Acer Group founder Stan Shih said Taiwan's industrial transformation from vertical integration to vertical disintegration has been crucial to its tech rise, noting that US chip giant Intel stood alone in resisting this industry-wide change.

Japan's Ministry of Economy, Trade and Industry (METI) is drafting new cybersecurity guidelines for semiconductor manufacturers and is considering making compliance a condition for receiving government subsidies. The final version of the guidelines is expected to be released in the fall of 2025.

Morrison, a Taiwanese company specializing in precision optical coating combined with semiconductor lithography process technology, was officially listed on the emerging stock market on June 26, 2025. It is the first company in Asia capable of mass-producing 8-inch patterned optical films (POF) and independently managing lithography operations. Morrison aims to expand its production capacity to address growing demands in sensor filter markets that require increasingly sophisticated optical components.

As the world shifts toward an "everything AI" paradigm, compute demands are rapidly outpacing hardware performance gains, ushering in what industry leaders are calling a golden decade for custom-designed AI chips (ASICs), beginning in 2025.

Flexible copper clad laminate maker Taiflex Scientific Co. said downstream customers increased inventory purchases in the first quarter amid uncertainty over new US tariff policies, driving shipment momentum for standard materials. The Taiwan-based manufacturer expects consumer electronics demand to face headwinds from macroeconomic volatility, though it doesn't anticipate destocking pressure in the second half of 2025.

Generalplus has announced that its self-developed MCU product, the GPM32F9010RLQ, has passed the AEC-Q100 Grade 1 automotive-grade certification. This milestone represents the company's initial entry into the automotive electronics market, with a product meeting stringent industry standards. The certification verifies that the MCU complies with critical automotive requirements concerning functional safety, environmental tolerance, and reliability.

Bosch Global Software Technologies (BGSW) has signed a Memorandum of Understanding (MoU) with Chennai-based fabless semiconductor startup Mindgrove Technologies to jointly develop high-performance system-on-chip (SoC) solutions aimed at applications in automotive, industrial automation, consumer electronics, and smart IoT infrastructure.

At Nvidia's 2025 annual shareholder meeting, CEO Jensen Huang presented the company's strategic outlook for the coming decade, emphasizing the critical role of AI infrastructure, the expansion of US-based manufacturing, and the acceleration of next-generation computing technologies. His remarks highlighted both Nvidia's near-term momentum and long-term investments to address a global surge in demand for advanced AI systems.

Chin-Ching Liu, chairman of the National Development Council (NDC), stated during a briefing at Taiwan's Economic Committee on June 25 that manufacturers' annual shipments are usually fixed. If customers pull orders forward in the first half of 2025, caution should be exercised for the second half. Additionally, Nvidia's GB300 chip will begin shipping in the second half of the year, supporting Taiwan's export performance. Private investment in Taiwan is projected to reach NT$5.7 trillion (US$194.1 billion) for the full year, potentially driving GDP growth by an additional 3.1 percentage points.

China's semiconductor equipment industry is witnessing renewed consolidation as leading toolmaker Naura Technology assumes control of Kingsemi, a specialist in lithography systems. The boardroom shake-up signals a strategic effort by China to streamline its equipment ecosystem and accelerate the development of homegrown technologies for advanced front-end chip manufacturing.