DIGITIMES Semiconductors news

May 25

Huawei bypasses 3D NAND limits with 122TB AI SSD packaging breakthrough

Huawei is using self-developed packaging technology to build ultra-high-capacity enterprise SSDs, underscoring how Chinese technology companies are increasingly turning to advanced packaging and system-level engineering to navigate US semiconductor restrictions.

Micron maps out HBM roadmap with 2027 HBM4E debut and custom AI memory designs

May 25

India-based Cyient Semiconductors raises US$30 million to scale power chips for global AI markets

May 25

Nvidia's reporting pivot and AMD's US$10B Taiwan bet signal a new frontier in AI chip war

May 25

Anthropic-Microsoft deal could broaden ASIC demand across cloud supply chains

May 25

MORE NEWS

IC MANUFACTURINGSamsung's silicon photonics push adds new layer to Korea-Dutch chip ties

May 26, 06:44

South Korea and the Netherlands are looking to broaden their semiconductor partnership beyond ASML's EUV lithography machines, as silicon photonics (SiPh) emerges as a potential next field of cooperation amid rising power and bandwidth demands from AI data centers.

IC DESIGN, DISTRIBUTIONAnalysis: Nvidia's Vera CPU opens new front in data center chip race

May 26, 06:44

Nvidia CEO Jensen Huang is pushing the company deeper into the CPU market, betting that the rise of agentic AI will create a new growth engine beyond the GPUs that made Nvidia the dominant supplier of AI computing hardware.

MEMORY CHIPSKioxia targets 2027 BiCS 10 NAND production as Samsung, SK Hynix hold back investment

May 26, 06:43

Kioxia is targeting 2027 production of its 10th-generation BiCS 10 NAND, a move that could help the Japanese memory maker narrow its technology gap with Samsung Electronics and SK Hynix as the South Korean rivals delay investment in their own next-generation NAND technologies, according to ZDNet Korea.

IC MANUFACTURINGTSMC promises faster bonus growth in 2026 after employees threaten Samsung-style strike

May 26, 06:42

Taiwan Semiconductor Manufacturing Company (TSMC) will reportedly cut employee bonuses by 15%, prompting some employees to voice dissatisfaction on social media. They argued that while TSMC's profits have soared, the share allocated to employee bonuses has decreased rather than increased, with some employees threatening to follow Samsung Electronics' union with a strike to fight for their rights.

IC MANUFACTURINGBeyond Silicon Valley: Lam Capital's startup contest goes global

May 25

Lam Research's Lam Capital recently held its fourth startup competition, drawing teams from the US, South Korea, Singapore, India, and Taiwan to vie for a sizeable prize pool. US startup Lightfinder won the top prize with a proposal centered on silicon photonics and intelligent software for a chip-scale spectrometer.

IC DESIGN, DISTRIBUTIONHuawei reveals post-Moore semiconductor roadmap targeting 1.4nm-equivalent chip performance

May 25

As the global semiconductor industry confronts the limits of Moore's Law, Huawei has unveiled a new roadmap aimed at extending chip performance growth through architecture, interconnect, and system-level optimisation rather than pure transistor miniaturisation.

IC MANUFACTURINGLam Research CEO: New fabs alone will not solve chip bottlenecks

May 25

Lam Research CEO Tim Archer said artificial intelligence and robotics can help chipmakers improve fab productivity as the semiconductor industry faces memory capacity constraints, chip-scaling limits, and growing demand for faster equipment delivery.

MEMORY CHIPSNvidia's Vera CPU push lifts LPDDR outlook for Samsung, SK Hynix

May 25

Nvidia's decision to sell its Vera CPU as a standalone chip could create a new source of demand for low-power DRAM, adding another pressure point to the already tight memory supply chain.

IC MANUFACTURINGAI servers drive order growth; Weltrend's fan motor driver IC visibility strong

May 25

At its earnings conference, Weltrend Semiconductor described the first quarter of 2026 as an exceptional one. Despite the period being historically slow, the company posted year-over-year and sequential growth. Nearly all major product lines demonstrated strong growth momentum, with server-related products standing out in particular. Order visibility is now expected to remain strong throughout the full year. Meanwhile, AI servers are becoming increasingly diversified, with demand across GPUs, ASICs, and CPUs growing almost simultaneously, underpinning a highly promising operating outlook.

IC MANUFACTURINGNan Pao joint venture nears full capacity as semiconductor demand rises

May 25

Nan Pao Resins Chemical is accelerating its push into the high-end semiconductor materials market through a joint venture with Advanced Echem Materials Company and Trusval Technology, forming Advanced Pao Trusval Technology to target advanced packaging adhesive materials.

PASSIVE, PCB, OTHER IC COMPONENTSAI data centers spark 800V HVDC rush for Taiwan lead frame suppliers

May 25

The shift toward 800V high-voltage direct current (HVDC) power architectures in AI data centers is driving a surge in demand for power semiconductors, boosting shipments for Taiwanese lead frame suppliers SDI Corporation and Jih Lin Technology and raising expectations for double-digit revenue growth in 2026.

More coverage

TOPICS

TSMC UPDATES

INDIA'S SEMICONDUCTOR MISSION

INTERVIEWS