DIGITIMES Semiconductors news

Mar 26

Arm's self-developed chip sparks cross-industry clash, TSMC-backed GUC faces impact

Arm has officially unveiled its first fully self-designed physical chip, the Arm AGI CPU, targeting data center mass production. The announcement came at the Arm Everywhere conference in San Francisco, sending shockwaves through an already fiercely competitive AI chip market.

SEMICON China opens with focus on AI chips and advanced packaging

Mar 26

Samsung and SK Hynix boost China factory investments in 2025 amid memory demand surge

Mar 26

Nanya Technology secures major private placement with Kioxia, Sandisk

Mar 26

Analysis: Tesla's Terafab being near Samsung's Taylor fab illustrates Musk's strategy shift

Mar 26

MORE NEWS

IC DESIGN, DISTRIBUTIONUS advances chip tracking mandate after US$2.5B smuggling case exposes export gaps

Mar 27, 11:40

In a rare show of bipartisan unity, a key US congressional committee voted 42-0 on Thursday to advance the Chip Security Act (CSA). The bill marks one of the most aggressive efforts yet to embed national security directly into the semiconductor supply chain, shifting export compliance from paperwork to hardware-level monitoring.

MEMORY CHIPSAdata secures NT$12B syndicated loan to drive expansion, debuts Trusta for edge AI infrastructure

Mar 27, 11:39

Taiwan's memory module giant Adata Technology has secured a NT$12 billion (US$375 million) syndicated loan led by Bank of Taiwan, strengthening its mid-term working capital while advancing its expansion into enterprise AI infrastructure.

PASSIVE, PCB, OTHER IC COMPONENTSEikei targets automotive and AI markets, establishes Slovakia subsidiary

Mar 27, 11:14

Automotive printed circuit board (PCB) manufacturer Eikei Group announced plans to establish a subsidiary in Slovakia, aiming to diversify geopolitical risks across its three major markets in Europe, the Americas, and Asia in 2026. Company chairman Shih-lin Liu added that the rapid growth momentum of artificial intelligence (AI) servers is expected to drive profitability higher.

IC MANUFACTURINGAir Liquide launches first advanced materials plant in Taiwan for sub-3nm chips

Mar 27, 11:10

Paris-headquartered Air Liquide has inaugurated a new advanced materials plant in Taichung, marking its first large-scale production base in Taiwan for deposition and etching materials. The facility is designed to meet rising demand from the island's semiconductor ecosystem and support next-generation chips for AI and high-performance computing (HPC), reinforcing the company's strategic expansion in Asia.

IC MANUFACTURINGAI drives semiconductor market to US$1.8 trillion by 2030, China leads capacity and equipment

Mar 27, 10:52

AI computing is pushing the semiconductor industry into a structural growth phase, reshaping global capacity and technology pathways, according to Lily Feng, President of SEMI China, and Benjamin Loh, chairman of Comet AG and vice chair of the SEMI International board, at SEMICON China 2026.

MEMORY CHIPSSK Hynix keeps HBM shipments steady, targets HBM4E sample this year

Mar 27, 10:22

SK Hynix expects stable growth in its high-bandwidth memory (HBM) business this year and plans to keep shipments in line with initial projections as it advances its next-generation roadmap amid evolving market conditions.

MEMORY CHIPSDRAM and NAND costs hit 90% of smartphone prices, squeezing low-end profits

Mar 27, 09:45

Core component costs for smartphones are surging at unprecedented rates, threatening the survival of low-priced models in the market. Nikkei reports that prices for two essential memory types—DRAM (mainly LPDDR) and NAND flash—are soaring faster than ever before.

IC MANUFACTURINGTSMC prioritises AI, core clients; 3nm capacity remains constrained

Mar 27, 09:43

Cloud AI demand is tightening advanced-node supply, with TSMC's 3nm capacity emerging as the most constrained segment at the end of the first quarter of 2026, according to IC design houses.

MEMORY CHIPSSamsung and SK Hynix expand microscope procurement to boost HBM yield

Mar 27, 07:39

As AI compute demand surges, the rising need for high-bandwidth memory (HBM) testing and failure analysis is reshaping semiconductor inspection equipment markets, affecting chipmakers, foundries, and equipment suppliers worldwide. Demand for integrated microscopy platforms and localised service hubs is increasing to control yield, reduce costly iterations, and secure AI supply-chain positions.

IC MANUFACTURINGSemicon China 2026: AI efficiency fuels demand growth under Jevons paradox, AMD warns

Mar 27, 07:38

At SEMICON China 2026, AMD VP and Head of Corporate Strategy and Partnerships Mario Morales delivered a stark warning: while the AI market is rapidly expanding toward a projected US$1.7 trillion valuation, the ultimate constraint may not be silicon capability — but electricity.

MEMORY CHIPSMicron inaugurates Tongluo site, targets fiscal 2028 DRAM, HBM output

Mar 27, 07:38

Micron Technology, on March 26, held an inauguration ceremony for its Tongluo site in Miaoli County, marking a milestone following the acquisition of a facility previously owned by Powerchip Semiconductor Manufacturing Corporation (PSMC).

More coverage

Lumotive makes optical breakthrough, targets 10,000-port data centers

As Nvidia and Coherent signal a shift toward all-optical networking to solve the AI power crisis, Redmond-based Lumotive has announced a milestone that could redefine data center scalability. In an interview with DIGITIMES Asia, Gleb Akselrod, Co-founder and CTO of Lumotive, detailed the success of the world's first programmable 2D optical beamforming chip.

SPECIAL REPORTS