Chinese advanced packaging provider SJ Semiconductor (SJSemi) has expanded its silicon-interposer-based 2.5D packaging platform to 3.3 times the standard reticle size, enabling denser integration of multiple dies and high-bandwidth memory for AI chips and high-performance computing (HPC).

Unimicron chairman SC Chien said the company is working to ease the tightening shortage of AI substrates as MediaTek seeks capacity support for the next three years, during a public appearance at Semicon Taiwan 2026. Chien appeared alongside ASE Technology CEO Tien Wu, TSMC senior vice president and deputy co-chief operating officer Cliff Hou, MediaTek CEO Rick Tsai and Foxconn chairman Young Liu.

Shanghai UniVista Industrial Software Group has launched an Agentic EDA framework, a native 3DIC physical-design tool and an advanced-process closure platform, expanding China's domestic toolchain for chip verification, 3D integration and digital back-end design.

South Korean prosecutors allege that Chinese memory maker ChangXin Memory Technologies (CXMT) set up an internal "Hefei Project" in 2016 to obtain Samsung Electronics' core DRAM technology and recruit its engineers, with phased goals laid out in advance.

Broadcom used its third-quarter fiscal 2026 earnings call on September 2 to convert a quarter-by-quarter AI story into a dated, customer-by-customer deployment schedule running into fiscal 2029. Chief executive Hock Tan told analysts that across the company's six XPU customers there is demand for 30GW of accelerated compute in fiscal 2027 and 2028 combined, and that Broadcom expects to ship "US$350 billion of AI semiconductors to these customers in the next two years." He was explicit that not all 30GW will come online inside those two fiscal years — "we judge it conservatively to be somewhat less" — and that the revenue figures, not the gigawatt figures, are the commitment.

US Commerce Secretary Howard Lutnick has confirmed that the Trump administration is preparing a new round of semiconductor tariffs built around an exemption for companies that manufacture in the US — a design that shifts foreign chipmakers' tariff exposure away from what they ship and onto how much they are willing to spend on American fabs. For Taiwan's suppliers, already committed under a bilateral trade deal, the question is no longer whether tariffs arrive but how large a US footprint buys a company out of them.

Broadcom's third quarter, ended August 2, 2026, is the point at which custom AI silicon stopped being an adjacent product line and became the shape of the company. Revenue reached US$29.6 billion, up 86% from a year earlier and 33% from the previous quarter. AI semiconductor revenue of US$16.7 billion — up 221% year on year, and 54% sequentially — is now larger than everything Broadcom billed, across every product and both segments, in the same quarter of 2025.

At the Semicon Network Summit 2026, speakers from Marvell, the Netherlands Organisation for Applied Scientific Research's Holst Centre, the UK Semiconductor Centre, and the Taiwan Semiconductor Industry Association (TSIA) discussed the future of silicon photonics (SiPh). They said the industry's bottlenecks have shifted from materials to packaging precision, materials platform selection, and the manufacturing tools needed to support both.

Samsung Electro-Mechanics (SEMCO) is set to expand the scope of its price increases, with market reports saying the company will raise direct-supply prices for multilayer ceramic capacitors (MLCCs) sold to OEMs and ODMs in the fourth quarter of 2026, while ABF substrate prices are also climbing. With supply constrained and demand for AI servers strong, further price increases are likely in the near term.

SK Hynix boosted its silicon wafer purchases in the second quarter of 2026 by more than doubling spending from the previous quarter as it moved early to secure raw materials amid rising wafer prices and surging AI demand. The increase drew more attention than Samsung Electronics' modest rise over the same period.

Samsung Electronics is set to install 1,612 brand-new critical semiconductor back-end processing tools manufactured in South Korea at its factory under construction in Vietnam's Thai Nguyen province. Industry analysts say the move shows Samsung is accelerating efforts to turn Vietnam into a major semiconductor back-end manufacturing base.