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Jun 17
Amkor alone cheers 10-year TSMC advanced packaging deal in Arizona
Taiwan Semiconductor Manufacturing Company (TSMC) and Amkor Technology have signed a 10-year agreement to jointly expand advanced semiconductor packaging capacity in Arizona, a move that would bring a more complete chip supply chain onto American soil.

In an exclusive interview with The Wall Street Journal, Apple CEO Tim Cook made an unusually blunt admission. The company is preparing to raise product prices because memory and storage costs have surged to a point Apple can no longer absorb. He said Apple has spent the past stretch trying to shield customers from these cost increases, but the situation has become "unsustainable."

Japanese Prime Minister Sanae Takaichi is scheduled to visit Assam in northeastern India in early July 2026. According to Nikkei, more than 50 Japanese companies and business groups, including Suzuki, Itochu and Toyota Tsusho, are expected to accompany the delegation, with market attention focused on cooperation in semiconductors and infrastructure.

MPI Corporation, a major probe card supplier, said AI demand is tightening supply across the probe card market and extending order visibility, with the company considering a prepayment mechanism to guarantee customers priority access to capacity.
Winbond's NOR flash has reportedly entered Nvidia's supply chain for the first time, as AI server demand drives a surge in memory consumption and Nvidia's next-generation Vera Rubin platform prepares for volume shipments in the second half of 2026. Industry sources said Winbond will align NOR flash shipments with customer rollout schedules and is expected to win a major share on the Vera Rubin platform.

Samsung Electronics and SK Hynix are each reviewing locations in South Korea's Honam region for new semiconductor packaging plants, according to The Elec and Hankyung, citing industry sources, as the two companies look for ways to add back-end capacity beyond their existing manufacturing hubs.

Taiwan's listed semiconductor manufacturers reported strong May revenue figures, with a sweeping recovery in DRAM prices and rising artificial intelligence infrastructure spending lifting most of the sector's 27 tracked companies to double-digit year-on-year gains.

As AI chip technology advances, larger chip sizes and heterogeneous integration packaging are driving bigger package dimensions, pushing semiconductor makers to adopt FOPLP over FOWLP and improve manufacturing efficiency by "replacing round with square." DIGITIMES believes that panel makers have an edge because their existing glass substrates are larger than those used by OSATs, making FOPLP development more favorable.

The global semiconductor and high-tech manufacturing landscape continues to undergo structural realignment. An increasing number of Chinese technology and semiconductor companies are adopting a dual-location strategy, establishing corporate entities in Singapore while locating manufacturing operations in Malaysia in an effort to reduce their association with the "Made in China" label.

Nichicon raises e-cap prices as supply tightens, costs increase
Jun 18, 10:16
Japanese capacitor manufacturer Nichicon has announced a broad price hike for aluminum electrolytic capacitors (e-cap), as order volumes for some products have exceeded the company's existing production capacity. The announcement comes amid another round of price increases in the passive components industry.

A teardown of Huawei's latest Mate 80 Pro Max smartphone has put China's semiconductor progress back under scrutiny, after analysis showed the HiSilicon Kirin 9030 processor was made on SMIC's third-generation 7nm-class N+3 process with a local metal pitch narrower than that of Intel's 18A chip used in Panther Lake.

Samsung Electronics is reportedly working with multiple partners to develop production equipment for its seventh-generation 10nm-class (1d) DRAM process. The company aims to begin tool installation as early as the second quarter of 2027, with initial volume production expected by the end of that year.