Glass core substrates, valued for their low dielectric loss and warpage reduction, are key to next-generation advanced semiconductor packaging. In South Korea, traditional glass makers KCC Glass and LX Glass have entered R&D efforts to capture market opportunities.
Optical lens giant Largan held its first quarter of 2026 earnings call on April 16, hosted by chairman En-Ping Lin. The company posted 7% year-on-year revenue growth — but headwinds are building as smartphone makers look to downgrade specifications.
As the global electronics and advanced semiconductor manufacturing sectors expand in 2026, the stability of semiconductor and electronics plant utilities systems has become critical to meeting new factory construction schedules. Kemflo Group CEO Eugene Lin pointed out that, leveraging its integrated strengths across water resources, industrial water treatment, and metal products, Kemflo is establishing itself as an indispensable high-end water treatment partner amid labor shortages in plant operations.
AI and high-performance computing (HPC) are driving increasingly stringent chip performance demands, marking a pivotal shift in advanced packaging technology from traditional wafers to large-size panels. Semiconductor equipment leader Skytech's CEO George Yi announced that its self-developed 310x310mm panel-level packaging physical vapor deposition (PLP PVD) system, a world first, has completed delivery and been successfully integrated into production lines at major OSAT firms including ASE Technology Holding.
TSMC's first-quarter 2026 earnings call delivered the expected headline numbers — $35.9 billion in revenue, a 66.2% gross margin, and full-year revenue growth guidance raised to above 30% in US dollar terms. The financial story was strong and largely anticipated.
The 2026 International Symposium on VLSI Technology, Systems and Applications (VLSI TSA) kicked off on April 14, gathering over 800 semiconductor professionals worldwide. The conference focused on next-generation core areas including GenAI inference acceleration, wafer-level computing, and terahertz wireless communication, while also delving into quantum computer system architectures and extending the reach of semiconductors to AI-driven cardiac analysis and other smart healthcare applications.
Samsung Electronics has initiated a workforce restructuring through a voluntary retirement program as strong semiconductor earnings contrast with weaker profitability in its device business, according to Korean media reports.
Elon Musk is reportedly accelerating plans to build a vertically integrated AI chip complex, reaching out across the semiconductor supply chain in what could become one of the most ambitious attempts to reshape AI infrastructure.
The surge in AI data center demand is rapidly accelerating the need for high-speed data transmission, prompting LED manufacturers to target opportunities in optical communications. best-Epitaxy Manufacturing's (bEMC) CEO Evan Wu said the company has focused on data transmission since its inception and recently began proof-of-concept (POC) testing with a leading cloud service provider (CSP). Their short-distance Micro LED transmission currently reaches speeds of 4Gbps, aiming to achieve 8Gbps per chip in 2026.
Suzhou C*Core Technology announced on April 15 that its next-generation automotive microcontroller unit (MCU), the CCRC4XXX series, has completed internal testing, marking a milestone in its push into high-end automotive semiconductors.
Memory module maker Apacer Technology reported its consolidated financial results for the first quarter of 2026, with revenue reaching NT$7.04 billion (approx. US$223 million), gross profit NT$3.47 billion, operating profit NT$2.31 billion, net profit NT$1.86 billion, and earnings per share (EPS) of NT$14.54. Revenue, gross profit, operating profit, and net profit all hit record highs for the quarter. Compared with EPS of NT$6.7 for the full-year 2025, Apacer's first-quarter earnings alone have already exceeded last year's total.
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