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Trends in industrial computing
Digitimes trackes the latest trends in industrial computing applications, including IoT, Industry 4.0 and automation and robotics.
IN THE NEWS
Friday 25 November 2022
Silicon IP provider M31 gains from China IC self-sufficiency drive
Taiwan-based silicon IP provider M31 Technology has benefited significantly from semiconductor self-supply campaign in China, with the ratio of revenues contributed by Chinese clients...
Thursday 24 November 2022
AI-based EDA tools increasingly crucial for IC design process
With the increasing diversity of end-use applications, IC design houses are facing increasing challenges in product design, and how to shorten the time to market for new products...
Tuesday 22 November 2022
Rising VCM sales boost Audix gross margin in 3Q22
Taiwan-based Audix saw its gross margin grow to a 40-quarter high of nearly 27% in Q3 2022 from Q2's 18.92%, thanks to strong sales of voice coil motor (VCM) components used in handset...
Tuesday 15 November 2022
Nexcom optimistic about demand for automation, smart manufacturing
Industrial PC maker Nexcom International expects demand for automation and smart manufacturing to remain strong in 2023 despite macro headwinds challenging many industry sectors.
Monday 14 November 2022
IC distributors expanding deployments in non-consumer, WBG chip segments
IC distributors are aggressively expanding their deployments in non-consumer chips products and third-generation semiconductors like GaN and SiC devices that remain in stable demand...
Friday 11 November 2022
MIH proposes seamless EV information security framework
EVs will massively incorporate intelligent functions including autonomous driving in the future, and therefore information security associated with data transmission among diverse...
Monday 7 November 2022
MCU demand remains stable for automotive applications
MCU demand for PC and other consumer electronics applications is expected to see a larger fall in the fourth quarter than in the third, and only 32-bit MCUs for automotive and industrial...
Monday 7 November 2022
Winbond sees 3Q22 profit hit 6-quarter low
Winbond Electronics, a maker of specialty DRAM and flash memory, has reported net profits falling 48.2% sequentially to a six-quarter low of NT$2.67 billion (US$83.1 million) in the...
Wednesday 2 November 2022
3D IC packaging to develop faster under US trade sanctions against China, says AP Memory chair
For mature manufacturing process, 3D IC packaging is expected to become their alternative solution to advanced processes and will develop faster than expected under the latest US...
Friday 28 October 2022
Rohm unveils on-device learning AI SoC with ultra-low power consumption
Japan-based Rohm Semiconductor has newly launched a prototype SoC featuring an on-device learning AI accelerator, which can instantly predict the failure of electronic devices such...
Wednesday 26 October 2022
Taiwan IC design houses keen on developing AI chip solutions
Taiwan's IC design houses are spending more resources and efforts on developing AI-related applications to strengthen their competitiveness. They are keen on incorporating AI algorithms...
Friday 21 October 2022
PCB equipment makers remain upbeat about sales outlook
Taiwan's PCB equipment makers remain optimistic about demand prospects despite orders deferral at the request of some customers, with most of them ending the first months of the year...
Wednesday 19 October 2022
Arm separates automotive and IoT business lines
Silicon IP vendor Arm has decided to separate its automotive and IoT business lines.
Friday 14 October 2022
Taiwan industries should deepen ecosystems, refocus operations amid worsening US-China tensions, says Advantech board member
Taiwanese businesses must step up efforts to deepen their industry ecosystems, reposition their roles in supply chains and refocus their business operations, so as to meet challenges...
Thursday 13 October 2022
Intel cooperates with US defense department to create 'Internet of Satellites' based on Intel 3 and chiplet
According to Intel, the company has joined the US Defense Advanced Research Projects Agency (DARPA) for the Phase 1 of its Spaced-Based Adaptive Communications Node (Space-BACN) program,...