Samsung Electronics has reportedly pushed the production yield of its sixth-generation high-bandwidth memory (HBM4) close to 80%, marking a sharp improvement from the start of mass production as competition with SK Hynix increasingly shifts toward production capacity and supply stability.
Chinese AI GPU developer Moore Threads is preparing a Hong Kong listing after first-half revenue jumped 147.42% year on year to CNY1.74 billion (approx. US$258 million), supported by stronger AI infrastructure demand and faster commercialization of its computing platforms. Its net loss narrowed 95.73% to CNY11.56 million, from CNY271 million a year earlier.
Apple has tested DRAM from China's ChangXin Memory Technologies in iPhone and MacBook products as AI-driven memory shortages and rising prices strain global supply, according to reports. The testing has also drawn bipartisan pressure from US lawmakers, who are urging the Commerce Department and Apple leadership to tighten restrictions on Chinese suppliers.
SK Hynix is facing an expanding US patent dispute with MonolithIC 3D. A second US International Trade Commission (USITC) investigation covers high-bandwidth memory (HBM) and 3D NAND products, alongside parallel litigation in federal court.
The US signed a presidential proclamation on August 6 (ET) imposing a 15% tariff on polysilicon and related products from all countries, with the new measures set to take effect on December 4, 2026. Taiwan's Executive Yuan said the decision was expected to have limited impact on the island's solar sector and highlighted exemptions available to semiconductor-related firms with US investments.
The Seoul High Court has upheld an 18-month prison sentence for a former SK Hynix employee who leaked trade secrets tied to CMOS image sensor (CIS) technology to Chinese companies while seeking new employment, including with Huawei chip unit HiSilicon.
