DIGITIMES Semiconductors news

Sep 10

China's Nvidia rivals raise prices as HBM shortage bites

Chinese chipmakers challenging Nvidia are sharply raising prices for current and next-generation accelerators as high-bandwidth memory (HBM) becomes scarcer and more expensive, adding another cost constraint to China's push for domestic computing hardware.

TSMC August 2026 revenue jumps 53.3% as AI chip demand drives record growth

Sep 10

CXMT's HBM3 yield reportedly stalls at 25% as TSV and stacking challenges expose China's AI memory gap

Sep 10

Apple just put a US$700 premium on hinges — seven supply chain takeaways

Sep 10

Qualcomm's AWS deal raises stakes for MediaTek and Alchip

Sep 10

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IC MANUFACTURINGChipmaking equipment spending could hit US$270 billion by 2030, Futurum says

Sep 11, 16:59

Global wafer fab equipment (WFE) spending could reach about US$270 billion in 2030 as data center expansion drives demand for advanced logic, high-bandwidth memory (HBM), DRAM and advanced packaging capacity, according to Futurum Group.

MEMORY CHIPSMemory makers gain the upper hand as Apple's iPhones pay the price

Sep 11, 16:26

Apple has raised prices on both its new iPhone 18 Pro series and older models, including the iPhone 17, as rising memory costs push up component expenses.

IC DESIGN, DISTRIBUTIONEnflame enters public markets with Nvidia alternatives in its sights

Sep 11, 16:17

Chinese AI chipmaker Enflame Technology made a striking debut on Shanghai's STAR Market on Friday, with its shares opening 188% above the IPO price after raising CNY6.12 billion (US$912 million). The listing gives the Tencent-backed company fresh capital to fund its next generations of AI processors and large-scale computing systems, while sharpening attention on China's effort to build alternatives to Nvidia.

IC MANUFACTURINGAUO, Innolux accelerate shift from displays to AI, CPO, advanced packaging

Sep 11, 16:09

Taiwan's panel makers posted mixed August results as the industry's strategic focus shifts beyond monthly revenue toward AI, advanced packaging and co-packaged optics (CPO). AUO and Innolux, the island's two largest panel makers, are accelerating capacity reductions and asset sales while redirecting capital and technology toward higher-growth businesses. For smaller and mid-sized players, however, the path beyond displays remains far less defined.

IC DESIGN, DISTRIBUTIONCPO startup Ayar Labs raises 2026 funding to US$650 million, adds Wiwynn as investor

Sep 11, 15:52

Ayar Labs, a co-packaged optics (CPO) startup, has raised an additional US$150 million, bringing the primary capital it has raised so far in 2026 to US$650 million. The company says it will use the money to move its CPO products into high-volume manufacturing.

PASSIVE, PCB, OTHER IC COMPONENTSChina's DRAM supply chain clears another materials hurdle

Sep 11, 15:12

China's semiconductor localisation effort has reached another upstream materials milestone. Jiangsu Pacific Quartz Co. has secured qualification for high-purity quartz products at a domestic DRAM manufacturer capable of large-scale production.

IC MANUFACTURINGCIOE: Hitachi relies on partnerships, not proprietary tech, to ride China's optical boom

Sep 11, 14:40

At an optoelectronics trade expo in China, Hitachi High-Tech used its booth not to unveil a flagship product of its own, but to showcase a growing web of partnerships. This is a strategy the company says reflects both its late entry into the photonics race and its long-term goals in the region.

IC DESIGN, DISTRIBUTIONSamsung's Exynos gains ground as Galaxy S26 lifts share to 9%

Sep 11, 14:18

Samsung Electronics is regaining ground in the global smartphone processor market, with its Exynos share rising to 9% in the second quarter of 2026 from 7% in the previous quarter as the Galaxy S26 brought Samsung's in-house chips back to its flagship lineup.

IC DESIGN, DISTRIBUTIONTaiwan govt boosts EDA R&D to target global gaps

Sep 11, 14:04

Taiwan's National Science and Technology Council (NSTC) briefed Premier Jung-tai Cho on September 10, 2026, at an Executive Yuan meeting on the Chip-Driven, Taiwan-wide semiconductor core facility buildout and advanced chip design software development initiative, with the biggest focus on breakthroughs in Taiwan's next-generation electronic design automation (EDA) tools. Taiwan's academic and research community is targeting emerging EDA gaps that international giants have not yet fully developed or adequately supported, while building critical tools for heterogeneous integration, advanced packaging and system-level design.

PASSIVE, PCB, OTHER IC COMPONENTSAI packaging turns to glass, with TGV metallisation persisting as key technical hurdle

Sep 11, 13:35

Taiwan supply-chain sources said low-CTE glass fibre cloth used in high-end substrates remains tight, while glass-core substrates for next-generation packaging are still in technical validation and supply-chain development. Key challenges include material brittleness and inconsistencies in through-glass via (TGV) metallisation processing and reliability.

MEMORY CHIPSMicron brings forward record pay amid Taiwan strike threat

Sep 11, 12:25

Micron has announced its FY26 pay package for more than 60,000 employees worldwide, the largest in the company's history. For the first time, every employee will receive merit-based stock awards, making the entire workforce shareholders.

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Exclusive Interview: WG Tech sees a faster route for TGV beyond displays

WG Tech (Jiangxi) Group is accelerating its shift from display glass into semiconductor applications, targeting through-glass via (TGV) substrates for optical communications and advanced packaging as AI demand expands.

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