DIGITIMES Semiconductors news

Aug 21

Lee Jae-myung meets SK chief Chey Tae-won with US chip investment pressure in focus

South Korean President Lee Jae-myung has begun a fresh round of talks with the country's leading business figures, starting with a private dinner with SK Group chairman Chey Tae-won, at a time when semiconductor investment, artificial intelligence and US demands for more local manufacturing are becoming increasingly intertwined.

Cambricon advances sixth-gen AI silicon, broadens support for DeepSeek, Qwen and GLM

Aug 21

Explainer: Why South Korea's semiconductor concentration may fare better than Taiwan's

Aug 21

FOPLP's race to scale: Taiwan leads while three technical hurdles test mass production

Aug 21

Charts: TSMC's share of Taiwan chip manufacturing revenue falls to 81.8% as memory makers scale up

Aug 21

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IC MANUFACTURINGAI accelerator shipments are set to turn advanced packaging into the next battleground: Counterpoint

Aug 24, 07:42

AI accelerator shipments are expected to reshape semiconductor demand worldwide, with implications for cloud operators, memory suppliers, and device makers in every major market. Counterpoint expects more than 130 million GPUs and AI ASICs to shift toward advanced-packaged on-compute memory over the next five years, as the industry braces for nearly US$2 trillion in compute revenue and an intensifying battle over packaging capacity.

IC MANUFACTURINGTaiwan's 'invisible champions' in chip materials are about to become visible, says GlobalWafers' Doris Hsu

Aug 24, 07:42

Advanced process technology and new device architectures are reshaping the semiconductor supply chain — and the pressure is shifting from the fab to the materials that feed it.

IC DESIGN, DISTRIBUTIONAI compute race heads toward space as MediaTek executive says 1 million H100s will be mid-tier by 2030

Aug 24, 07:41

Speaking at DIGITIMES' "AI on Chips: Semiconductor Industry Outlook Forum," MediaTek senior director Bor-Sung Liang said AI development is shifting from individual large language models (LLMs) toward collaborative teams of AI agents with different roles and capabilities. He also revisited the seven-layer AI architecture he previously proposed, contrasting it with NVIDIA CEO Jensen Huang's five-layer "cake."

IC MANUFACTURINGIndia roundup: India's chip push moves beyond fabs as yield, supply chains and new technology become the next test

Aug 24, 07:40

India's semiconductor strategy is entering a more demanding phase, shifting from attracting fabs and assembly plants toward building the capabilities needed to sustain them. From wafer yields and labor rules to materials, equipment, rare earth magnets and emerging technologies, the country is expanding its ambitions as it seeks a deeper role in the global chip supply chain.

PASSIVE, PCB, OTHER IC COMPONENTSAI chip boom lifts South Korean semiconductor materials makers' profits in 2Q26

Aug 24, 07:40

The AI semiconductor investment boom is increasingly spilling over into the materials supply chain. South Korea's major semiconductor materials suppliers broadly improved profitability in the second quarter of 2026, as stronger demand for advanced materials drove sharp operating profit growth. With customers expected to expand capacity from 2027 onward, the sector could see another wave of revenue growth.

IC MANUFACTURINGSamsung DX hits first quarterly loss on chip inflation

Aug 24, 07:39

Samsung Electronics' Device eXperience (DX) division posted its first-ever quarterly operating loss in the second quarter of 2026, hit by chip inflation. Despite the worsening profitability, DX chief Tae-Moon Roh is responding with a strategy centered on expanding market share.

IC DESIGN, DISTRIBUTIONAgentic AI opens new era for humanoid robots, shipments to jump fourfold by 2030

Aug 24, 07:38

Humanoid robots have entered a clear new phase since agentic AI emerged in 2025, with DIGITIMES analyst Zouhao Shen saying the category is now moving toward a three-tier hardware architecture of the brain, cerebellum, and peripheral nerves. He said the shift is reshaping the market and setting the stage for rapid growth through 2030.

MEMORY CHIPSResearch Insight: ASIC shipments projected to overtake GPU by 2027 as AI reshapes memory

Aug 24, 07:37

ASIC and GPU shipments will reach a "golden cross" in 2027, with ASIC shipments expected to surpass GPU shipments for the first time at 15.3 million units, DIGITIMES Intelligence analyst Stella Weng said. She also said AI is driving a "qualitative change" in memory architecture inside AI servers.

IC MANUFACTURINGCPO hurdles linger as 800G and 1.6T SiPh surge, says analyst

Aug 24, 07:36

Challenges around co-packaged optics (CPO) remain unresolved, but they have not slowed the rapid rise of 800G and 1.6T silicon photonics, DIGITIMES analyst Kiwi Hsu said on August 20 at a semiconductor industry forum in Taipei. He said demand for AI cluster interconnects continues to expand, driving exponential growth in the output value of optical communications.

MEMORY CHIPSAI memory windfall: Samsung to hand back up to US$79 billion in 2026

Aug 22

Samsung Electronics' board has approved a 2026 shareholder return plan estimated at KRW90 trillion to KRW110 trillion (approx. US$64-79 billion), which the company says is the largest ever by a Korean firm.

IC DESIGN, DISTRIBUTIONInterview: Arbe Robotics on why radar is needed for autonomous driving and beyond

Aug 22

Autonomous driving technology is maturing, and a future in which cars entirely drive themselves is quickly approaching in the rearview mirror. Yet safety and trust remain crucial barriers to overcome before fully autonomous driving becomes a reality, and a key part of this is the "eyes" of the car.

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