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Aug 3
Intel offers bonuses to speed up Ohio fab construction and reaches EMIB-T yields of 90%
Intel is awarding bonuses for overtime work as it seeks to complete the construction of its Ohio fab complex by 2031. Meanwhile, the company has made progress on the development of its next-generation packaging technology, embedded multi-die interconnect bridge-through-silicon via (EMIB-T), positioning it to compete with TSMC.
Sandisk and SK Hynix have published a technical specification for high-bandwidth flash through the Open Compute Project, a move that could shape future AI infrastructure worldwide. The standard is meant to help developers build faster, more efficient inference systems as demand rises for memory that sits closer to compute and handles larger workloads.
Yangtze Memory Technologies Corp. (YMTC) has rejected claims that the US Patent and Trademark Office (USPTO) invalidated all 19 claims of a core 3D NAND patent, calling the reports "seriously misleading" while its patent battle with Micron Technology expands across the US, China, and Europe.

Montage Technology has begun pilot production of what it says is the industry's first CXL 3.2 memory expansion controller, targeting growing memory capacity and pooling requirements across AI, cloud computing and data centres.

RichWave says Wi-Fi 7 momentum stays strong in 2H26
Aug 4, 07:52

RichWave Technology said at a recent earnings call that Wi-Fi 7 adoption continues to rise rapidly, with strong demand from telecom operators and retailers. The radio frequency (RF) front-end supplier said that the second half of 2026 should be slightly better than the first half of the year overall, but warned that tight supply of memory and passive components could affect shipment timing.

ChipAgents, a two-year-old startup building autonomous AI agents for chip design and verification, has raised an additional US$60 million in Series A2 funding, taking its total Series A financing to US$134 million just six months after the round first closed.

Major memory suppliers are increasing capital spending as AI-related demand from U.S. technology companies accelerates, but Kioxia is keeping investment comparatively tight. According to Nikkei Asia, the Japanese NAND maker is prioritizing technology leadership over a rapid expansion of equipment spending, reflecting caution shaped by earlier downturns in the memory market.
Inversion Semiconductor is developing a particle-accelerator lithography platform that it says could deliver shorter wavelengths, higher throughput and denser chips than today's extreme ultraviolet systems, offering a new route beyond ASML's EUV architecture.
AI infrastructure orders extend PCB expansion race
Aug 3
Global demand for AI infrastructure is rising, and as order visibility improves, the PCB supply chain has launched a marathon of factory expansion. Upstream copper-clad laminate (CCL) materials are already in short supply, and land, plant space, and machinery are also becoming scarce resources.
The semiconductor industry is grappling with a supply-demand imbalance as AI-driven demand for advanced-node chips outpaces global capacity by several times, pushing up fab utilization stress and manufacturing costs. xLight says it aims to ease that pressure by reinventing light transmission and turning it from a single-machine function into a utility-scale service.

Renesas Electronics plans to gradually end production at its Takasaki factory in Japan over the next two to three years while strengthening research and development there. The move reflects wider supply-chain strain in legacy semiconductor manufacturing and could affect customers, workers, and global users of analog and power chips.

Semiconductor testing company Materials Analysis Technology (MA-tek) approved the sale of an 80% stake in its Chinese subsidiary MA-tek Technology Testing (Shanghai), as it moves to accelerate its global footprint in the US, Japan, Europe, and Southeast Asia. The transaction is expected to complete all procedures and close by the end of 2026.