SK Hynix has started global shipments of a next-generation compact SSD designed for AI-driven personal computers, a move that could reshape storage choices for device makers and end users worldwide. The cSSD promises higher capacity and improved efficiency to meet growing demand for AI PC storage.
Prices for gallium arsenide (GaA) substrates — a key material used in power amplifiers for wireless communications — are rising, driven by surging costs for gallium, a critical upstream metal. After months of sustained increases in raw material prices, industry executives say a reversal appears unlikely.
Compared to short-term geopolitical turbulence, the AI megatrend represents a once-in-a-generation business opportunity. In the past, TSMC often took the lead during earnings season in releasing industry outlooks. This time, ASML will hold its earnings call for the first quarter of 2026 a day earlier on April 15, and is expected to outline how memory manufacturers and new large-scale logic foundries will reshape the semiconductor manufacturing landscape.
Broadcom recently announced two major partnership developments. The first is with Google on its Tensor Processing Unit (TPU) application-specific integrated circuits (ASICs), with the collaboration set to extend through 2031. This means that Broadcom will continue to generate related revenue from multiple future generations of Google's TPU products.
Industry sources reveal that polarizer manufacturers are preparing a price hike starting in the second quarter of 2026, with increases beginning at 10%, though final approval remains pending. This is because the escalating conflict in Iran has heightened risks to the Middle East energy supply chain, driving up crude oil prices and pushing costs higher for upstream polarizer materials such as PET, adhesives, and plastics.
Intel's industrial ecosystem is converging on a vertically integrated chip model, as Intel joins the Terafab project led by SpaceX, xAI, and Tesla—marking both a revival of the IDM approach and a potential turning point in Intel's turnaround strategy.
The global AI race is no longer just about who builds the fastest chip. Increasingly, it is about who writes the rules.
Indium phosphide (InP), a critical material for long-distance optical communication, has become essential for AI-driven high-speed data transmission. However, China's export restrictions have triggered a shortage of InP substrates, creating a bottleneck in manufacturers' capacity expansion worldwide. The supply chain acknowledges that due to China's export curbs and the technical challenges of producing InP substrates, major international players remain cautious about increasing investments. The timeline for resolving this shortage remains uncertain.
Arm recently unveiled its first self-developed AGI CPU, marking a significant milestone as the company shifts from a pure technology IP licensor to a standard CPU supplier competing directly with Advanced Micro Devices (AMD), Ampere, and Intel.
India-based fabless startup IndieSemiC is betting that its new OSAT partnership with Kaynes Semicon can help it move from RF modules into vertically integrated chip products. However, the company acknowledged that the headline volume tied to the collaboration is still based on expected customer adoption rather than firm orders.
French quantum chip startup Quobly has continued to report progress while expanding its partnership network. The company has set up a new presence in Canada and gained recognition at the American Physical Society meeting, where it was identified as a potential key player in the emerging quantum computing era.
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