The board of Taiwan Semiconductor Manufacturing Company (TSMC) has approved capital appropriations of US$3.98 billion for the purpose of upgrading and expanding capacity for advanced-node...

TSMC has reported consolidated revenues of NT$74.69 billion (US$2.45 billion) for April 2019, down 6.3% sequentially and 8.8% on year.

Taiwan Semiconductor Manufacturing Company (TSMC) is on track to move 5nm process technology to volume production in 2020, and reportedly has plans to roll out an enhanced version...

Taiwan IC designers are now moving to place additional orders with foundry houses and thicken their inventories lest they should suffer insufficient foundry capacity support in the...

Samsung Electronics will be making significant efforts to strengthen the competitiveness of its logic IC business, and is also eyeing to become the world's largest logic chipmaker...

The semiconductor industry is expected to see demand pick up significantly in the second half of 2019 after gradually hitting the bottom, and Taiwan can compete well in the global...

Smartphone AP shipments to China slid 29.3% sequentially in first-quarter 2019 under the influence of system integrators' inventory adjustment and fewer working days.

IC backend house ASE Technology Holding and wafer probe card specialist Chunghwa Precision Test Tech (CHPT) are both engaged in the supply chain for HiSilicon's next-generation flagship...

Tsinghua Unigroup's chipmaking arm Unisoc has recently released a new generation chipset platform, Tiger 310 mobile SoC, for 4G smartphones, seeking to better cash in on pre-5G replacement...

TSMC has announced the expansion of its open innovation platform (OIP) cloud alliance, with Mentor Graphics joining inaugural members Amazon Web Services (AWS), Cadence, Microsoft...

TSMC has certified Ansys' solutions for its SoIC (system-on-integrated chips) 3D chip-stacking technology, according to Ansys, an engineering simulation software provider.

Despite a ramp-up of orders for 7nm chips, TSMC is still seeing orders for other advanced process nodes remain sluggish which has kept its overall 12-inch fab capacity in oversupply,...

Memory backend specialist Powertech Technology is aggressively developing its advanced packaging technology capability for logic IC production, and will remain focused on fan-out...

TSMC will see its 7nm process utilization rate climb substantially in the second half of 2019, driven by a seasonal pick-up in demand for smartphones, as well as chip demand for HPC,...

ASE Technology has landed more customized SiP (system-in-package) backend orders than expected earlier this year thanks to growing demand for heterogeneous integration of 5G chips,...