Fabless chipmaker MediaTek is expected to enter volume production of its 10-core SoC series for smartphones in the third quarter of 2015, according to industry sources. The chip solutions...
Internet of Things (IoT) will be the semiconductor industry's next growth driver, spurring demand for chip components for use in applications particularly automotive, medical/healthcare...
Taiwan-based chipmakers including foundries TSMC and UMC, and IC packager ASE have said that their operations have not been affected by a 6.3 magnitude earthquake that struck the...
Taiwan Semiconductor Manufacturing Company (TSMC) will break ground for a new fab at its 12-inch wafer plant in central Taiwan in June 2015. The fab is designed to manufacture chips...
Taiwan Semiconductor Manufacturing Company (TSMC) is targeting a 10% compound annual growth rate (CAGR) for both revenues and profits over the next five years, according to the pure-play...
Taiwan Semiconductor Manufacturing Company (TSMC) expects its revenues to decrease 7-8% sequentially in the second quarter of 2015. The pure-play IC foundry has also cut its annual...
TSMC would prefer to set up its own 12-inch wafer fab in China, and management is evaluating the feasibility "aggressively," according to the Taiwan-based contract chipma...
Taiwan Semiconductor Manufacturing Company (TSMC) may not only lag behind rival United Microelectronics Corporation (UMC) but also Powerchip Technology in the race to build 12-inch...
Pure-play IC foundry Taiwan Semiconductor Manufacturing Company (TSMC) has reported consolidated revenues of NT$72.27 billion (US$2.32 billion) for March 2015, up 15.4% on month and...
Cadence Design Systems has announced that its digital and custom/analog tools have achieved certification from TSMC for its most-current version of 10nm FinFET Design Rule Manual...
Taiwan Semiconductor Manufacturing Company (TSMC) will break ground for the fifth phase construction of its 12-inch wafer plant in central Taiwan in May, according to industry sour...
Altera and TSMC have produced an UBM-free (under-bump metallization-free) WLCSP (wafer-level chip scale package) technology for Altera's MAX 10 FPGA products, according to the comp...
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