DIGITIMES Semiconductors news

May 20

Nvidia earnings set to beat again on AI rack boom

Supply chain optimism grows as Blackwell shipments ramp, Rubin approaches, and Intel CPUs re-enter the AI server spotlight.

ASML to deliver first High-NA chips within months despite cost concerns

May 20

China's top NAND flash chipmaker YMTC begins IPO tutoring with Chinese banks

May 20

Samsung braces for major strike after bonus talks collapse

May 20

AMD makes history with first overseas AI DevDay in Shanghai, targeting deeper China partnerships

May 20

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IC MANUFACTURINGUS targets Hua Hong's 7nm nodes while China targets South Korean partners to evade sanctions

May 21, 08:14

The US Department of Commerce (DOC) has reportedly issued "is-informed" letters to several major wafer fab equipment (WFE) manufacturers, ordering an immediate halt to tool shipments destined for Hua Hong Semiconductor, China's second-largest foundry. The restrictions specifically target two facilities within the Hua Hong Group, including its subsidiary Huali Microelectronics, which US officials believe are being positioned to scale China's most sophisticated logic nodes.

MEMORY CHIPSOSE targets AI server SMT growth as memory demand lifts outlook

May 21, 08:14

Orient Semiconductor Electronics (OSE) said that strong memory market demand is lifting its outlook and expanding its role in the memory supply chain, while also strengthening its importance in surface-mount technology (SMT) for AI server boards with major US clients.

IC MANUFACTURINGSMIC, Hua Hong form materials supply platform to cut China chip chain reliance on US

May 21, 08:14

China's semiconductor self-sufficiency drive has taken another step forward, with SMIC and Hua Hong Group jointly establishing Shanghai Electronic Materials International Supply Chain, in what market observers view as more than a conventional materials procurement platform.

IC DESIGN, DISTRIBUTIONFII challenges Broadcom and Nvidia as CPO race shifts to system integration

May 21, 08:14

As AI computing demand continues to grow exponentially, pressure to upgrade data center network architectures is intensifying. Co-packaged optics (CPO) is moving from concept to real-world deployment, and Foxconn Industrial Internet (FII) is quietly building a strong market position by leveraging its existing strengths in CPO all-optical switches as well as AI servers.

MEMORY CHIPSChina memory supplier Biwin's AI photonics funding raises questions about strategy and risk

May 21, 08:14

China's AI infrastructure race is entering a new phase, with industry focus shifting from raw computing power toward data transmission efficiency.

PASSIVE, PCB, OTHER IC COMPONENTSAI server demand tightens passive component supply, lifting Taiwanese suppliers' share

May 21, 08:13

Demand for artificial intelligence servers and related power systems is pushing lead times higher for high-end multilayer ceramic capacitors, elongated electrolytic capacitors, and hybrid aluminum electrolytic capacitors, distributor Nichidenbo has reported, with typical waits rising from around 1.5–2 months to 3–4 months and in some cases much longer.

PASSIVE, PCB, OTHER IC COMPONENTSTSMC's COUPE push puts Samsung's silicon photonics ambitions under pressure

May 21, 08:13

Samsung Electronics has launched silicon photonics foundry services and entered pilot production, signaling during its latest earnings call that optical communication modules will soon move to mass production — backed by aggressive investment. Yet compared with TSMC, which has already achieved breakthroughs in co-packaged optics (CPO) through Taiwan's well-established supply chain ecosystem, Samsung still has a long way to go.

IC DESIGN, DISTRIBUTIONNvidia revenue surges 85% as data center sales jump 92%

May 21, 07:16

May 20, Nvidia reported first-quarter fiscal 2027 revenue of US$81.6 billion, up 85% year over year and 20% sequentially. GAAP diluted EPS reached US$2.39, up 214% year-on-year, and non-GAAP EPS was US$1.87, up 140% year-on-year. Both topped consensus estimates, with revenue near US$79 billion and non-GAAP EPS of US$1.77, S&P Global Market Intelligence reported.

MEMORY CHIPSSamsung averts strike with last-minute labor deal, but deeper divisions remain

May 21, 07:13

With less than an hour remaining before a planned strike was set to begin, Samsung Electronics and its labor union reached a tentative agreement late on May 20, narrowly avoiding what industry observers estimated could have triggered supply-chain disruptions worth more than KRW100 trillion (US$66.8 billion).

IC DESIGN, DISTRIBUTIONAlibaba's T-Head doubles down on AI infrastructure with Zhenwu M890

May 20

Alibaba Cloud has unveiled the Zhenwu M890, a new proprietary AI training and inference chip developed by its semiconductor subsidiary T-Head Semiconductor, as the Chinese cloud group accelerates its push into full-stack AI infrastructure for the agentic AI era.

IC DESIGN, DISTRIBUTIONAmazon's AI chip push gains ground as Nvidia remains central to AWS

May 20

Amazon's yearslong push to build a credible alternative to Nvidia's AI chips is beginning to gain traction, as software improvements, tight GPU supply, and cost pressure prompt more developers to test the company's Trainium processors, according to The Information.

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