CONNECT WITH US
Jul 3, 12:46
How TSMC quietly turned its supply chain into a 'second fleet'

TSMC has accelerated efforts to localize its supply chain in recent years, using joint development, joint validation, and long-term partnerships to help Taiwanese equipment, materials, and chemical suppliers enter the advanced semiconductor supply chain. The move is steadily building a more resilient and complete local supply system, with both CoWoS and panel-level advanced packaging (CoPoS) now spawning a "second fleet."

Infineon China said on July 3 that it is pursuing legal remedies after several gallium nitride (GaN) products became the subject of a removal dispute at electronica Shanghai 2026, saying public accounts of the incident did not fully reflect the case's background or specific circumstances.

Apple is reportedly planning to launch at least five new models by this time next year, with the company expanding its foldables' production. Amid surging component prices and a weakening smartphone market, these moves may be a bid to gain market share while rivals are on the back foot.

China's memory price rally continues to gather momentum. Giantec Semiconductor Corporation, a Chinese NOR flash supplier, recently notified its distribution partners that prices for its entire NOR flash memory product portfolio will increase by 25% beginning July 6, 2026. The new pricing will apply to both newly signed orders and outstanding orders that have yet to be delivered.

With supply chain inventory normalization largely complete, Sonix Technology (Sonix) has seen business momentum recover. The MCU supplier is benefiting from resilient demand for microcontrollers used in medical monitoring devices and steady shipments of multimedia image-processing chips, giving it better order visibility for 2026 than in previous years. Meanwhile, the company's drone business has entered niche commercial and industrial applications, providing a stepping stone toward higher-end markets.
Japanese Prime Minister Sanae Takaichi held her first summit with Indian Prime Minister Narendra Modi in New Delhi on July 2, during a three-day visit that both governments framed as the next step in a long-running partnership.

China's AI chip sector has a heavyweight new entrant: veteran semiconductor figure Shaojun Wei has formally unveiled Shanghai Orient Computing Core Technology Co., a 3D AI compute chip startup now valued at CNY12.2 billion (approx. US$1.8 billion), just two years after it was founded.

Taiwanese power management IC (PMIC) design houses have been expanding into new applications and broadening their product portfolios in recent years, aiming to move beyond consumer electronics into higher-spec, more stable markets as the AI boom accelerates.

Samsung Group detailed plans on July 2 to invest KRW140 trillion (US$90 billion) in display panels, batteries, chips, and chip materials in South Korea's central Chungcheong region.

SK Hynix plans to invest KRW100 trillion (approx. US$64.38 billion) to build new NAND memory chip and advanced packaging facilities in Cheongju, betting that AI demand will keep tightening supply for storage and server memory.
Infineon has opened its new Smart Power Fab in Dresden ahead of schedule, adding capacity for chips used in AI data centers, electric vehicles, renewable energy, and industrial systems. The move expands Europe's semiconductor base, strengthens supply chains, and could affect technology markets far beyond Germany and the continent.
Kioxia has begun sample shipments of 1Tb triple-level-cell memory devices built with its 10th-generation BiCS FLASH 3D flash memory technology. The move underscores the race to supply higher-capacity, lower-power storage for AI systems, data centers, and enterprise customers worldwide as demand for advanced memory continues to rise.