DIGITIMES Semiconductors news

Aug 12

OCP photonics panel warns CPO packaging is still unsettled as pluggables fade

Pluggable front-panel optics still own the market, but Arista co-founder Andy Bechtolsheim gave them a deadline at an OCP APAC panel here: the form factor reaches its physical limit at the 49.6T switch generation, roughly 18 months out.

Japan's US$430B 2040 chip plan hinges on Rapidus 2nm

Aug 12

OCP APAC 2026: Microsoft leans on Taiwan supply chain for 'silicon-to-systems' AI buildout

Aug 12

OCP APAC 2026: TSMC says AI advanced packaging enters system-level battle

Aug 12

TSMC-Sony's US$4.69B sensor venture is a defensive play against Samsung and China

Aug 12

MORE NEWS

IC DESIGN, DISTRIBUTIONOCP APAC 2026: Ayar Labs CEO says copper is holding back open compute, sees optical interconnects as way forward

Aug 13, 14:00

Speaking at the OCP APAC Summit 2026, Ayar Labs CEO Mark Wade argued that copper interconnects have become one of the biggest obstacles to realizing the vision of open computing.

IC MANUFACTURINGGaAs gains ground in short-reach AI optics as InP constraints mount

Aug 13, 12:39

As AI workloads push data center interconnects from 800G toward 1.6T, indium phosphide (InP) has become a critical material for high-speed optical links, particularly for longer-distance transmission. But crystal growth challenges, supply constraints and high costs are prompting the industry to explore gallium arsenide (GaAs) as a partial alternative for shorter-reach connections, with the technology expected to become clearer by 2028.

IC MANUFACTURINGIntel signals memory push after hiring former SK Hynix CEO

Aug 13, 12:15

Intel is signaling a broader push into next-generation memory technologies, with CEO Lip-Bu Tan revealing that the company is exploring new memory architectures after hiring former SK Hynix CEO Seok-Hee Lee.

IC MANUFACTURINGHanmi pulls ahead of Hanwha as HBM4 orders rebound

Aug 13, 11:51

South Korea's Hanmi Semiconductor is pulling ahead of rival Hanwha Semitech in thermal compression (TC) bonders for high-bandwidth memory (HBM), as HBM4 equipment orders rebound and Hanmi's growing business with Micron helps reduce its reliance on SK Hynix, according to Chosun Biz.

IC MANUFACTURINGIndia's state of Odisha sweetens chips, renewable energy incentives to court ISM projects

Aug 13, 11:45

Odisha's state cabinet has approved a third amendment to its Semiconductor Manufacturing and Fabless Policy, adding fresh capital support to attract projects backed by India's national chip-making push, according to state officials cited by regional outlets on August 12, 2026.

IC DESIGN, DISTRIBUTIONLightmatter white paper targets fragmented supply chain, barriers to photonic interconnect deployment

Aug 13, 11:38

Bijan Nowroozi, Head of Ecosystem Development at Lightmatter, announced at the OCP APAC Summit 2026 that the company has released an infrastructure white paper aimed at building a more unified, less fragmented supply chain for photonic interconnects.

IC DESIGN, DISTRIBUTIONSiemens EDA unveils AI-Native Design strategy in South Korea

Aug 13, 11:32

Siemens EDA has introduced an AI-Native Design strategy in Seoul, aiming to help chipmakers and system designers manage rising complexity while reducing the risk of AI errors. The move could shape how semiconductor tools evolve worldwide, as companies seek faster, more reliable automation across increasingly global supply chains.

IC DESIGN, DISTRIBUTIONSynopsys pushes into system design as Nvidia, AMD and Broadcom move up the stack

Aug 13, 11:23

Nvidia, AMD and Broadcom are moving beyond chip-level design into subsystems and complete systems, a shift that is increasing the need to account for thermal, electrical, mechanical and other physical effects earlier in the design process, according to Synopsys executives.

IC DESIGN, DISTRIBUTIONNXP expands Malaysia factory to bolster global chip supply resilience

Aug 13, 11:20

NXP Semiconductors has begun expanding its Petaling Jaya assembly and test site in Malaysia, a move that could support semiconductor supply chains worldwide by adding capacity, automation, and geographic diversification. The project is part of a broader effort to improve manufacturing resilience as global demand and supply risks continue to shape the industry.

IC DESIGN, DISTRIBUTIONNvidia's compute financing push signals a new phase for AI spending

Aug 13, 11:18

Nvidia's plan to assemble more than US$500 billion in third-party capital for AI infrastructure could reshape how the industry pays for compute. By bringing major Wall Street firms into the deal, the chipmaker is effectively turning AI capacity into a financeable asset class, with implications for cloud providers, investors, and credit markets.

MEMORY CHIPSOCP APAC 2026: Intel sees agentic AI shifting bottlenecks toward CPUs, memory

Aug 13, 10:14

Intel sees agentic AI changing the balance of AI servers, as CPU orchestration, memory capacity and data movement emerge as performance constraints even when more GPU capacity is available.

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