DIGITIMES Semiconductors news

Apr 2

TSMC plans 12 fabs in Arizona as supply chain shifts from passive to active

TSMC's expansion scale in the US has exceeded expectations, prompting Taiwanese suppliers with existing or planned local operations to take a more proactive approach. Reportedly, companies covering cleanroom, plant engineering, electromechanical integration, and equipment sectors have seen surging visa applications and staffing demands. This surge has kept intermediaries and legal service providers busy both in Taiwan's Hsinchu Science Park and Arizona, highlighting peak mobilization within the supply chain.

South Korea reportedly advances GaAs localization with 95% yield on 4-inch process

Apr 2

Commentary: What's the real game behind Arm's chip venture?

Apr 2

Intel buyback signals shift beyond austerity as chipmaker regains confidence

Apr 2

Memory price surge impacts smartphone supply chain; Foxconn's structural shift key to resilience

Apr 2

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IC MANUFACTURINGPSMC emerges as key link in Europe's push to bring AI chip research to market

Apr 3, 16:04

Europe is stepping up semiconductor ties with Taiwan as it seeks to turn research strength into commercial production, with foundries such as Powerchip Semiconductor Manufacturing Corp. (PSMC) playing a growing role in bridging that gap as the artificial intelligence race intensifies.

IC MANUFACTURINGPSMC, CEA-Leti strike multi-year deal to ease AI data, power bottlenecks

Apr 3, 16:03

Taiwanese foundry Powerchip Semiconductor Manufacturing Corp. (PSMC) and France's CEA-Leti have signed a multi-year agreement on April 3 aimed at easing one of artificial intelligence's most pressing constraints: rising power consumption and data-transfer bottlenecks inside data centers, executives said in an interview with DIGITIMES Asia.

IC MANUFACTURING2026 USTR Report: landmark 'ART' pact reshapes US-Taiwan trade landscape

Apr 3, 12:44

The Office of the United States Trade Representative (USTR) has designated Taiwan as a highly cooperative and pivotal trading partner in its 2026 National Trade Estimate (NTE) Report.

PASSIVE, PCB, OTHER IC COMPONENTSSamsung Electro-Mechanics lifts FC-BGA prices on AI-driven shortage

Apr 3, 12:44

Samsung Electro-Mechanics has raised prices for its high-end flip-chip ball grid array (FC-BGA) substrates as demand from artificial intelligence (AI) servers and high-performance computing (HPC) applications continues to outpace supply, according to South Korean media reports and industry sources.

IC MANUFACTURINGUS faces split Asia: allies build 'sovereignty walls' as digital tensions rise

Apr 3, 12:44

The 2026 National Trade Estimate (NTE) Report signals a new era of digital friction between the US and its closest Asian allies.

IC MANUFACTURINGTaiwan pushes ahead with AI and tech agenda even as budget deadlock threatens fiscal paralysis

Apr 3, 12:43

Taiwan sits at a rare intersection of economic momentum and political gridlock. The island's economy expanded 8.68% in 2025, exports hit a record US$640.75 billion, and per capita GDP is closing in on the US$40,000 threshold — largely on the back of booming global demand for AI chips and semiconductor capacity. Yet while Taiwan's technology industry is firing on all cylinders, its legislature remains deadlocked over the government's spending plan.

IC MANUFACTURINGTaiwan tackles CPO testing bottlenecks to scale SiPh for AI data centers

Apr 3, 12:37

The surge in AI computing power is driving explosive demand for high-speed optical interconnects in data centers. Forecasts show that by 2026, over 50% of data center transceiver sales will come from silicon photonics (SiPh) modules, a sharp rise from 33% in 2024.

IC MANUFACTURINGMemory stocks rattled by TurboQuant, but demand outlook holds

Apr 3, 12:37

Google Research's TurboQuant memory-compression algorithm has raised concerns that demand for AI-related memory could weaken, but South Korean experts and analysts say the market reaction may be overblown.

IC DESIGN, DISTRIBUTIONIBM and Arm collaborate on dual‑architecture hardware to broaden enterprise AI deployment

Apr 2

IBM and Arm announced a collaboration to build dual‑architecture hardware aimed at running AI and data‑intensive workloads with more flexibility, reliability, and security, potentially affecting enterprise infrastructure worldwide by expanding software choice, easing workload portability, and influencing how organizations deploy mission‑critical applications across cloud and on‑premises environments in the near term.

IC MANUFACTURINGCopper price surge drives quarterly lead frame price hikes

Apr 2

Lead frame packaging suppliers are hiking prices to pass along rising costs sweeping through the semiconductor supply chain. Gold, silver, and copper prices continue to climb sharply, significantly raising raw material costs. At the same time, the inventory reduction cycle within the mature process semiconductor market is nearing completion, prompting customers to ramp up orders.

IC DESIGN, DISTRIBUTIONSamsung reportedly supplies Exynos modem chips to Fibocom for 5G module mass production

Apr 2

Samsung Electronics has supplied its Exynos modem chipset to Chinese wireless module maker Fibocom, marking a notable expansion of its system semiconductor business into external clients, according to inews24 and Greened.

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