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Global supply chain: Key components
Key components news coverage
IN THE NEWS
Tuesday 1 November 2016
Silicon Motion enjoys strong shipments for SSD, eMMC solutions
NAND flash device controller supplier Silicon Motion Technology saw revenues generated from its embedded storage products increase over 15% sequentially to account for about 80% of...
Friday 28 October 2016
Taiwan ITRI, Seria develop new technology for PCB production
Taiwan's ITRI has teamed up with Japan-based Seria Engineering to develop a new process technology for the manufacture of PCBs, which has been showcased at the TPCA (Taiwan Printed...
Friday 28 October 2016
ASE nets NT$0.72 per share for 3Q16
Advanced Semiconductor Engineering (ASE) has reported net profits of NT$5.51 billion (US$173.9 million) for the third quarter of 2016, up 27% sequentially but down 14% on year. EPS...
Thursday 27 October 2016
Qualcomm to acquire NXP for US$47 billion
Qualcomm and NXP Semiconductors have announced a definitive agreement, unanimously approved by the boards of both companies, under which Qualcomm will acquire NXP. Pursuant to the...
Thursday 27 October 2016
CIS module maker Asia Tech Image reports strong earnings for 3Q16
CIS module maker Asia Tech Image has reported net profits of NT$113 million (US$3.579 million) for the third quarter of 2016, increasing 51% from a quarter earlier. EPS for the quarter...
Thursday 27 October 2016
UMC 14nm FinFET ready for production in 2Q17
United Microelectronics (UMC) is expected to move its 14nm FinFET process to volume production in the second quarter of 2017, with Bitcoin mining company BitFury being the first customer,...
Wednesday 26 October 2016
Phison reports strong pre-tax earnings for 3Q16
Phison Electronics, which supplies controller solutions for memory devices, has reported pre-tax profits of NT$1.544 billion (US$48.9 million) for the third quarter of 2016, up 26.88%...
Wednesday 26 October 2016
Alchip to set up subsidiary in Hefei
Alchip Technologies, a Taiwan-based provider of ASIC/SoC design services, has signed an MoU with the Hefei city government of China's Anhui province to set up a subsidiary locally.
Wednesday 26 October 2016
ASE ready to enter volume production of fan-out wafer-level packaging
Advanced Semiconductor Engineering (ASE) has reportedly obtained orders for fan-out wafer-level packaging (FOWLP) from Qualcomm, MediaTek and HiSilicon with volume production set...
Wednesday 26 October 2016
Cadence IP tools certified on Samsung 10nm process technology
Cadence Design Systems has announced that its complete suite of digital and signoff tools has been certified for Samsung Electronics' Process Design Kit (PDK) and Foundation Library...
Tuesday 25 October 2016
AMD reports 3Q16 results
​AMD has announced revenues for the third quarter of 2016 of US$1,307 million, operating losses of US$293 million, and a net loss of US$406 million, or US$0.50 per share. Non-GAAP1...
Monday 24 October 2016
Fujitsu adopts Cadence Palladium Z1 enterprise emulation platform
Cadence Design Systems, has announced that Fujitsu has adopted the Cadence Palladium Z1 enterprise emulation platform for the development of the ARMv8-based Post-K computer. The Post-K...
Monday 24 October 2016
GMT to see VCM driver IC shipments expand significantly in 2017
Analog IC vendor Global Mixed-mode Technology (GMT) is expected to see its shipments of VCM (voice coil motor) driver ICs expand significantly in 2017 thanks to increasing adoption...
Monday 24 October 2016
Avnet completes acquisition of Premier Farnell
Avnet has announced that it has completed its acquisition of Premier Farnell in an all cash merger for GBP1.85 (US$2.26) per share, which equates to an equity value of approximately...
Monday 24 October 2016
North American semiconductor equipment industry posts September book-to-bill ratio of 1.05
North America-based semiconductor equipment manufacturers posted US$1.60 billion in orders worldwide in September 2016 (three-month average basis) and a book-to-bill ratio of 1.05,...