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Jul 17
Exclusive: PC brands reportedly rush to secure CXMT memory as orders extend to end-2027
Chinese DRAM maker ChangXin Memory Technology's (CXMT) IPO has entered its final stage, drawing close market attention. PC supply chain sources said the US had briefly planned to add CXMT to its entity list but had not announced it, and that easing US-China tensions, along with reports that Apple had tested CXMT memory and lobbied the US government, had signaled a possible green light and triggered a rush of orders from brands, with shipments reportedly booked through the end of 2027.
Taiwan's heavy-electrical and electromechanical industry is entering a new growth phase as demand expands beyond its long-standing reliance on Taiwan Power (Taipower). While Taipower's grid modernization remains the sector's foundation, semiconductor investments, AI data center construction, and overseas infrastructure projects are creating multiple growth drivers. At the same time, project-based business models are making revenue recognition increasingly uneven despite record order backlogs.

Rising demand for AI data centers and high-bandwidth memory (HBM) is pushing semiconductor competition further upstream into silicon wafers and critical materials. Micron and GlobalWafers recently announced a 10-year agreement, with Micron also providing US$500 million in support, marking the longest and potentially largest long-term supply agreement in GlobalWafers' history.

Huahsu, a semiconductor materials supplier established in 1997 through a joint investment by Japan's Asahi Kasei and Wah Lee, has launched a new capacity expansion plan as demand for AI, HPC, and advanced semiconductor packaging accelerates. The company recently held a completion ceremony for its second high-resolution dry film photoresist processing plant.
South Korea's Hanmi Semiconductor is racing to expand output of the bonding equipment that global memory and foundry makers rely on to build high-bandwidth memory (HBM), warning that demand could outstrip supply from 2027, a bottleneck that would ripple across the AI chip buildout now being funded by the likes of Micron, SK Hynix, and TSMC.
India is broadening its technology strategy from attracting chip factories to building semiconductor equipment, materials, AI capabilities, supply chains and trade partnerships as it seeks a larger role in global electronics.
MiTAC packs 96 AMD GPUs into 52U liquid-cooled rack
Jul 20, 08:01
MiTAC Computing Technology, a subsidiary of MiTAC Holdings, showcased its server lineup and high-density liquid-cooled rack solutions at the 2026 World Artificial Intelligence Conference (WAIC) in Shanghai.
Merck did not begin in a laboratory, but in a neighborhood pharmacy that still opens every day to fill prescriptions for local residents. The Engel Pharmacy in central Darmstadt, Germany, founded in 1668, has operated for 358 years and is the company's starting point.
SmartSens is signaling stronger first-half 2026 growth, a development that may matter to investors tracking global demand for image sensors used in security cameras, smartphones, and vehicles. The company said revenue and profit are likely to rise, reflecting broader adoption of AI-driven hardware across consumer and industrial markets worldwide.
The humanoid robot industry is converging on a "big brain, small brain" architecture, with AI compute shifting from the cloud to the edge, and even to hands, feet, and other endpoints. DIGITIMES Intelligence predicts that Nvidia's CUDA will keep it dominant in the robot "big brain" layer for now, but automotive chipmakers and field-programmable gate array (FPGA) vendors can still target the "small brain" and endpoint edge-compute market to break into the humanoid robot ecosystem.

AI development is driving larger data transfers and higher GPU efficiency demands, pushing memory toward customization and prompting South Korean industry watchers to call for a shift to a "memory foundry" model. Sungkyunkwan University professor Seokjoon Kwon said at the Nano Korea 2026 forum that memory makers must move from mass production to order-driven design tailored to customer needs.

High-NA EUV lithography is becoming the semiconductor equipment industry's next major battleground as demand rises for more advanced chips used in artificial intelligence, high-performance computing, and mobile devices. Trumpf, a key supplier to ASML, says higher laser power, faster tool output, and closer coordination with chip designers will determine how quickly the technology becomes mainstream.