Nvidia has begun securing advanced substrate capacity in Taiwan, Japan and South Korea, using capacity reservation agreements and upfront payments to support supplier expansion as next-generation AI accelerators ramp up. The move comes as the global packaging substrate market is projected to grow from US$14.9 billion in 2025 to US$40.2 billion in 2030, while demand for advanced ABF build-up materials is expected to exceed supply from 2027.
ASE Technology Holding (ASEH) expects gross margins in its packaging and testing business to remain above 30% in 2027 as growing demand for AI-related advanced packaging helps the company move beyond the profitability ceiling that has historically constrained the industry.
KLA Corporation, the US maker of semiconductor inspection and metrology equipment, is evaluating a manufacturing foray in India and is considering one or two applications under the country's Semicon 2.0 incentive scheme, The Economic Times reported on October 29, citing people familiar with the developments. KLA did not respond to the newspaper's queries.
The rapid development of AI robotics applications is driving a sharp increase in semiconductor computing requirements. According to DIGITIMES Intelligence, Nvidia is set to dominate the 2026 AI robotics computing IC market with a 69% share, far outpacing Intel (11%), Qualcomm (5%), and AMD (2%). Beyond raw computing power, Nvidia's comprehensive software ecosystem is the critical factor leaving competitors in its wake.
Intel told Taiwanese chip equipment and materials suppliers that they need spare parts and service capability in place early if they want its business. The company said this at a supplier forum held by industry group SEMI in San Francisco ahead of the SEMICON West trade show.
After The New York Times reported that a female executive at Singapore-based Megaspeed International was under investigation for allegedly conducting espionage activities for China, Nvidia CEO Jensen Huang said the company's dealings with Megaspeed were normal and involved no irregularities.
Sandisk sees demand for roughly 60 to 90 gigabytes of NAND flash per CPU in certain AI inference and agent-orchestration applications, as customers rethink how they use different memory and storage technologies across their AI systems.
Passive component manufacturer Yageo said robust AI demand is driving shipments of multilayer ceramic capacitors (MLCCs) and tantalum capacitors, pushing AI-related applications to nearly 20% of its total revenue in the third quarter of 2026, up from 16% in the preceding quarter.
Intel's growing server business is strengthening its operating recovery, but a factory disruption and a prolonged PC downturn threaten its ability to convert demand into near-term sales. Its third-quarter results show why the turnaround now depends as much on supplying data centers as on reviving the client business that has long anchored the company.
Oracle will offer cloud services powered by Cerebras' AI computing systems in its cloud data centers starting in 2027, giving the wafer-scale chipmaker another major cloud customer. Although the companies did not disclose Oracle's planned Cerebras hardware purchases, the deal highlights the shift toward diversified AI compute resources as inference demand accelerates.
As AI chip packages continue to grow in size, panel-level packaging equipment is gradually advancing toward customer validation and volume production.
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