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Global supply chain: Mobile, telecom, computing
Mobile, telecom, computing trends
IN THE NEWS
Tuesday 13 August 2019
Memory firms expect explosive growth from 5G starting 2020
Despite lackluster memory demand likely to persist till the end of 2019, the memory industry is expected to see a brighter prospect starting 2020 when 5G services kick off commercial...
Monday 12 August 2019
Highlights of the day: Huawei resumes 5G notebook development
There have been signs that the impact of the US trade ban on Huawei may be waning, as the Chinese vendor has recently set an even more ambitious goal for its handset shipments for...
Monday 12 August 2019
TSMC gearing up for another semiconductor supercycle
The global semiconductor market is set to enter a dynamic new phase of growth, as the era of 5G network looms around the corner. TSMC, the world's largest pure-play foundry, is also...
Monday 12 August 2019
Huawei resumes notebook orders, development of 5G models, say sources
Huawei has resumed pulling in new orders for notebooks and also restarted the development of 5G-enabled notebook models, according to sources from the vendor's Taiwan-based supply...
Friday 9 August 2019
Highlights of the day: AMD to see rising share of server market
AMD is expected to grab a larger share of the server market thanks to its newly launched EPYC server processor platform...
Friday 9 August 2019
Asia Pacific spending on public cloud services to reach US$76.1 billion by 2023, says IDC
Asia Pacific spending on public cloud services and infrastructure is forecast to value at US$26.0 billion in 2019, an increase of 47.1% over 2018, according to IDC. The public cloud...
Friday 9 August 2019
AMD launches second-generation EPYC platform
AMD, joined by an expansive ecosystem of datacenter partners and customers at a launch event, has introduced the second-generation AMD EPYC family of processors for enterprise, cloud...
Friday 9 August 2019
AMD to enjoy rising share in server market with new generation EPYC platform
AMD has launched its second-generation EPYC server processors manufactured using Taiwan Semiconductor Manufacturing Company's (TSMC) 7nm process technology, and the new platform is...
Friday 9 August 2019
Advantech unveils new 5-year development plans to spur growth
Taiwan-based IPC maker Advantech has launched a new 5-year development project, aiming to strengthen its growth momentum by deepening service localization and personnel training in...
Friday 9 August 2019
Global smartwatch shipments grow 44% in 2Q19, says Strategy Analytics
Global smartwatch shipments grew 44% on year in the second quarter of 2019, according to Strategy Analytics. Apple Watch maintained its strong leadership, as Samsung returned to second...
Thursday 8 August 2019
Note revenues to account for over 20% of Samsung handset sales, say sources
The availability of the Note 10 lineup is likely push up Note revenues to 20-23% of Samsung's total handset revenues compared to 15-19% currently, according to an industry estimate...
Thursday 8 August 2019
Highlights of the day: Supply chain upbeat after Galaxy Note 10 launch
Samsung has just launched its Galaxy Note 10, with its suppy chain partners expecting the new smartphone series to prompt rivals to adopt similar specs for their offerings, including...
Thursday 8 August 2019
Global tablet market – 2Q 2019
Global tablet shipments amounted to 32.66 million units in second-quarter 2019, down 8.7% on quarter and 11.9% on year due to slow season, Apple's new products making little contribution...
Thursday 8 August 2019
Vapor chamber demand to grow exponentially for 5G smartphones, says Auras chair
Demand for vapor chambers (VCs) from smartphone vendors will grow exponentially in the next few years to support high heat-sinking performance required for 5G smartphones, according...
Thursday 8 August 2019
Samsung pioneers adoption of 0.35mm vapor chamber in new Galaxy series
Samsung Electronics has taken the lead to adopt 0.35mm vapor chambers (VC) in its newly released Galaxy Note 10 series, which may become mainstream smartphone heat-sinking spec in...