Panel maker Innolux posted a small profit in 2025, but compared with its earnings performance, the "factory sale drama" that has drawn market attention is escalating. In addition to selling a small factory not listed on its official website to ChipMOS Technologies, Innolux also announced plans to dispose of its Nanke Fab 2 and Fab 5 plants. The board of directors has authorized chairman Jim Hung to handle the matter, which the market interprets as a sign that the sale is likely to proceed. If the two plants are successfully sold, they could become a new battleground for advanced packaging capacity after transitioning away from panel production.

GlobalWafers chairman Doris Hsu said rising adoption of artificial intelligence (AI) and high-performance computing (HPC) is sustaining long-term demand for advanced 12-inch silicon wafers, as expanding chip complexity and advanced packaging requirements increase semiconductor material consumption.

The Taiwan Printed Circuit Board Association (TPCA) held its annual member meeting, where chairman Lawrence Chang announced projections for the industry through 2026. The announcement included both growth expectations and a newly released risk governance strategy.

Fiber Optic Communications Inc. (FOCI) is deploying high-precision automated production lines for fiber array units to accelerate the production of co-packaged optics products and plans to mass-produce 1.6T and 3.2T FAUs in the second half of 2026.

After a challenging 2025, flexible printed circuit (FPC) giant Flexium Interconnect is optimistic about its revenue and profit outlook, driven by accelerated transformation in high-speed transmission products. The company expects full-year growth in 2026 fueled by strong demand in two key sectors: new models for major US smartphone customers and applications in AI servers and wearable devices.

Samsung Electronics is reportedly planning to adopt a 2-nanometer (nm) process for the base die of its next-generation high-bandwidth memory (HBM), HBM4E, aiming to enhance its technological competitiveness. Industry experts see this as part of Samsung's broader strategy to leverage its advantage as a leading integrated device manufacturer (IDM) in the global AI semiconductor race.

The semiconductor landscape is undergoing a fundamental shift, moving from a mobile-first volume game to an AI-driven value competition.

United Microelectronics Corporation (UMC) has partnered with startup HyperLight to mass-produce thin-film lithium niobate (TFLN) chiplets, aiming to improve data transmission speeds in artificial intelligence computing clusters and data centers.

Samsung Electro-Mechanics (Semco) is expected to supply ABF substrates for Tesla's next-generation artificial intelligence chips that Samsung Electronics plans to manufacture at its Taylor, Texas foundry, according to Chosun Biz and other Korean media reports.