The European Commission has unveiled a comprehensive Technology Sovereignty Package aimed at strengthening Europe's capabilities in semiconductors, AI, cloud infrastructure, open-source software, and digital energy systems.

Huawei's recently proposed "Tau Law" suggests that reducing signal transmission distance, combined with heterogeneous integration and system-level optimisation, can enhance computing power and energy efficiency. The concept is increasingly seen as a key route for China to extend AI chip performance in the post-Moore's Law era.

China's silicon carbide (SiC) substrate manufacturers continue to slash prices despite already operating on razor-thin margins, underscoring the intensity of a price war reshaping the global compound semiconductor industry.

At Computex 2026, much of the spotlight fell on the rapid evolution of AI data center infrastructure. Among the technologies drawing renewed attention was silicon carbide (SiC), a compound semiconductor material whose ability to handle high voltages and large currents has made it a critical enabler of the industry's shift toward 800-volt high-voltage direct current (HVDC) power systems.

SK Group Chairman Chey Tae-won met TSMC Chairman C.C. Wei in Taiwan on June 3, as the two sides exchanged views on the latest trends in next-generation AI technologies and discussed how to shape the future of the AI ecosystem. The meeting underscored closer ties between the two companies, which plan further to strengthen cooperation in next-generation HBM and advanced packaging.

Surging demand for artificial intelligence computing has accelerated the buildout of data centers, pushing system cooling closer to its limits. As power consumption rises, heat-related slowdowns are becoming a growing bottleneck for both computing performance and data-transfer efficiency.

At the earnings call on June 3, Broadcom said its AI semiconductor business continued to accelerate in the fiscal second quarter, with revenue reaching a record US$10.8 billion, up 143% from a year earlier, and bookings exceeding US$30 billion. CEO Hock Tan said demand for custom accelerators and networking remained "simply insatiable," adding that the company expects AI semiconductor revenue to double in the second half of fiscal 2026 from the first half.

Broadcom said its AI semiconductor business remained in an "insatiable" demand environment on its second quarter of fiscal 2026 earnings call on June 3, as it outlined progress with its six core customers, including Google, OpenAI, Meta, Anthropic, and Apollo-backed programs. Chief Executive Hock Tan said the company's AI semiconductor revenue reached a record US$10.8 billion in the quarter, up 143% year on year, and added that networking made up almost 40% of AI revenue. He also said bookings topped US$30 billion, while shipments totaled US$10.8 billion.

Broadcom reported record second-quarter revenue and raised expectations for the current quarter, but its outlook for artificial intelligence (AI) semiconductor sales fell short of elevated market expectations, prompting a sharp decline in the company's shares in after-hours trading.

Silicon photonics (SiPh) chip designer BE Epitaxy Semiconductor turned profitable in 2025 as demand for 800G and 1.6T co-packaged optics (CPOs) heads toward explosive growth. Backed by orders and funding from AMD and MediaTek, the company is using a lean-asset model and ecosystem integration strategy to push into full-optical CPO design. General manager Jada Wang said 2026–2027 will mark the industry-wide breakout point for SiPh chips and CPO commercialization. BE Epitaxy Semiconductor's 800G products have already reached shipment standards, and the company is now moving toward 1.6T optical engine (OE) chipsets.

Memory module maker Goldkey said it plans to raise NT$6 billion (US$191.4 million) to NT$10 billion in working capital in 2026 through multiple channels as tight supply and rising contract prices fuel a memory supercycle. The company also plans to accelerate a shift into higher-value segments such as industrial control, AI, and edge computing after posting a 30% gross margin and 27.4% operating margin in the first quarter of 2026.