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Dec 3, 10:39
Intel taps Amkor in Korea for advanced chip packaging
Intel is reportedly outsourcing the advanced packaging of its artificial intelligence semiconductors to Amkor Technology Inc.'s facility in Incheon, South Korea, marking the first time the US chip giant has relied on an external partner for this critical process, according to South Korea's ET News.

Tokyo Electron Limited (TEL) sought to clarify its position after Taiwan's High Prosecutors Office indicted its subsidiary, Tokyo Electron Taiwan Ltd., over alleged supervisory failures tied to a confidential-information leak. TEL itself has not been indicted.

Innoscience said at midday on December 3 via the Hong Kong Stock Exchange that it had prevailed in its US patent dispute with Infineon, marking a decisive turn in a long-running GaN intellectual property battle. The US International Trade Commission delivered the key ruling, closing a case that had drawn industry-wide attention.
AMD and Hewlett Packard Enterprise (HPE) are expanding their long-standing partnership with a new plan to deliver open, rack-scale infrastructure for the AI era. HPE becomes one of the first adopters of AMD's "Helios" architecture, a full-stack, Ethernet-based platform built to streamline and accelerate the deployment of large AI clusters.

Nvidia CFO Colette Kress said at the UBS Global Technology and AI Conference in Arizona that the company's potential investment agreement with OpenAI of up to US$100 billion has not been finalised.

Pat Gelsinger describes himself as a born-again Christian who lives "at the intersection of faith and technology." For the former Intel CEO, reviving American semiconductor manufacturing isn't just a business strategy—it's a mission he believes he was called to fulfill. This conviction has driven him to donate nearly half of his income to charity and maintain strict self-discipline, waking at 4 a.m. each morning. But the same unwavering sense of purpose that guides his personal life now shapes his vision for the industry, one that fundamentally challenges how foreign companies like TSMC are investing in the US.
Optical communication filter maker East Tender Optoelectronics Corp. (EOC) completed a board restructuring in March 2025, positioning itself to capture booming opportunities in AI, semiconductors, high-speed computing, satellite communications, and advanced packaging. The company is shifting from its traditional optical filter business toward integrated solutions spanning optics, networking, AI, lasers, and semiconductor materials, aiming to transform from a component supplier into an integrated optoelectronic solution provider.
Onsemi and Innoscience have signed a memorandum of understanding to assess opportunities for expanding the manufacturing of gallium nitride (GaN) power devices, with a focus on accelerating deployment in the 40–200V segment. The companies said the non-binding agreement aims to combine Onsemi's packaging, drivers, and system-integration capabilities with Innoscience's 8-inch GaN-on-silicon wafer technology and high-volume production capacity.
Following Nvidia CEO Jensen Huang's commitment to supply 260,000 GPUs to South Korea, the government has received its first shipment of approximately 13,000 units, including the latest B200 GPUs and a range of earlier-generation models.
Global memory capacity remained tight with strong demand pushing DRAM and NAND flash spot prices sharply higher in November. Samsung Electronics planned to moderately release RDIMM modules mainly for server customers in the fourth quarter of 2025, slightly easing shortages but leaving many smaller buyers struggling amid soaring costs.
The DIGITIMES Tech Forum commences on December 3, drawing over 1,500 participants from the technology sector. The hybrid event spotlighted the industry's focus on global supply chain restructuring and accelerating artificial intelligence (AI) developments.
Marvell's planned acquisition of Celestial AI signals a major shift toward all-optical interconnects in AI data centers, with the company positioning itself to capture a rapidly expanding market driven by multi-rack, high-bandwidth system architectures.