DIGITIMES Semiconductors news

Sep 17

CXMT cashes in on the DRAM shortage — and takes aim at HBM

ChangXin Memory Technologies (CXMT) is emerging from the memory shortage with sharply higher profits and greater pricing power, giving China's largest DRAM maker more resources to expand into LPDDR6 and high-bandwidth memory (HBM) while China's domestic memory supply chain moves further upstream.

20 of China's OSATs push into advanced packaging amid EUV curbs

Sep 17

SK Hynix weighs US memory options as buyers lock in 2027 supply

Sep 17

Google reportedly weighs CoWoS backup for 2027 TPU as EMIB-T substrate yields lag

Sep 17

Exclusive: China's CAS institute charts DUV route to 3nm GAA without EUV

Sep 17

MORE NEWS

MEMORY CHIPSChina's memory push gains ground across LPDDR6, advanced NAND, with HBM still the test

Sep 18, 13:56

AI is reshaping the global memory industry, tightening supply while creating an opening for China's domestic suppliers. With Samsung Electronics, SK Hynix, and Micron prioritizing high-bandwidth memory (HBM) and high-end server memory, ChangXin Memory Technologies (CXMT) and Yangtze Memory Technologies (YMTC) are gaining ground in conventional DRAM, mobile memory, and NAND Flash.

IC MANUFACTURINGChip equipment makers face waits of up to 40 months for critical parts

Sep 18, 11:56

The semiconductor industry's capacity crunch is moving deeper into the equipment supply chain, with shortages of specialized components stretching delivery times as chipmakers accelerate fab investment.

IC MANUFACTURINGSamsung deepens Euclyd ties as startup reportedly reaches test-chip stage

Sep 18, 11:45

Samsung Electronics is deepening its relationship with Dutch chip startup Euclyd after the company reportedly reached the test-chip stage at Samsung Foundry, adding a manufacturing dimension to Samsung's recent investment in the two-year-old company.

PASSIVE, PCB, OTHER IC COMPONENTSCPO raises PCB downgrade concerns but switches stick with M8 CCL

Sep 18, 11:07

As the industry shifts toward greater use of optical interconnects and less reliance on copper, market speculation has emerged that wider adoption of co-packaged optics (CPO) could reduce high-speed transmission requirements for AI server motherboard printed circuit boards (PCBs).

IC DESIGN, DISTRIBUTIONMobile SoC battle for 2026 centers on NPUs

Sep 18, 10:31

More technical details on 2026 mobile systems on a chip (SoCs) from major vendors are emerging, and the biggest changes in chips such as Apple's A20 Pro and MediaTek's Dimensity 9600 Pro are clearly concentrated in the neural processing unit (NPU). Qualcomm also published a technical article on NPU development on September 10, saying its next-generation NPU will expand shared memory capacity to improve access efficiency and speed for model data, helping mobile AI maintain fast response times.

MEMORY CHIPSMicron: AI memory crunch rewrites the market with long-term deals and custom designs

Sep 18, 10:24

As the AI boom spreads from data centers to edge devices and robotics, Micron Technology executives are warning that memory has become a core bottleneck determining the upper limits of AI performance. With new capacity taking years to build and manufacturing processes growing increasingly complex, meaningful new memory supply may not begin arriving until 2028.

IC MANUFACTURINGGlobalFoundries, Marvell expand SiGe capacity deal for AI optical connectivity

Sep 18, 09:56

GlobalFoundries (GF) and Marvell Technology have expanded a multi-year agreement to increase production capacity for silicon germanium (SiGe) technology at GF's facility in Burlington, Vermont, as demand grows for optical connectivity used in AI and cloud data centers.

IC MANUFACTURINGRumored Japan-US chip plant talks test whether two former chipmaking giants can rebuild at home

Sep 18, 09:36

If the project under discussion goes ahead, it would be the first time Japan's US$550 billion tariff-linked investment pledge is directed toward chip manufacturing rather than the energy and industrial-materials projects announced so far — and the clearest sign yet that the two countries that once dominated chipmaking could rebuild some of that capacity jointly.

IC MANUFACTURINGResonac grows 300mm SiC crystal, marking a substrate milestone

Sep 18, 09:35

Resonac has grown and processed a 300mm silicon carbide (SiC) single crystal. This development could shape the future of power electronics used worldwide in electric vehicles, renewable energy systems, data centers, and advanced computing. The achievement underscores the push for larger, higher-quality wafers that may improve efficiency, reliability, and manufacturing scale.

IC MANUFACTURINGGlobal chipmakers answer India's pitch with equipment, materials, and R&D — not fabs

Sep 18, 09:14

The multinationals that filled Semicon India 2026 committed to almost every layer of the semiconductor value chain except the one India most wants: nobody announced a new fab. Applied Materials, Lam Research, Micron, ASML, and Infineon instead put money and headcount behind equipment manufacturing, silicon components, assembly and test, research parks, and design centers. That is the supporting industry that the government's Semicon 2.0 framework explicitly targets, and the part of the chain that can be built without waiting for a customer's wafer starts.

IC MANUFACTURINGTata Electronics put 16 MoUs on the record at Semicon India, join hands with Nexperia

Sep 18, 08:57

Tata Electronics has attached a headline number to its supplier-recruitment drive at Semicon India 2026 — 16 memoranda of understanding — but only five have been documented in the company's own announcements, leaving most of the tally resting on a list its chief executive read from the stage. For an India Semiconductor Mission trying to show movement from project approvals to commercial production, the distance between the claim and the paperwork is a fair measure of how early this ecosystem still is.

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