DIGITIMES Semiconductors news

Sep 22

India's fifth chip plant goes live, capping Suchi Semicon's three-year buildout

Prime Minister Narendra Modi virtually inaugurated commercial production at Suchi Semicon's outsourced semiconductor assembly and test (OSAT) plant in Palsana, Surat, on September 17, alongside CDIL Semiconductor's assembly, testing, marking, and packaging unit in Mohali, Punjab. The two facilities take the number of semiconductor projects in commercial production in India to five, according to The New Indian Express, joining Micron, Kaynes Semicon, and CG Semi at Sanand in Gujarat.

Anthropic, OpenAI expected to start buying memory directly in 2027

Sep 22

DeepSeek bets on Huawei chips for model training as Nvidia's China sales slip

Sep 22

Micron Taiwan union heads for strike vote as board, earnings calendar stall profit-sharing talks

Sep 22

Exclusive: China SiC capacity tightens, spilling orders over to Taiwanese foundries

Sep 22

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MEMORY CHIPSYMTC wins German injunctions against Micron in latest round of NAND patent battle

Sep 23, 15:59

Micron is facing fresh pressure on multiple fronts after Germany's Munich I Regional Court sided with Chinese memory maker YMTC and issued two injunctions over alleged infringement. Industry sources said enforcement of the injunctions could restrict Micron's supply in Germany and reshape the European automotive and industrial-control NAND market.

MEMORY CHIPSSamsung LPDDR6 validated by Qualcomm for next-gen Snapdragon platform

Sep 23, 15:13

AI workloads are pushing cloud, edge, and mobile devices toward tighter power budgets and heavier data traffic, making memory efficiency a growing global issue. Samsung is positioning its new LPDDR6 as a response, with higher bandwidth, lower power use, and improved reliability for next-generation on-device AI.

IC MANUFACTURINGBiwin Storage commits US$672M to double down on 2.5D packaging, compute-memory integration

Sep 23, 15:02

Biwin Storage Technology plans to invest CNY4.5 billion (approx. US$672 million) in the third phase of its wafer-level advanced packaging and testing project, expanding 2.5D integration and compute-memory co-packaging capacity as AI and high-performance computing lift demand for advanced packaging.

PASSIVE, PCB, OTHER IC COMPONENTSZDT prices US$800M ECB to expand AI server PCB push

Sep 23, 14:40

Printed circuit board (PCB) maker Zhen Ding Technology (ZDT) Group completed pricing of its sixth overseas convertible bond issue on September 22, raising a total of US$800 million (about NT$25.224 billion). The company plans to issue the bonds on September 29 and list them on the Singapore Exchange, with proceeds to be used entirely to replenish working capital and support technology development for high-end products.

IC MANUFACTURINGHermes-Epitek eyes CPO test revenue in 2027

Sep 23, 14:14

Archie Hwang, the founder and chairman of Hermes-Epitek, appeared before the media alongside Hermes Testing Solutions Inc. (HTSI) executives. The company outlined a major push into silicon photonics (SiPh) co-packaged optics (CPO) testing and said related revenue is expected to begin contributing in 2027.

PASSIVE, PCB, OTHER IC COMPONENTSNvidia's 800V power shift hands Taiwan's capacitor makers a new AI segment

Sep 23, 13:07

As AI computing workloads surge, demand for higher GPU and CPU performance is triggering exponential growth in data center power density and energy consumption. Nvidia's transition toward an 800V high-voltage direct current (HVDC) power architecture is driving hardware upgrades across sidecar power cabinets and battery backup units (BBUs), while spurring demand for customized high-voltage NP0 (C0G) multilayer ceramic capacitors (MLCCs).

IC MANUFACTURINGNexperia China turns 12-inch wafers into the backbone of its chip supply-chain reset

Sep 23, 12:35

Nexperia China is accelerating production on its domestic 12-inch wafer platform as it rebuilds a locally controlled semiconductor supply chain spanning design, wafer production, packaging, and testing.

IC MANUFACTURINGEpisil says AI demand marks structural shift in semiconductor epitaxy

Sep 23, 11:55

Episil Precision said AI-related demand is reshaping semiconductor epitaxy for the long term, with effects reaching global power and optical supply chains. The Taiwan-based maker is expanding in silicon, GaN, SiC, and GeSi to serve AI servers, optical communications, and mature-node power components worldwide.

MEMORY CHIPSSK hynix's venture arm moves beyond memory into optical interconnect and system software

Sep 23, 11:50

SK hynix has launched a corporate venture capital (CVC) brand, SK hynix Ventures, and widened its investment scope beyond semiconductors and emerging technology to include AI computing, data centers, system software and optical interconnect — areas that sit beside and above its own products rather than inside them.

IC MANUFACTURINGTaiwan's August export orders top US$100 billion as overseas production edges up

Sep 23, 09:27

Taiwan's export orders topped US$100 billion in August 2026, reaching US$102.96 billion, up US$5.02 billion from the previous month, according to statistics released by Taiwan's Ministry of Economic Affairs (MOEA) on September 22. Export orders for September are forecast to be between US$106 billion and US$109.1 billion, representing year-over-year growth of 50.7% to 55.1%.

IC MANUFACTURINGTaiwan courts Indian IIT chief in bid to boost chip talent ties

Sep 23, 09:05

Taiwan is stepping up outreach to India's engineering sector as global competition for chip and artificial intelligence talent intensifies. The planned cooperation could affect supply chains, university links, and where skilled graduates build careers, with implications for chipmaking hubs in Asia and beyond.

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Interview: Advanced packaging shifts toward system-level co-design for AI

Advanced packaging remains one of the semiconductor industry's hottest technology areas in 2026. In Taiwan, terms such as co-packaged optics (CPO), chiplets, and glass substrates are increasingly common as packaging moves deeper into system-level design.

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