DIGITIMES Semiconductors news

Jan 16

US-Taiwan reach agreement on tariff deal, but leave timelines and capacity rules unclear

The US Commerce Department said Taiwan and the US will sign a trade agreement involving up to US$500 billion in Taiwanese investment. However, the framework does not set annual allocations, phased targets, or completion deadlines, giving both sides broad flexibility.

MediaTek scales flagship performance with Dimensity 9500s and 8500

Jan 16

China expedites photoresist localization to reduce Japan reliance

Jan 16

Huawei matches Nvidia in China's AI chip market, 2026 power shift in play

Jan 16

South Korea seeks matching US tariff breaks after Taiwan's chip pact agreement

Jan 16

TSMC retains pricing power using Apple and AI dual structure

Jan 15

MORE NEWS

MEMORY CHIPSSK Hynix reportedly completes 1a DRAM upgrade at Wuxi plant in China

Jan 18, 09:32

SK Hynix has reportedly finished converting its key DRAM production facility in Wuxi, China, to the fourth-generation 1a process. The company reached the manufacturing milestone despite US export controls that limit exports of advanced semiconductor equipment to China.

MEMORY CHIPSSouth Korea signs IP pact again, China-linked tech leaks still dominate

Jan 18, 09:31

South Korea's Intellectual Property Office (KIPO) signed a new Memorandum of Understanding (MOU) on intellectual property cooperation with China's National Intellectual Property Administration (CNIPA) during a China-South Korea leaders' meeting in Beijing in January 2026. It was the third such agreement, following earlier MOUs in 2013 and 2021.

IC DESIGN, DISTRIBUTIONResearch Insight: Qualcomm's Ventana deal signals push to reduce Arm reliance and deepen RISC-V bets

Jan 18, 09:31

On December 10, 2025, Qualcomm Inc. disclosed its acquisition of Ventana Micro Systems in the US without revealing the deal's financial terms or completion date. The company highlighted that the move would reinforce its global leadership in the RISC-V ecosystem and improve its CPU development capabilities, complementing its existing Oryon custom CPU team.

MEMORY CHIPSSK Hynix accelerates advanced packaging from Korea to Indiana

Jan 18, 09:29

SK Hynix plans to invest KRW19 trillion, about US$12.9 billion, to build an advanced semiconductor packaging plant in Cheongju, South Korea, as it moves to secure capacity for AI-driven memory demand. The investment would add to existing packaging operations in Icheon and a planned facility in Indiana, creating a network spanning South Korea and the US.

IC MANUFACTURINGTSMC speeds up US expansion while keeping FX strategy simple

Jan 17

TSMC is speeding up its multibillion-dollar expansion in Arizona after posting strong earnings, signaling confidence in long-term artificial intelligence demand and the US push to rebuild domestic chip manufacturing.

MEMORY CHIPSInternal memo reveals Micron has locked in PSMC HBM capacity through prepayment

Jan 17

Powerchip Semiconductor Manufacturing Corporation (PSMC) has provided new details on its planned sale of the Tongluo P5 fabrication plant to Micron Technology, confirming that the transaction is paired with a broader cooperation framework that includes prepaid reservations for high-bandwidth memory (HBM) back-end wafer manufacturing capacity.

MEMORY CHIPSMicron to buy PSMC Taiwan fab in $1.8bn deal as both recalibrate AI memory strategies

Jan 17

Micron Technology and Powerchip Semiconductor Manufacturing Corporation have reached a preliminary agreement under which Micron will acquire PSMC's Tongluo fabrication assets for US$1.8bn.

IC MANUFACTURINGNIAR launches chip-level advanced packaging platform to boost Taiwan's semiconductor edge

Jan 17

As the global semiconductor industry enters the post-Moore's Law era amid surging demand for artificial intelligence (AI) and high-performance computing (HPC), advanced packaging has become a critical technology shaping technological competitiveness and industrial layout. On January 13, 2026, Taiwan's National Institutes of Applied Research (NIAR) unveiled its chip-level advanced packaging R&D platform.

IC DESIGN, DISTRIBUTIONResearch Insight: System-level design, energy efficiency, and TCO drive AI hardware competition

Jan 17

AMD introduced its Helios system platform at CES 2026, marking a significant move in cloud AI computing competition from traditional single-chip performance to full rack-scale solutions. This development follows Nvidia's GB200 NVL series release and Google's TPU-based rack product plans disclosed by Broadcom, underscoring an industry trend toward delivering computing power through integrated system platforms rather than isolated chips.

MEMORY CHIPSMicron's new fabs target 2030 rollout as supply shortages linger

Jan 17

Micron is scheduled to begin construction on its planned New York state megafab site on January 16, 2026, advancing its US manufacturing expansion even as executives warn that new capacity will take years to meaningfully ease tight conditions in the global memory market.

IC DESIGN, DISTRIBUTIONTop 10 Chart: Taiwan's IC design sector ends 2025 with an AI-led split

Jan 17

Taiwan's IC design segment posted a visibly divergent finish in December 2025, with AI/HPC, data center, and enterprise storage-related suppliers closing the year strongly, while consumer electronics-facing lines weakened amid seasonality, cautious panel and handset component pull-ins, and ongoing inventory adjustment.

More coverage

TOPICS

TSMC UPDATES

JAPAN ADVANCED SEMICONDUCTOR MANUFACTURING, INC. (JASM)

INTERVIEWS