Samsung Electronics and SK Hynix are reportedly allocating additional or flexible DRAM production capacity to server DDR5 and other conventional memory products while maintaining high-bandwidth memory (HBM) volumes already committed to customers.
Chinese chip designer GigaDevice is investing another CNY500 million (approx. US$73.9 million) into its wholly owned subsidiary to support its DRAM research and industrialization project, continuing a series of capital injections aimed at expanding its memory business.
SK Hynix said in a July 22 disclosure that it had neither pursued nor decided on an acquisition of Intel's under-construction semiconductor site in New Albany, Ohio, denying a JoongAng Ilbo report that the companies were negotiating over the campus.
TSMC's planned 2027 wafer price increases are reinforcing confidence that AI chip demand remains strong while prompting fresh discussion over whether Intel and other semiconductor companies will gain greater flexibility to adjust their own pricing.
The AI industry may be riding a wave of momentum, but two clouds have recently unsettled the outlook: growing public opposition to data center construction across the United States, and a dramatic leap in the rankings by Chinese-developed model Kimi K3, which has renewed fears of AI overinvestment. NVIDIA CEO Jensen Huang addressed both concerns directly on July 21.
Nvidia's newly detailed Vera Rubin NVL72 is being pitched less as a faster chip and more as a cheaper unit of AI output. This shift matters most for the power-constrained data centers now defining the ceiling of the industry's growth. In its July 21 announcement, Nvidia said the rack-scale system delivers roughly 10 times more tokens per megawatt than its current Grace Blackwell NVL72, and about one-tenth the cost per million tokens of the GB200 NVL72. This framing positions electricity, not silicon, as the scarce resource.
Chinese semiconductor equipment suppliers are beginning to secure production orders for through-glass via (TGV) manufacturing tools, marking a shift from prototype validation toward commercial deployment as the industry moves to develop glass substrates for next-generation AI chip packaging.
Intel and Fortinet have expanded their long-standing partnership to develop the Fortinet Security Processor 6 (SP6), a move expected to shape how cybersecurity hardware is designed, produced, and distributed globally. The effort is also intended to make the supply chain for critical security chips more resilient, potentially benefiting enterprises, governments, and consumers worldwide.
Chinese AI chip developer Enflame said at the World Artificial Intelligence Conference (WAIC) 2026 that it had jointly showcased an AI chip sample with Shanghai Xianfeng Technology using glass-based Chip-on-Panel-on-Substrate (CoPoS) panel-level advanced packaging.
Philippe Notton has spent nearly 20 years traveling to Taiwan roughly once a month. That rhythm—born from his time at MStar Semiconductor and deepened across four companies on three continents—shaped how he thinks about building chips, building companies, and building Europe's only independent advanced CPU business.
