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Global supply chain: Key components
Key components news coverage
IN THE NEWS
Tuesday 22 November 2016
China firms headhunting talent from Taiwan fabless and DRAM companies
China's emerging memory companies have been aggressively headhunting talent from Taiwan-based fabless and DRAM firms, according to industry sources.
Tuesday 22 November 2016
PCB makers hike prices due to increased CCL cost
Taiwan-based PCB makers, in response to price hikes by CCL (copper-clad laminate) suppliers, have raised quotes to reflect increased costs, according to industry sources.
Tuesday 22 November 2016
GigaDevice to merge with ISSI, say sources
Trading in GigaDevice Semiconductor has been suspended on the Shanghai Stock Exchange (SSE), paving the way for the NOR flash specialist to obtain shares of Integrated Silicon Solution...
Tuesday 22 November 2016
Market for 10nm mobile chips to heat up in 2017
Qualcomm, Samsung Electronics, MediaTek, Apple and Spreadtrum Communications are gearing up to roll out their 10nm mobile chips which will be shipped in smartphones during 2017.
Monday 21 November 2016
MediaTek intros technology enabling 4K video streaming
MediaTek has announced the launch of its UltraCast technology, a chipset-enabled streaming technology enabling users to enjoy 4K video content generated by their smartphones and stream...
Monday 21 November 2016
Phison Jan-Oct pre-tax profits approach almost 2015 level
Phison Electronics' pre-tax profits totaled NT$4.42 billion (US$138.6 million) in the first 10 months of 2016, approaching nearly the NT$4.47 billion reported for all of 2015, according...
Monday 21 November 2016
Macroblock revenues and profits rise in 1Q-3Q16
LED driver IC supplier Macroblock has reported revenues for the first three quarters of 2016 increased 24.7% from a year earlier to NT$1.88 billion (US$58.7 million), while net profits...
Friday 18 November 2016
Qualcomm, Samsung collaborate on 10nm for Snapdragon 835 mobile chips
Qualcomm and Samsung Electronics have extended their tie to manufacture Qualcomm's Snapdragon 835 mobile chips with Samsung's 10nm FinFET process technology, according to the compa...
Friday 18 November 2016
ASE-SPIL merger still under review in China and US
A proposed merger between Advanced Semiconductor Engineering (ASE) and Siliconware Precision Industries (SPIL) is still being reviewed by anti-trust authorities in China and the US...
Friday 18 November 2016
China investment funds wooing Taiwan IC vendors
More semiconductor investment funds backed by local governments in China have stepped up their contact with Taiwan-based IC vendors, aiming to lure them to establish IC-design companies...
Friday 18 November 2016
Egistec October revenues surge
Taiwan-based fingerprint sensor supplier Egis Technology (Egistec) has reported October revenues surged 84.7% on month to NT$301 million (US$9.4 million).
Thursday 17 November 2016
SMIC 28nm chip shipments to double in 4Q16
Semiconductor Manufacturing International (SMIC) is expected to hike shipments of its 28nm process technology to 20 million chips in the fourth quarter of 2016 from 10 million units...
Thursday 17 November 2016
Taiwan FTC OKs ASE-SPIL merger
Taiwan's Fair Trade Commission (FTC) has approved the proposed merger between Advanced Semiconductor Engineering (ASE) and Siliconware Precision Industries (SPIL).
Thursday 17 November 2016
eMemory NeoFuse IP verified in TSMC 10nm FinFET process
Taiwan-based eMemory, a logic NVM IP provider, has announced the successful demonstration of its security-enhanced NeoFuse IP in TSMC's 10nm FinFET process, along with IP design kits...
Wednesday 16 November 2016
Taiwan IC production value to fall 4.8% in 4Q16, says IEK
Taiwan's IC production value is forecast to decline 4.8% sequentially to NT$627.7 billion (US$19.8 billion) in the fourth quarter of 2016, according to the Industrial Economics and...