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Jun 11
Commentary: TSMC's pricing power stays intact as AI demand keeps fabs full
Market chatter about TSMC has intensified, with reports that its advanced process and packaging prices will rise again in the second half of 2026 and 2027, while some Google TPU production could shift to Intel, and some AMD products could be made by Samsung Electronics. TSMC CFO Wendell Huang recently told the media that global inflation and overseas fab expansion have indeed pushed up operating costs, adding that TSMC does not rule out moderate price adjustments. Those comments have drawn close attention across the industry.

Breaking the inference barrier requires a rethink of the whole system architecture, not just faster compute. This was the key takeaway from a recent panel discussion at SuperAI Singapore, which brought chip makers and an AI model accelerator together to address how to overcome inference bottlenecks at a time when compute workloads are hitting up against physical limits.

Power semiconductors are taking on a central role as AI data centers move from 800V high-voltage input down through multiple power-conversion stages to the ultra-low voltages used by chips. After the post-pandemic inventory correction, industry players say power semiconductors have shifted "from a supporting role to the lead" under the new AI high-voltage direct current (HVDC) power architecture.
Chinese PC major Lenovo is reportedly set to raise prices across its entire product line from July 2026, with increases broadly in line with its first round of adjustments in March. Retail prices for some models could rise by as much as CNY1,000 (approx. US$148).

DDR4 memory supply remains tight, with the shortage affecting buyers worldwide, from cloud and server operators to industrial and networking customers. Sources indicate that Nanya Technology's limited third-quarter 2026 capacity has led major shareholders and customers to secure output, pushing contract prices higher and making further gains increasingly likely.

Amkor Technology Korea is considering investing about KRW1 trillion (approx. US$650 million) to expand its chip packaging and testing facilities in the South Korean city of Gwangju, according to Korean media reports and city officials. The company has not officially announced the plan.

Applied Materials is expanding manufacturing and research in Singapore as artificial intelligence (AI) drives a wider shift in semiconductor planning, supply chains, and investment. The move highlights how AI demand is influencing chipmakers, equipment suppliers, and global customers, with implications for production capacity, regional innovation hubs, and technology markets worldwide.
AI infrastructure demand is lifting high-end PCB orders, but fresh bottlenecks are emerging in the upstream copper-clad laminate (CCL) supply chain. T-glass glass fiber cloth remains tight after disrupting the high-end ABF substrate market. HVLP4 copper foil is set to become the next constraint in the second half of 2026.
Taiwan's export growth has accelerated to its strongest pace in nearly 16 years on the back of AI and higher prices for electronic components, drawing large amounts of capital into the stock market and other asset markets. Central bank governor Chin-Long Yang said on June 10 that Taiwan remains far from systemic risk despite concerns over surging market activity.

Congressional Republicans are urging stronger exclusion orders in the ongoing Section 337 investigation tied to TSMC's advanced-node chips, while the company reiterates compliance with local laws and highlights ongoing legal uncertainty in its quarterly filing.

Concerns have emerged in recent weeks that the commercialization of co-packaged optics (CPO), a technology widely viewed as the future of AI networking, could face further delays as manufacturing yields remain inconsistent.

Montage Technology has begun sampling its sixth-generation DDR5 registering clock driver chip (RCD06) to customers, marking a step forward in the performance upgrade of next-generation server memory platforms.