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Feb 10
US plans chip tariff breaks for tech giants tied to TSMC's US expansion
The Trump administration is preparing to spare major US technology companies from a new round of semiconductor tariffs as they expand data center capacity to support the artificial intelligence boom, according to the Financial Times. The plan would grant tariff carve-outs to US hyperscalers, including Amazon, Google and Microsoft, with relief tied to the scale of TSMC's US investment commitments and projected production capacity. TSMC is the world's largest contract chipmaker.
On February 10, Semiconductor Manufacturing International Corporation (SMIC) reported record 2025 revenues, but quarterly gross margins fell to 19.2%. The decline, driven by heavy depreciation costs and shifting smartphone supply chain dynamics, underscores the financial pressure of aggressive capacity expansion despite sustained high utilization across manufacturing facilities.
Intel's 14A process node has become a focal point for the semiconductor industry, with market observers viewing it as a critical test of the company's manufacturing resurgence strategy. The advanced node has attracted significant attention amid speculation that major customers like Apple and Nvidia could adopt it for high-volume production. However, recent developments suggest these optimistic timelines may need recalibration.

Taiwanese semiconductor materials distributor Topco Scientific (TSC) reported record revenue for January 2026, buoyed by robust demand from artificial intelligence-driven advanced chip production. The company said January revenue reached NT$6 billion (approx. US$190 million), an 8.25% increase from the same month a year earlier. The figure marks the highest January performance in the company's history and ranks as the third-highest monthly revenue on record.

Amazon is deepening its partnership with STMicroelectronics, expanding a multiyear, multibillion-dollar collaboration aimed at developing specialized chips for data center infrastructure, as cloud computing giants race to improve performance and energy efficiency amid surging demand.

Taiwan's Ministry of Finance (MOF) announced on February 9, 2026, that Taiwan's exports in January 2026 hit a record high, surpassing NT$2 trillion (US$63.4 billion) for the first time, up 69.9% year-on-year. Strong demand for AI servers, ongoing memory shortages, and the competitiveness of Taiwan's semiconductor products drove the surge.
Riding a year of extraordinary growth powered by the AI boom, Taiwan Semiconductor Manufacturing Co. (TSMC) has approved a 2026 strategy that couples record capital spending with one of the most consequential management reshuffles in its history. The board's decisions underscore how aggressively the world's largest contract chipmaker intends to widen its technological and organizational lead.
Renesas Electronics recorded its first net loss in six years in fiscal 2025, reflecting weak demand for automotive semiconductors and a limited contribution from AI-related products. The company is recalibrating its strategy, with India and China positioned as key pillars in its recovery roadmap.

Vanguard International Semiconductor (VIS) reported consolidated revenue of NT$4.01 billion (approx. US$127 million) in January 2026, reflecting a decline in wafer shipments. The figure was down 18.6% from December 2025, when revenue totaled NT$4.93 billion, but up 18.4% from a year earlier, underscoring uneven but improving demand conditions.

Alphabet Inc. has executed a financial maneuver that fundamentally alters the landscape of the AI arms race.

Taiwan Semiconductor Manufacturing Co.(TSMC) reported a sharp 36.8% jump in January revenue, underscoring an acceleration in global demand for advanced semiconductors that outpaced market expectations.

Europe has taken a decisive step toward advanced semiconductor leadership with the launch of the NanoIC pilot line at Imec's Leuven headquarters, positioning the region to accelerate development of sub-2nm systems-on-chip (SoCs) and strengthen its role in next-generation chip manufacturing.