DIGITIMES Semiconductors news

Oct 30

STATS ChipPAC CTO: Scaling innovation defines AI and HPC's next era

IK Shim, Chief Technology Officer of STATS ChipPAC, opened the 2025 Advanced Packaging Developers Conference (APDC) with a clear message: the semiconductor industry's greatest challenge is no longer invention itself, but turning invention into a manufacturable, scalable reality.

Taiwan approves funding for local IC design houses to advance AI and chip innovation

Oct 30

Samsung 3Q25 marks the reset of the global memory hierarchy

Oct 30

China's 15th Five-Year tech doctrine to tilt global industry balance

Oct 30

Nexperia's export ban sparks Brazil auto shutdown fears

Oct 30

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IC MANUFACTURINGLam Research ramps up ultra-low temperature etching for next-generation 1,000-layer NAND

Oct 31, 10:59

As demand for cloud and edge AI accelerates, high-capacity storage is becoming increasingly critical. Lam Research has announced stable mass production of its next-generation ultra-low temperature etching equipment, Cryo 3.0, designed to improve aspect ratio, profile consistency, and throughput of 3D NAND channel holes in preparation for the upcoming 1,000-layer NAND era around 2030.

IC MANUFACTURINGSamsung Foundry rebounds on Tesla, Qualcomm orders

Oct 31, 09:42

Samsung Electronics' foundry unit has recently secured major customer orders, signaling a recovery in progress. With clients like Tesla and Qualcomm joining, the company appears poised to move into a full rebound phase.

IC MANUFACTURINGCommentary: Trump–Xi talks cool tempers, not conflicts, in chips and rare earths

Oct 31, 06:46

On 30 October 2025, Donald Trump and Xi Jinping met in Busan, South Korea, in a summit that could redefine the global trade and technology order. It marked their first meeting since Trump's return to the White House and their second in six years, a long-awaited rematch that drew worldwide attention.

IC MANUFACTURINGRenesas reports significant profit decline and warns of potential inventory risks with Nexperia dispute

Oct 31, 06:45

Japanese semiconductor manufacturer Renesas Electronics has disclosed a challenging beginning to 2025, revealing a decline in revenue and a sharp drop in profitability for the first nine months of the year. The company expressed concerns that the ongoing Nexperia dispute may cause customers to stockpile excess semiconductor inventories, potentially disrupting market stability in early 2026.

PASSIVE, PCB, OTHER IC COMPONENTSWhat India's latest PCB drive means for its semiconductor supply chain growth

Oct 31, 06:45

India's newly approved multilayer and high-density interconnect (HDI) printed circuit board (PCB) projects mark a crucial upstream shift in the country's electronics manufacturing ecosystem, one that analysts say could strengthen India's long-term semiconductor packaging and OSAT ambitions.

MEMORY CHIPSTrump concludes Asia tour with rare earth and tech deals

Oct 30

US President Donald Trump has ended his six-day trip to Asia.

IC MANUFACTURINGUMC reports Q3 gains as specialty and 22nm platforms boost growth

Oct 30

Benefiting from increased wafer shipments and higher capacity utilization, United Microelectronics Corporation (UMC) reported its most profitable quarter in nearly two years for the third quarter of 2025.

MEMORY CHIPSMXIC chair vows comeback after ninth straight quarterly loss

Oct 30

Memory chipmaker MXIC reported a net loss of NT$862 million (US$28.1 million) in the third quarter of 2025, marking its ninth consecutive quarterly deficit. Chairman Miin Wu candidly expressed disappointment over the results and apologized to investors, announcing he will return to frontline management starting November 2025 to lead R&D and align products with market demand, aiming for a turnaround within a year.

IC MANUFACTURINGAMEC reports 46% sales jump on strong etching, thin-film tool momentum

Oct 30

Chinese semiconductor equipment maker Advanced Micro-Fabrication Equipment (AMEC) reported strong growth in the first three quarters of 2025, driven by surging demand for its etching and thin-film deposition equipment used in advanced logic and memory chip production.

IC MANUFACTURINGSingapore leverages advanced packaging to capture share of US$1 trillion chip market

Oct 30

Terence Gan, Executive Director of Singapore's Institute of Microelectronics (IME), delivered a confident address at the 2025 Advanced Packaging Developers Conference (APDC), unveiling Singapore's ambition to become a global center for advanced semiconductor packaging research and commercialization as artificial intelligence reshapes the industry.

IC MANUFACTURINGSTATS ChipPAC targets 600mm panel-level packaging in roadmap for next-generation AI chips

Oct 30

Dr. Nokibul Islam, Senior Director at STATS ChipPAC, presented the company's advanced packaging technology roadmap at the 2025 Advanced Packaging Developers Conference (APDC), identifying advanced packaging as one of the fastest-growing areas in the semiconductor industry.

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