AI computing is pushing the semiconductor industry into a structural growth phase, reshaping global capacity and technology pathways, according to Lily Feng, President of SEMI China,...
At SEMICON China 2026, AMD VP and Head of Corporate Strategy and Partnerships Mario Morales delivered a stark warning: while the AI market is rapidly expanding toward a projected US$1.7...
At the SEMICON China 2026 opening keynote, Siemens EDA IC Products Executive Vice President (EVP) Ankur Gupta delivered a clear message: traditional EDA software is no longer sufficient,...
SEMICON China 2026 opened on March 25 in Shanghai, as the global semiconductor industry enters a new expansion cycle fueled by the rapid rise of artificial intelligence.
As advanced packaging pushes toward 3D integration and high-bandwidth computing, hybrid bonding has emerged as a critical battleground for semiconductor equipment makers.
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