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Jun 25
China specialty foundry Hua Hong Grace rides 40nm low-power process and Wuxi 12-inch ramp
Hua Hong Grace Semiconductor (HHGrace) is seeing gains from both process technology and capacity expansion, with industry research showing its 40nm ultra-low-power specialty process has entered stable mass production while its Wuxi 12-inch line continues to ramp.
AI-driven hyperscale data center expansion is pushing the global AI race beyond raw GPU computing power into a broader contest over high-speed interconnects and electro-optical integration. As Nvidia's next-generation AI factory moves toward petabyte (PB)-scale data transfers, co-packaged optics (CPO) is heading toward commercialization, lifting the importance of key components such as fiber array units (FAU) and external laser sources (ELS).

Samsung Group is expected to announce a domestic investment plan worth more than KRW1,000 trillion (approx. US$648 billion) on June 29, when South Korean President Lee Jae-myung chairs a public briefing at the presidential office in Seoul on what his administration is calling the country's "three mega-projects for a great leap forward," Maeil Business Newspaper reported.

The global memory market is facing a structural supply-demand imbalance that shows little sign of easing. Micron's stronger-than-expected quarterly results have drawn fresh attention from investors and the technology industry, while the broader supply picture remains tight.

US-based automated test equipment supplier Teradyne plans to expand its presence in India and has appointed Alpa Sood as India Manager, as the company seeks to deepen engagement in a semiconductor ecosystem moving toward manufacturing scale.
Corning weighs South Korea site as chip packaging race turns to glass
Jun 26, 11:54

Corning is studying South Korea as a possible manufacturing base for semiconductor glass substrates, a sign that the US specialty glass and optical materials maker is looking to extend its AI exposure beyond data-center connectivity into advanced chip packaging.

Academia Sinica has built a 20-qubit quantum chip from scratch, and the team now says the next phase is less about lab breakthroughs and more about engineering a scalable, reproducible manufacturing system. Chii-Dong Chen, executive director of Academia Sinica's Center for Quantum Computer, says Taiwan's quantum chip effort is moving into that engineering battleground.
Apple raised prices across its Mac and iPad lineup on June 25, and the timing wasn't a choice so much as a deadline.

SK Hynix is racing to complete the first cleanroom at its massive Yongin Semiconductor Cluster in Gyeonggi Province, South Korea, by February 2027, ahead of rival capacity expansion timelines. The site's first fabrication facility will break from conventional flat-floor layouts, stacking production floors three levels high in a pioneering triple-deck fab design.

Apple is preparing its biggest shift yet to the release strategy for its in-house Mac processors, opting to skip high-end M6 Pro and M6 Max chips and instead bring more powerful AI-focused M7 Pro and M7 Max processors to market in 2027, according to a Bloomberg report citing people familiar with the matter.
Academia Sinica's Center for Quantum Computer is focusing only on hardware, not algorithms or applications, and executive director Chii-Dong Chen said that approach is similar to the mission Taiwan's government gave ITRI in the early days of the foundry industry. He said Taiwan enjoys a strong advantage in quantum chip manufacturing, but turning the new Quantum Chip Fabrication Space (QC-Fab) into a technology transfer model for private companies will still require regulatory easing.

Before the price hikes became official, Apple had already warned investors that soaring memory costs would increasingly pressure margins. The company has now followed through on one of the rarest moves in its history: raising prices across much of its Mac, iPad, home device, and Vision Pro lineup to offset an AI-driven surge in memory and storage costs.