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REALTIME NEWS
Musk and Anthropic test rival models for sharing AI wealth with the public
ICT
58min ago
Intel Foundry targets optical communications with 12-inch InP technology
Tomorrow's Headlines
6h 7min ago
China’s RISC-V targets servers as XuanTie chip shipments exceed 6 billion
Tomorrow's Headlines
6h 7min ago
DAMO Academy expands into autonomous driving and robotics with XuanTie processors
Tomorrow's Headlines
6h 7min ago
Samsung Electro-Mechanics expands long-term contracts to package substrates
Tomorrow's Headlines
6h 7min ago
SDC advances MPO and inkjet-printed OLED in parallel
Tomorrow's Headlines
6h 7min ago
Oct 20, 16:58
Intel requests FCC waiver from US foreign robot ban, citing impact on US chipmaking
Oct 20, 17:22
Jensen Huang urges Germany to embrace physical AI at Berlin summit
Oct 20, 17:09
Samsung eyes six foldables for 2027, including a rollable phone
Oct 20, 17:05
Japan's MMX mission launches successfully, gains edge over China in race for first Mars system sample return
Oct 20, 18:09
Unimicron chairman sees substrate sizes reaching 14x current scale by 2030
LATEST STORIES
7 days news
Global Tek's new Thailand plant enters trial production in 3Q26, targeting AI liquid cooling and aerospace opportunities
Oct 20, 17:05
SOUTHEAST ASIA
US firms eye Malaysia to diversify rare earth supply chains
Oct 20, 15:55
SOUTHEAST ASIA
AUO selects glass substrate specs for semiconductor processes, not size rivalry
Oct 20, 15:38
SEMICONDUCTORS
Taiwan anchors US chip revival, SEMICON West spotlights trusted partners
Oct 20, 15:08
SEMICONDUCTORS
Chief Telecom starts NT$3.3 billion AI data center in Taiwan
Wistron Medical Technology and Chang Gung University expand AI elder-care training
AI server demand lifts Tongtai drilling orders through 2027
AI servers drive TVS and ESD demand for Yea Shin Tech
Thermaltake expands AI workstation lineup on edge AI demand
Samsung's HBM4 supply lock-in exposes limits of China's CXMT as Apple and Tesla seek DRAM alternatives
BYD's China EV battery market share slips as overseas installations surge 66.5%
Daeduck Electronics targets 2029 ceramic substrates for AI packaging
Genius Electronic Optical partners with 3M on EBO development
Hygon's revenue jumps 58% on AI chip demand, but growth slows amid 51% stock slump
Powertip Technology transitions into a solutions provider as demand and costs rise
South Korea's US$1.66 billion humanoid robot push puts auto suppliers in focus
DeepSeek-Huawei chip co-design could shift AI training away from Nvidia
Nvidia says South Korea has Vera CPU customers, LG robot results ahead
OLED monitor panel shipments set to overtake TV panels in 2028
China tightens drone export controls, extending restrictions to critical components, technologies
Kioxia targets higher-value AI storage with Nvidia partnership, advanced NAND technology
AI substrate bottleneck shifts from design to manufacturing
Nscale set to lose Microsoft as anchor tenant over UK power delays, adding uncertainty to IPO
China's S2C–HyperSilicon merger targets hardware emulation gap in domestic EDA with Empyrean backing
FIC Global targets doubling business in 2027 on optical module orders from eight of world's top 10 makers
LGD continues microLED development despite Apple's exit
Exclusive: Apple's MacBook Neo pressures Microsoft to cut specs for low-cost 12-inch Surface
Micro LED optical interconnect targets AI racks amid unsettled standards
Intel says it is the only high-volume fab for 12-inch InP silicon photonics as co-packaged optics nears deployment
IFA CEO: Taiwan tech to leverage core silicon strengths to counter China's momentum
More news
BIZ FOCUS
Oct 20, 08:00
CHT Leverages Hackathon to Cultivate AI Solutions for Urban Governance
Tuesday 20 October 2026
Cincoze's EMC Solution Boosts Equipment Stability and Production Efficiency
Tuesday 20 October 2026
CES 2027 Welcomes First-Ever Chilean Global Pavilion
Monday 19 October 2026
GMIF2026: AI Inference Drives Token Factory and System Memory Rethinking
MOST-READ
TSMC locks in 3-6% wafer out price hikes for 2027
Musk's Memphis move puts xAI at the center of his empire
TSMC, Intel named as Musk's Terafab ambitions face reality check
GlobalFoundries wins US$2 billion TSMC interposer deal, closing a US packaging gap
Beyond 16 layers: HBM stacks test advanced packaging equipment makers
TSMC breaks silence on Musk's Terafab: Talks underway, but fab control non-negotiable
ByteDance's China AI chip push hits substrate shortage
MULTIMEDIA
K-Safety Expo 2026: Safety, rewired, AI takes the front line at the edge of Busan blue
4F2 DRAM development
Memory leaders are making progress with the next-generation 4F2 DRAM designs, a part of the industry's move toward vertically stacked 3D architectures to increase performance.
AI dividend drives Taiwan's memory makers from trough to transformation
Elon Musk points to China's 2028 DRAM supply surge to challenge Samsung, SK Hynix pricing power
CXMT targets DDR5 RDIMMs by end of 2026; SiCarrier showcases China's advanced chipmaking equipment
...More
EV
Wednesday 9 September 2026
Analysis: When 72% of the world's EV batteries are Chinese, one defect travels
Commentary: China's EV brands own the Paris Motor Show floor, but still yet to land on Macron's guest list
Tuesday 20 October 2026
BYD's China EV battery market share slips as overseas installations surge 66.5%
Tuesday 20 October 2026
South Korea's US$1.66 billion humanoid robot push puts auto suppliers in focus
Tuesday 20 October 2026
TECH
Tuesday 20 October 2026
Exclusive: Apple's MacBook Neo pressures Microsoft to cut specs for low-cost 12-inch Surface
AUO, Largan Micro LED debate highlights optical communications uncertainty
Monday 19 October 2026
Charts: YMTC bets on premium eSSDs to take on Samsung
Friday 16 October 2026
TSMC, Intel, Samsung seek to break AI chipmaking's next barrier through early technology integration
Wednesday 14 October 2026
ASIA
Thursday 10 September 2026
India's fraud office seeks a Xiaomi probe as the market it once led shrinks around it
Samsung's HBM4 supply lock-in exposes limits of China's CXMT as Apple and Tesla seek DRAM alternatives
Tuesday 20 October 2026
China tightens drone export controls, extending restrictions to critical components, technologies
Tuesday 20 October 2026
Analysis: China's proposed AI export controls reach beyond chips to design IP, computing infrastructure
Tuesday 20 October 2026
OPINIONS
Tuesday 20 October 2026
Analysis: US backing grows, but Intel insists turnaround remains independently run
Analysis: China's proposed AI export controls reach beyond chips to design IP, computing infrastructure
Tuesday 20 October 2026
Analysis: China's proposed AI export controls target top-ranked foundation models, advanced agents
Tuesday 20 October 2026
DIGITIMES Insight: AI packaging power reaches kilowatt scale as thermal design moves toward the die
Tuesday 20 October 2026
TOPICS
4F2 DRAM DEVELOPMENT
TSMC 3Q26 EARNINGS CALL
GEOWATCH
TRENDS IN INDUSTRIAL COMPUTING
SPECIAL REPORTS
Monday 19 October 2026
Shipments of high-end cloud AI accelerators, 2027
DIGITIMES observed that cloud service providers (CSPs) such as Google and AWS will sharply ramp up self-developed ASICs in 2027, lifting high-end cloud AI accelerator shipments to 25.951 million units, up 64.5% year-over-year.
Monday 12 October 2026
Chinese government and industry make full push into AI glasses development: AR display integration and lightweighting gain traction
DIGITIMES notes that China continued to advance smart glasses policies from the central government to local governments in 2026, driving both enterprise production and consumer purchase subsidies.
Friday 2 October 2026
Global annual AI server shipments, 2025-2026
Continued advances in top-tier LLM capabilities, coupled with the potential for business automation enabled by agentic AI, are prompting major North American cloud providers, Neo Clouds, and leading AI labs to accelerate AI data center buildouts in 2026.
Thursday 1 October 2026
SiC substrate market shows signs of recovery, driven by demand from vehicles, energy and AI infrastructure
DIGITIMES has observed that since Tesla equipped the Model 3 with a traction inverter integrated with SiC power modules in 2018, the application of SiC power devices in the electric vehicle (EV) sector has gradually expanded, prompting suppliers to aggres 8_s.jpg
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