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Aug 20, 13:44
SK Hynix's new HBM team lands in Nvidia and AMD's backyard — co-design is becoming the way to win HBM4 orders
SK Hynix is reported to be assembling a high-bandwidth memory (HBM) design team in Silicon Valley, a move that would deepen its co-design work with major US chip customers. Analysts see it as evidence that HBM competition is shifting into a customized, jointly developed phase.

Samsung Electronics is gaining pricing power in its foundry business as AI and high-bandwidth memory (HBM) demand tightens advanced-node capacity, with its 4nm lines reportedly fully booked through 2027 and some customers being steered toward 5nm production.

China has reportedly delayed customs clearance for critical materials — including germanium, quartz-based materials and neodymium magnets — since 2025, lengthening delivery times for Taiwanese aerospace and optical suppliers and, in some cases, costing them orders.
Advanced Micro-Fabrication Equipment Inc. China (AMEC) posted a 300% surge in first-half 2026 profit and announced a CNY3.5 billion (US$520 million) capacity expansion, accelerating its shift from an etch specialist into a broader semiconductor equipment supplier.

One word in Marvell Technology's August 19 filing decides how the Google agreement should be read. The custom silicon programs, it says, attach to the tensor processing unit (TPU) ecosystem. Attach, not replace.

Jusung Engineering and PSK each lost more than 40% of their China revenue in 2025. The similarity ends there.

SICC reported stronger first-half 2026 revenue and margins as its 8-inch silicon carbide substrate business gained scale, highlighting how the industry's migration to larger wafers is beginning to reshape SiC economics across electric vehicles and AI power infrastructure.

Samsung Electronics will break ground in September on a KRW6 trillion (approx. US$4.31 billion) HBM production and advanced-packaging facility at its Onyang campus in Asan, South Korea, after the project cleared a provincial urban-planning review. The move advances a broader capacity buildout to meet growing AI memory demand.
Kenmec subsidiaries target SiC, AIDC growth
Aug 20, 10:50

Kenmec Group founder and president Frank Hsieh said on August 19 that two of the company's new businesses have taken shape, with Taisic Materials focusing on silicon carbide (SiC), a third-generation semiconductor material, and Kentec targeting the AI data center (AIDC) market. Both companies are expected to list on Taiwan's Emerging Stock Board in October 2026.

Shanghai Fudan Microelectronics Group reported a sharp first-half earnings increase in 2026, helped by stronger semiconductor demand, rising sales across its chip portfolio and investment gains, while tightening global FPGA supply is creating fresh opportunities for Chinese suppliers.
Tech leaders converged at the 2026 International Robotic Forum on August 19, where they laid out their visions for the evolution and next stages of physical AI. They noted that a robot's success does not lie simply in demonstrations or prototypes, but in whether it can function in real-world settings like factories, address safety concerns, and meet the needs of real customers.

The Gujarat government's approval of 12-hour work shifts at Micron Technology's Sanand assembly and test plant is more than just a single-factory ruling. It is the clearest sign yet that Indian states are willing to reshape decades-old labor rules to fit the round-the-clock demands of semiconductor manufacturing, as they compete for a slice of a global chip supply chain shifting away from China.