Infineon COO Alexander Gorski told DIGITIMES in an exclusive interview at Semicon Taiwan 2026 that the current global chip shortage is unlike the one during Covid-19 and will take longer to resolve. He also discussed progress on Infineon's new Dresden plant, in-house manufacturing, outsourcing, and the company's global footprint.

Phison CEO K.S. Pua expects NAND Flash supply to remain tight into 2027 despite capacity expansion across major memory makers, arguing that forecasts of a rapid return to oversupply are "too naive."

DeepSeek is reportedly planning to purchase 160,000 Huawei chips for its large 1 GW data center currently under construction in the Chinese province of Inner Mongolia. This would make it among the largest clusters of Huawei chips deployed to date, as the Chinese authorities attempt to wean the country off Nvidia chips, but still struggle with insufficient domestic manufacturing capacity.

Micron Technology has scored a seventh favorable Patent Trial and Appeal Board (PTAB) outcome in its wide-ranging patent fight with China's Yangtze Memory Technologies (YMTC), while a separate set of challenges is moving through the US Patent and Trademark Office (USPTO) reexamination process.

Taiwanese companies are only at the start of a broader overseas investment cycle, as Washington signals possible new semiconductor tariffs and Taipei moves to deepen industrial links with Europe, Japan, and ASEAN. Officials say the island's chipmakers are responding to pressure from the US, while also broadening their global strategy to reduce risk and strengthen supply chains.

SK Hynix is accelerating its shift to sixth-generation 10nm-class 1c DRAM, with the process expected to account for roughly 34% of its DRAM production by the fourth quarter as the company prepares for HBM4E and seeks greater cost efficiency.

China's Naura Technology has demonstrated a selective etching process for 64-layer 3D DRAM structures, potentially giving domestic memory makers another route to raise transistor density while access to advanced EUV lithography remains restricted.

JM-Applied, a Taiwanese semiconductor gas equipment manufacturer and supply chain member for Micron and TSMC, said on September 4 that revenue in the first half of 2026 exceeded NT$600 million (approx. US$18.98 million), up more than 50% year-over-year. Growth was driven by the continued demand for artificial intelligence (AI) and high-performance computing (HPC), which is driving global semiconductor expansion and boosting demand for gas supply systems and equipment at wafer fabs.

India is selling its semiconductor build-out abroad as a hedge against an over-concentrated supply chain. The officials running it are unusually candid that the hedge cannot be built without the country it hedges against. Asked at a media briefing in Taipei on 4 September how New Delhi views the role of Chinese companies in India's chip and electronics supply chain, S. Krishnan, secretary of India's Ministry of Electronics and Information Technology, opened with a line that would be politically awkward in most capitals: "We need to be realistic."

Huawei is using measured data from its upcoming Kirin 2026 processor to challenge a key concern around vertically stacked logic: that higher transistor density inevitably brings more heat.

AI infrastructure and semiconductor supply chains led reader interest this week, from Taiwan's manufacturing recovery and Nexperia's legal battle to Sandisk's HBF, Micron's HBM expansion, and Marvell's silicon photonics roadmap. Samsung also refreshed its smartphone lineup with the Galaxy S26 FE. Below are the most-read DIGITIMES stories from the week of August 31-September 06, 2026.