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Aug 3
Intel offers bonuses to speed up Ohio fab construction and reaches EMIB-T yields of 90%
Intel is awarding bonuses for overtime work as it seeks to complete the construction of its Ohio fab complex by 2031. Meanwhile, the company has made progress on the development of its next-generation packaging technology, embedded multi-die interconnect bridge-through-silicon via (EMIB-T), positioning it to compete with TSMC.

Onsemi's leadership fielded a wide range of investor questions following the company's second-quarter 2026 results, with much of the discussion centered on its accelerating AI data center business, capacity utilization, and how the company is managing rising input costs.

Samsung Electro-Mechanics (SEMCO) is reportedly pulling forward the start-up of its first overseas multilayer ceramic capacitor (MLCC) plant, a move that underscores how an AI-driven scramble for the tiny components is reshaping pricing and investment across the industry.

China has revised its regulations on the protection of integrated circuit (IC) layout designs, introducing stricter registration requirements, stronger enforcement measures and clearer commercialization rules as Beijing steps up efforts to strengthen its domestic semiconductor industry amid ongoing US technology restrictions.

TSMC has announced that Japan Advanced Semiconductor Manufacturing (JASM), its subsidiary in Kikuyo, Kumamoto Prefecture, has resumed normal operations following production disruptions caused by the recent Kumamoto earthquake.

China's leading DRAM maker ChangXin Memory Technologies (CXMT) is considering building a second 12-inch memory chip fabrication plant in Beijing's Yizhuang district while holding early-stage financing talks with entities backed by the Beijing municipal government, according to a Reuters report. The proposed project would further expand the company's manufacturing footprint as AI-driven demand continues to tighten global memory supply.

Taiwan-based specialty chemicals supplier Johnson Fine Chemical expects robust growth in electronic materials demand driven by AI, high-performance computing (HPC) and advanced communications applications. The company is expanding production capacity in both Taiwan and China and plans to raise prices for selected products by 10-20% in the third quarter of 2026 to offset higher raw material costs. Management forecasts revenue growth of about 20% in 2026 from a year earlier, with profits also expected to increase, while 2027 is projected to deliver even stronger results.
Kinsus boosts spending as global IC substrate supply stays tight
Aug 4, 11:11
Kinsus said stronger second-quarter results and fresh capital spending reflect continued strain in the global IC substrate market, where demand from AI, CPU, GPU, and ASIC customers is keeping capacity tight. For global readers, the company's expansion plan points to prolonged supply constraints and firmer pricing ahead.
Cooperation between Taiwan and Japan in semiconductors will go beyond supply-chain partnerships towards joint technological innovation and talent development, according to Taiwan's former Minister of Economic Affairs Jyh-huei Kuo.

Memory module maker Team Group posted record profit in the first half of 2026, as surging demand and a persistent DRAM supply-demand gap lifted earnings to all-time highs.

Taiwanese research institute Chung-Hua Institution for Economic Research (CIER) released Taiwan's manufacturing purchasing managers' index (PMI) for July 2026 on August 3. The seasonally adjusted PMI rose 0.8pp to 61.5%, marking the tenth consecutive month of growth and the fastest pace of expansion since September 2021. The six-month outlook index also edged up 0.3pp to 64.5%, remaining above the 60.0% expansion threshold for a seventh consecutive month.
The question of where the limits of cloud AI high-speed interconnects will fall has been a major market focus over the past six months. MediaTek addressed the issue for the first time in its 2026 second-quarter earnings call, saying its work on the more advanced SerDes 448G specification is roughly halfway complete.