MediaTek has introduced its new Dimensity 8400 SoC series for light flagship smartphones, with Redmi being the first to release a model featuring this processor.
Despite the recent military maneuvers by China's navy and coast guard that threaten Taiwan's security, as well as challenges within China such as a struggling real estate market, US technological sanctions, and supply chain restructuring, the Mainland Affairs Council reports that cross-strait trade is steadily recovering.
The US trade deficit with Taiwan is projected to grow to US$59 billion in 2024, an increase only ranking behind Mexico and Vietnam. However, although US President-elect Donald Trump is now certain to target trade with Mexico, Taiwan should remain safe from restrictions for a number of reasons.
ChangXin Memory Technologies (CXMT), China's leading DRAM manufacturer, has reportedly begun mass production of DDR5 memory, according to market sources.
Nan Ya PCB, one of Taiwan's top trio of substrate manufacturers, has capitalized on a strategic opportunity in the latter half of 2024 by launching new high-end substrate products to drive its business transformation and capture a share of the burgeoning AI and high-performance computing (HPC) markets. The company forecasts double-digit revenue growth by 2025.
US President Joe Biden's administration is launching an investigation that will offer President-elect Donald Trump a choice about whether to enact new tariffs on Chinese-made semiconductor chips.
Amid intense competition from Chinese suppliers and a maturing consumer electronics market, Taiwan-based panel provider Innolux is pursuing transformation through its "More than Panel" strategy. The company is exploring advanced semiconductor packaging and maintains cautious optimism about Fan-Out Panel Level Packaging (FOPLP) while acknowledging the inherent challenges.
Lam Research has introduced Dextro, which the company claims is the semiconductor industry's first collaborative robot (cobot) designed to optimize critical maintenance tasks on wafer fabrication equipment. Currently deployed in multiple advanced wafer fabs around the world, Dextro enables accurate, high-precision maintenance to minimize tool downtime and production variability, while driving significant first-time-right (FTR) results that can enhance yield.
The Industrial Technology Research Institute (ITRI) has partnered with microcontroller unit (MCU) manufacturer Generalplus to develop a wireless oral sensing capsule for medical inspection services. This collaboration combines innovative 3D IC packaging technology with Generalplus MCU chips, demonstrating heterogeneous integration and advanced packaging technologies' potential in healthcare while enabling the rapid development of multifunctional sensors.
The year 2024 marks a pivotal shift in the silicon carbide (SiC) industry, as unprecedented production increases by Chinese manufacturers transform the global supply chain. This critical compound semiconductor material, once valued for its scarcity, has become a double-edged sword causing ripples throughout the sector.
TSMC introduced "Wafer Manufacturing 2.0" in July 2024, integrating packaging, testing, and photomask production into its portfolio. This move underscores a seismic shift in the advanced packaging supply chain, driven by fresh investments from OSAT providers, IDMs, and new entrants that are disrupting traditional roles.
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