20.9 billion) in 2017, as a result of weaker growth coming from MediaTek, according...
Thursday 29 June 2017
MediaTek unveils NB-IoT SoC, partnership with China Mobile
MediaTek has unveiled its first narrow band Internet of Things (NB-IoT) system-on-chip (SoC), the MT2625, and announced a collaboration with China Mobile to build what the companies...
Thursday 29 June 2017
Powerchip eyeing orders from Illumina
Powerchip Technology is looking to become the second foundry partner of Illumina following Taiwan Semiconductor Manufacturing Company (TSMC), according to industry sources.
Thursday 29 June 2017
FocalTech seeing orders ramp up
Touchscreen and LCD driver solution provider FocalTech Systems has seen its customers step up their pace of orders, according to market sources.
Thursday 29 June 2017
UltraChip, INT Tech form joint venture to develop AMOLED driver ICs
Taiwan's knowledge-based startup INT Tech and LCD driver IC maker UltraChip have set up a joint venture, Ultra Display, which will focus on development of driver ICs for AMOLED pan...
Thursday 29 June 2017
Qualcomm expanding mobile chip offering for mid-range smartphones
Qualcomm has introduced its Snapdragon 450-series mobile chips, a new entry to the Snapdragon 400 mobile platform tier designed for mid-range smartphones and tablets. The Snapdragon...
Wednesday 28 June 2017
CMOS image sensor sales to reach another record high in 2017, says IC Insights
CMOS image sensor sales are on pace to reach a seventh straight record high in 2017, and nothing ahead should stop this semiconductor product category from breaking more annual records...
Wednesday 28 June 2017
Imec looking to deepen partnerships with China-based chipmakers
China has the possibility to become a world-class semiconductor industry if local players make good use of resources domestically and internationally, according to Huiwen Ding, head...
Wednesday 28 June 2017
Qualcomm announces advanced fingerprint scanning and authentication technology
Qualcomm has announced its next-generation ultrasonic fingerprint solutions which bring new and enhanced features to the previous generation Qualcomm Snapdragon Sense ID fingerprint...
Wednesday 28 June 2017
Powerchip opens JV fab in China
Powerchip Technology has completed the construction of its 12-inch fab in Hefei, China and started to run the fab, according to the Taiwan-based foundry chipmaker. The fab...
Wednesday 28 June 2017
Strong RF chip demand to buoy supplier 2017 revenues
Strong radio-frequency (RF) component demand will buoy sales at suppliers including Richwave Technology, Rafael Microelectronics and AMIC Communication (AMICCOM) in 2017, which are...
Wednesday 28 June 2017
ASE expects to outgrow global logic IC industry in 2017, says COO
Advanced Semiconductor Engineering (ASE), the world’s largest outsourced semiconductor assembly and test (OSAT) company, will see its 2017 sales growth outperform the global...
Wednesday 28 June 2017
China smartphone vendors ramping orders at IC firms
China-based smartphone vendors including Oppo and Vivo have stepped up their pace of chip orders, while Huawei, Xiaomi Technology and Gionee are expected to increase their chip orders...
Wednesday 28 June 2017
Panel and component suppliers gearing up for robust demand for 18:9 displays
LCD panel makers and panel-related component suppliers are gearing up for robust demand for 18:9 LCD panels from the smartphone sector in the second half of 2017, according to industry...
Tuesday 27 June 2017
Tongfu Microelectronics to set up advanced IC backend plant in Xiamen, says report
China-based Tongfu Microelectronics has struck a deal with the Xiamen Haicang District government to set up a manufacturing base for advanced packaging and testing services locally...