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Sep 18, 12:11
Baidu's Kunlun chip nab China Mobile contract, but still trails Huawei Ascend ecosystem
Baidu, one of China's leading internet companies, has cultivated its in-house Kunlun chip for years and recently secured a significant contract with China Mobile, marking the first step in its commercialization process of supplying external customers.
Nvidia and Intel announced a wide-ranging collaboration to jointly develop data center and personal computing products that integrate both companies' technologies. The agreement centers on combining Nvidia's AI and accelerated computing platforms with Intel's CPU and x86 ecosystem, connected through Nvidia's NVLink technology.
Hanwha E-ssential, a subsidiary of Hanwha Solutions, has successfully localized the production of semiconductor packaging insulation materials in South Korea. The company plans to begin supplying in 2026, aiming to challenge the market dominance of Japanese firm Ajinomoto.
Taiwan is racing to advance its silicon photonics capabilities, aiming to develop high-efficiency 400Gbps optical modules within one to two years, according to the Ministry of Economic Affairs (MOEA).
Murata Manufacturing has announced its Medium-Term Direction 2027, outlining ambitious growth targets and a bold investment strategy as the electronics market undergoes structural change. The Japanese electronic components maker aims to achieve revenue of JPY2 trillion (approx. US$13.3 billion) and an operating profit margin of at least 18% by fiscal 2027, with artificial intelligence (AI) applications serving as a key growth driver.
Arm has opened a new chip design center in Bengaluru focused on advanced 2nm chips. Union IT minister Ashwini Vaishnaw called it a milestone for India's semiconductor goals, making Arm the second company after Renesas to reach this level domestically.
Advanced packaging has emerged as the centerpiece of semiconductor innovation, with industry attention now focused on what will replace the dominant chip-on-wafer-on-substrate (CoWoS) process. Many suppliers see chip-on-panel-on-substrate (CoPoS) —a panel-level packaging method that converts round wafers into square panels— as the frontrunner for near-term adoption.
Vietnamese technology giant FPT Corporation is intensifying its push into the semiconductor industry with plans to establish a new backend semiconductor manufacturing facility in the central city of Đà Nẵng.
Samsung Electronics is the only South Korean tech company invited to a new US government initiative focused on modernizing the nation's healthcare system. The program, dubbed "Make Health Tech Great Again," is a public-private partnership launched by US President Donald Trump.
Amid uncertainties posed by major powers such as the US and China, Japan and Europe are strengthening their ties. The scope of Japan-EU cooperation could potentially expand to include the development of rare earth resources in Greenland.
As the third quarter of 2025 draws to a close, a consensus has formed within Taiwan's IC design industry that overall demand remains weak. Notably, an increasing number of chipmakers are adopting a more conservative outlook on the upcoming market conditions. The main reason is that customers appear reluctant to stock up ahead of key fourth quarter promotional events such as Singles' Day, Christmas, and New Year sales.

Transcom, a specialist in high-power amplifiers, is making bold strides into the dual frontiers of national defense and space communications. Leveraging its deep expertise in compound semiconductor technologies such as gallium arsenide (GaAs) and gallium nitride (GaN), the company is expanding the application of its amplifier technology to address both pressing geopolitical demands and the rapidly growing low-Earth orbit (LEO) satellite market.