VisionPower Semiconductor Manufacturing Company (VSMC), the joint venture between Vanguard International Semiconductor (VIS) and NXP Semiconductors, opened its 12-inch wafer fab in Tampines, Singapore, on September 28.

China's largest dynamic random-access memory (DRAM) maker ChangXin Memory Technologies (CXMT) is accelerating a CNY34.9 billion (US$5.2 billion) expansion aimed at chipmaking equipment, in-house testing and tighter control of its memory supply chain.

Global Foundry 2.0 market revenue reached a record US$96.6 billion in the second quarter of 2026, up 25% year-over-year and 11% sequentially, as semiconductor demand tied to data-center expansion spread beyond leading-edge processors into networking, power management, mature-node chips, packaging and test.

India's chip push is drawing the materials layer of the supply chain onshore. With Tata Electronics' Dholera fab and a cluster of packaging plants in Sanand under way, suppliers of industrial gases, wet chemicals, and photoresists from the US, Japan, and South Korea are moving to secure positions close to their future customers in Gujarat.

CXMT's continued DRAM capacity expansion is coinciding with stronger demand from China's domestic memory sector.

Samsung Electronics expects high-performance computing (HPC) to account for 66% of its foundry business by 2029, up from 28% currently, as the company shifts its contract chipmaking portfolio beyond mobile products toward AI and HPC.

India has barred semiconductor projects approved under its Semicon 2.0 program from selling, disposing of, or mortgaging project assets until commercial production of the entire project is declared, according to guidelines issued on September 17, 2026. The rules attach lock-in conditions on assets, operations, and ownership to the INR1.27 trillion (US$13.22 billion) incentive scheme.

Advanced Micro Devices (AMD) CEO Lisa Su is reportedly set to visit South Korea again in October 2026, after her March 2026 trip, which formally launched next-generation AI memory cooperation with Samsung Electronics. The planned visit is expected to broaden that push, with meetings lined up with South Korean AI chip companies and government officials as AMD deepens its AI semiconductor alliance in the country.

TSMC is reportedly evaluating whether to build a second US manufacturing hub in Texas, potentially housing up to 6 advanced wafer fabs, as its US footprint continues to expand. The move follows the company's establishment of a massive semiconductor cluster in Arizona, which encompasses 12 fabs, advanced packaging facilities, and an R&D center.

TDK and Taiyo Yuden have signed a memorandum of understanding to begin discussions on a business alliance to develop electronic components, including MLCCs and inductors jointly, the two Japanese companies announced on September 29, 2026. The talks will also cover cooperation in manufacturing and procurement, and the companies will consider a future capital alliance.

Taiwan-based chemical manufacturer Grand Pacific Petrochemical (GPPC) is optimizing its core business while actively expanding into high-tech and semiconductor materials-related industries, amid high oil prices and the reshaping of global trade flows. Company president Chia-hsiung Tseng stated that its strategic partnership with Japan-based industrial gas company Air Water (AWI) is a key move to connect GPPC to the semiconductor materials supply chain.