AI GPUs, CPUs, and ASICs are driving demand for increasingly larger sizes and higher layer counts in substrate technology. The supply-demand gap for high-end ABF substrates continues to widen, and over the next three years, the industry is expected to enter a capacity expansion cycle.

As artificial intelligence chips increasingly migrate to advanced manufacturing nodes, the complexity — and duration — of semiconductor testing is rising sharply. That shift is fueling surging demand for Taiwan's test interface suppliers, whose businesses are climbing in tandem with the AI boom.

India's notification of a special economic zone in Dholera for the country's first chip fabrication plant marks a potential turning point in global semiconductor supply chains, promising a new manufacturing hub that could attract investment, create skilled jobs, and reduce import dependence — part of a broader international effort to diversify electronics production worldwide.

China semiconductor equipment maker Naura Technology delivered strong 2025 revenue growth on rising chip tool demand and domestic substitution, but weaker margins and intensifying competition signal a tougher next phase.

South Korean AI semiconductor startup DeepX has entered mass production and supply for its in-house neural processing unit (NPU), the DX-M1, as it seeks to scale revenue amid tightening wafer capacity and rising memory costs. The company said it has secured more than 30 purchase orders and is targeting US$40 million in revenue in 2026, supported by demand for low-power, cost-efficient AI chips.

As global research institutions downgrade their economic forecasts for 2026 in the wake of the joint US-Israel strikes on Iran, Taiwan has stood out as a rare exception to the worldwide downturn. Even with oil and natural gas prices surging amid shipping disruptions through the Strait of Hormuz, Taiwan's economy grew by 13.19% in the first quarter of 2026, following an impressive 8.68% growth in 2025. Meanwhile, consumer price index (CPI) inflation is expected to stay at a low 1.98%, thanks to government intervention.

Spanish optical inspection startup Wooptix officially unveiled its first inspection system, Phemet, in November 2025. The company stated that its first-generation prototype has already undergone testing and collaboration with European research institutions and major wafer manufacturers. Moving forward, the system will be further refined based on customer requirements.

Odisha broke ground on India's first advanced 3D chip packaging unit on April 19, 2026, a move that could reshape global semiconductor supply chains by adding high-end heterogeneous integration capacity in South Asia, attracting investment for aerospace, defense, artificial intelligence (AI), 5G, and data center applications, and creating jobs.

Printed circuit board (PCB) giant Zhen Ding Technology held a board meeting on April 17 and approved plans for its subsidiary, Leading Interconnect Semiconductor Technology (LIST), to apply for a listing on the Hong Kong Stock Exchange. The proposal will be submitted for review at the upcoming annual general meeting. The company stated that the move aims to unlock the standalone value of its high-growth business and strengthen the group's global competitiveness in core infrastructure in the artificial intelligence (AI) era.

SK Hynix has begun mass production of its 192GB SOCAMM2 memory module, marking a major step in the commercialization of next-generation low-power server DRAM designed for AI workloads, according to a company press release on April 20, 2026. Built on SK Hynix's 1-c nm (10nm-class sixth-generation) process and LPDDR5X technology, the module is positioned as a core memory solution for AI servers, particularly for training and inference of large language models.