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Mar 11
Nvidia audits Samsung HBM4 packaging for Rubin GPUs, report says
Nvidia has reportedly conducted a series of closely spaced visits to Samsung Electronics' semiconductor packaging campus in Cheonan, South Korea, signaling that verification of the next-generation high-bandwidth memory (HBM) supply chain is entering a final stage.
Daxin, a key player in semiconductor materials, has seen rapid growth in recent years. Currently, wafer process materials account for a larger share of revenue than advanced packaging materials, and both segments are expected to continue expanding.
Jiu Han System Technology, a leading cleanroom and turnkey project contractor, reported strong profit growth in 2025 driven by peak construction periods and approval for large-scale projects. Benefiting from AI-driven demand and advanced process manufacturing, the company revealed that its order book as of the first quarter of 2026 totaled NT$11.6 billion (US$364.78 million), with order visibility extending two to three years.
Managing director Yao-Kuo Yu of Nichidenbo, a passive component distributor, stated that the AI industry's growing demand for passive components continues to tighten supplies of high-end multilayer ceramic capacitors (MLCCs) and tantalum capacitors, with tantalum capacitor prices rising about 10-20%.
IC distributor WT Microelectronics reported consolidated preliminary revenue of NT$104.4 billion (US$3.28 billion) for February 2026, up about 29% year over year. For the first two months of 2026, cumulative consolidated revenue reached approximately NT$300.2 billion, marking an 89.1% increase year over year.

JCET, China's leading semiconductor packaging and testing provider, has launched a facility focused on automotive electronics and robotics chips, strengthening the country's vehicle-grade semiconductor manufacturing ecosystem.

Japan selected 61 products and technologies for priority investment, including 27 items already under early review, such as physical AI systems, regenerative medicine, quantum computing, and marine drones, the government said, according to Bloomberg.
Sercomm chairman James Wang predicted that memory shortages and price increases will persist through the end of 2026, influenced by Middle East conflicts affecting AI data center investments and consumer reactions to smartphone price hikes.

Market sources say analog chip design leader Texas Instruments (TI) is preparing to raise prices on a range of semiconductor products starting in April 2026. The scale of the increases across different product lines and the outcomes will depend on negotiations between TI and its customers.

The rapid growth of artificial intelligence (AI) and data centers is driving a sharp rise in global electricity demand, renewing interest in nuclear power as a source of reliable, carbon-free energy. Yet while governments in the US and Europe are trying to revive their nuclear sectors, structural challenges—including aging workforces, fragile supply chains, and project delays—are complicating those efforts.

MediaTek CEO Ricky Tsai recently discussed artificial intelligence, semiconductor geopolitics, and MediaTek's evolving strategy in an interview with an English-language publication. He also reflected on his academic background and career path, as well as his approach to work and life.
Vivo unveiled its V70 series in Taiwan on the March 10, aiming to drive continued growth in its 2026 local operations by bringing flagship features to a broader audience. Although Taiwan's smartphone market is expected to slow in 2025 due to high penetration rates and the price of components continues to rise, Vivo Taiwan President Yi-ting Chen said the company plans to boost revenue by 30% and increase shipment volume by 20% through targeted product segmentation and innovative marketing strategies.