Semicon Taiwan 2026

Semicon Taiwan 2026 took place on September 2-4, 2026, at TaiNEX 1&2, Taipei, with the event tagline of "Transform Tomorrow".

Semicon Taiwan 2026 took place on September 2-4, 2026, at TaiNEX 1&2, Taipei, with the event tagline of "Transform Tomorrow". Pre-event forums began in August 31.

Over 100,000 industry professionals from 65 countries participated in this year's event.

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IN THE NEWS

Saturday 5 September 2026

Semicon Taiwan 2026: A windmill in the die bonder, and a Dutch bet on photonics

Dutch equipment maker ITEC used Semicon Taiwan to promote a die-bonding architecture that it says triples throughput over earlier versions of the design by removing the largest source...

Saturday 5 September 2026

Taiwan semiconductor output targets NT$8 trillion

As Semicon Taiwan kicked off at the Taipei Nangang Exhibition Center, the Ministry of Economic Affairs (MOEA) announced that, based on forecasts compiled from multiple research institutions,...

Saturday 5 September 2026

Topco targets optical comms, cooling as copper gives way

System integration remains a key hurdle as the AI chip industry pushes for higher power efficiency and faster transmission speeds, drawing intense attention to when short-reach optical...

Saturday 5 September 2026

TSMC's 3D packaging roadmap: engineering AI chips to think like the human brain

TSMC is steering the future of artificial intelligence toward high-density three-dimensional advanced packaging designed to mimic the architectural connectivity of the human brain,...

Saturday 5 September 2026

SiPh, optical lens demand ignite laser race

Silicon photonics (SiPh) is emerging as a core theme at SEMICON Taiwan 2026, and while the sector is still in an early, fast-growing stage, production-line investments are already...

Saturday 5 September 2026

Google TPU splits training, inference as CPU becomes next focus

As AI model training, inference, and AI agent workloads continue to grow, AI accelerators are increasingly being optimized for different tasks. Amin Vahdat, Google's senior vice president...

Saturday 5 September 2026

Jmem Tek's PQC security chip nears mass production

Taiwanese IC design startup Jmem Tek showcased its in-house physical unclonable function (PUF) and post-quantum cryptography (PQC) hardware security technologies at SEMICON Taiwan...

Friday 4 September 2026

Cisco targets zero engineers writing code by end-October

AI is forcing companies to rethink not only how software is built but how quickly ageing systems must be replaced, with Cisco warning that increasingly capable frontier models are...

Friday 4 September 2026

CPO testing shifts to mid-stage to avoid costly failures, Chroma says

Co-packaged optics (CPO) is forcing chipmakers and equipment suppliers to rethink where testing should take place, as long optical test...

Friday 4 September 2026

TSMC urges HBM makers to design for X-ray inspection as packaging grows more complex

TSMC is calling for future HBM and DRAM designs to become more compatible with X-ray inspection, as increasingly complex advanced packaging makes buried defects harder to detect while...

Friday 4 September 2026

From chips to physical AI: Experts urge Taiwan-US push for trusted drone supply chains at Semicon Taiwan 2026

Trustworthy supply chain concerns are extending beyond semiconductors to drones and other autonomous systems, now emerging as national strategic industries. At a Semicon Taiwan 2026...

Friday 4 September 2026

The 'Copper Wall': inside the physical bottlenecks threatening to melt AI supercomputing boom

A decade ago, when Nvidia CEO Jensen Huang was developing the world's first NVLink-enabled deep learning system, the DGX-1, the tech industry was deeply skeptical about the future...

Friday 4 September 2026

How agentic AI and 'AI physics' are reshaping chip design

As semiconductor designs advance toward trillion-transistor packages, the traditional engineering playbook of simply adding more personnel or running legacy software faster has hit...

Friday 4 September 2026

Trusval Technology eyes NT$23 billion order backlog, US 4Q26 ramp

Trusval Technology is riding AI- and high-performance computing-driven semiconductor expansion overseas, but Taiwan's fab engineering firms face tougher labor shortages, regulations,...

Friday 4 September 2026

SEMICON Taiwan 2026: QuantumDiamonds cracks the hybrid bonding blind spot with new inline metrology

The global semiconductor industry is hitting a physical wall. As artificial intelligence demands push architectures toward three-dimensional packaging, high-bandwidth memory (HBM)...

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