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REALTIME NEWS
Commentary: Spain's IC design ecosystem revives as EU chip sovereignty demand grows
Semiconductors
1min ago
Apr 20, 09:45
As 2D NAND fades, UMC faces steep hurdles to enter a shrinking market
Apr 20, 10:15
China's humanoid robot half-marathon highlights rapid advances in autonomy and system integration
Apr 20, 10:42
DeepSeek reportedly weighs first external fundraising as AI competition intensifies
Apr 20, 11:29
SOCAMM2 race intensifies as SK Hynix starts mass production, while Micron and Samsung push competing designs
Apr 20, 12:04
Brands boost wearable device sales to offset smartphone shipment pressure
LATEST STORIES
7 days news
Taiwan's Homeplus turns to free streaming to tap FAST TV growth as OTT market saturates
Apr 20, 12:02
DISPLAYS
Zhen Ding plans Hong Kong listing for subsidiary to boost global IC substrate presence
Apr 20, 11:49
SEMICONDUCTORS
Acerpure begins OTC trading, targets emerging markets for smart home expansion
Apr 20, 11:48
ICT
SDC's 8.6-gen OLED approaches 90% yield, expected to supply 2 million panels to Apple in 2026
Apr 20, 11:32
DISPLAYS
Column: Texas emerges as key hub for drone and autonomous systems industry
Samsung reportedly signals exit from LPDDR4 market as memory industry shifts toward LPDDR5
Lens supplies 132 core components for Honor humanoid robot program, reinforcing role in embodied intelligence manufacturing
Samsung tests domestic EUV masks to cut Japan reliance at 4nm
Cerebras revives IPO bid as AI boom fuels growth and high-profile partnerships
Weekly news roundup: Samsung launches voluntary retirement; Qualcomm moves into custom DRAM with CXMT
Canary Islands push into semiconductors, build on space tech base
Qilimanjaro targets analog quantum computing for AI data center integration within 10 years
Open Cosmos wins Ka-band spectrum, targets sovereign LEO networks over mass connectivity
MSP+ eyes 2026 growth with new Yangmei plant, advances in Micro LED and CPO
Mirle, UAT form robotics venture for global expansion
Samsung files injunction to prevent union from occupying chip facilities
India roundup: China's supply-chain squeeze tests India's industrial rise
Taiyo Yuden raises MLCC prices, Murata takes the lead, Samsung to follow suit
Toyota Corolla's standard ADAS raises global debate on subscriptions
Geely's AI-powered i-HEV challenges Toyota's hybrid dominance
AI agents are slipping past enterprise defenses
CFIUS kills Sanan's bid for Lumileds, adding to Chinese LED giant's mounting troubles
Corning leads glass substrate race as South Korea's KCC and LX Glass face steep challenges
Largan eyes FAU opportunity as smartphone downgrades loom
Wage protests in Northern India disrupt electronics output as Uttar Pradesh raises pay
H3C expands in Southeast Asia as Singapore emerges as a hub for Chinese AI vendors
Kemflo strengthens water resilience for semiconductor fabs
Taiwan networking firms post strong 1Q26 results on data center, Wi-Fi 7 demand
ASE's CoPos advanced packaging accelerates as Skytech and CMIt boost equipment deliveries
At 360° Mobility Show, Taiwan pushes integrated automotive future
BIZ FOCUS
Feb 9, 08:00
iCatch and DXOMARK Establish Taiwan's First Next Generation Imaging Laboratory
Friday 6 February 2026
2026 Market Outlook: Key Opportunities & Risks to Watch
Thursday 5 February 2026
Attopsemi Scales I-fuse Technology to 7nm following 12nm Silicon Success
Wednesday 4 February 2026
Teaching Machines to Feel the World TOUCH Lab Redefines Sensing
MOST-READ
TSMC plans 12 fabs in Arizona as supply chain shifts from passive to active
AI compression won't ease memory crunch, NAND shortage set to persist
China's memory capacity surge led by YMTC and CXMT shifts global supply in AI cycle
Samsung reportedly aims to begin silicon photonics mass production in 2028
TSMC eyes SiPh breakthrough as industry consensus forms
TSMC hints at next-gen LPU bid, stokes speculation that Samsung's Groq order may not last
Qualcomm moves into custom DRAM with CXMT for smartphones
MULTIMEDIA
Post Space-Comm 2026: Insights & Takeaways
TSMC 1Q26 earnings call
On April 16, TSMC held its earnings call for the first quarter of 2026.
TSMC revises advanced process and packaging strategy
TSMC chairman C.C. Wei denies customer favoritism regarding tight 1Q26 capacity
TSMC hints at next-gen LPU bid, stokes speculation that Samsung's Groq order may not last
...More
EV
Monday 2 March 2026
Europe's battery industry faces strategic setback as high costs and technology gaps cede ground to Asian rivals
Honda plans deeper China capacity cuts, targets Guangzhou and Wuhan plants
Friday 17 April 2026
Vingroup signs US$6.5 billion India investment framework with Maharashtra
Friday 17 April 2026
Stellantis, Microsoft ink five-year deal to scale AI, cybersecurity
Friday 17 April 2026
TECH
Thursday 26 February 2026
Is Nvidia's GTC mystery chip a 3D IC with memory stacked on the GPU?
Analysis: Intel, Musk advance TeraFab partnership, echoing Apple's TSMC shift
Friday 17 April 2026
Exclusive: Samsung weighs Vietnam semiconductor testing facility
Friday 10 April 2026
ChipX targets AI data center market with photonics, power chips ahead of Malaysia fab
Thursday 9 April 2026
ASIA
Monday 2 March 2026
Renesas names new India president to accelerate growth amid fierce engineering talent competition
Lens Technology swings to loss on weak smartphone demand, FX pressure
Friday 17 April 2026
Commentary: Robots are selling, but profits are not; data is the real prize
Friday 17 April 2026
Samsung's VD division reviews China strategy as local rivals gain ground
Friday 17 April 2026
OPINIONS
Monday 2 March 2026
Insight: Broadcom delivers 2nm 3.5D AI processor, expanding custom chip push against Nvidia
Analysis: Nvidia links RISC-V to NVLink with SiFive investment
Thursday 16 April 2026
Column: How do intelligent robots learn action skills?
Wednesday 15 April 2026
Exclusive: Edge AI inference set for 10x growth; Nokia, Blaize advance hybrid AI compute
Tuesday 14 April 2026
TOPICS
TSMC 1Q26 EARNINGS CALL
EMS WATCH
GEOWATCH
WEEKLY NEWS ROUNDUP
SPECIAL REPORTS
Friday 17 April 2026
Accelerating enterprise AI: Hardware advancements and compute architecture transformation
According to DIGITIMES, six major AI applications - chatbots, software development, image generation, video generation, enterprise operations automation, and manufacturing process automation - are increasingly being adopted by enterprises. The resulting s 4_s.jpg
Thursday 16 April 2026
Global Expansion of 2.5D/3D Packaging: Strategic Moves in the US, Asia, and Beyond
Major OSAT providers accelerate 2.5D/3D advanced packaging deployments in US, Japan, South Korea, and Malaysia with non-Taiwan capacity footprint to expand.
Wednesday 15 April 2026
Beyond Huawei: China's New H3C Leverages Former HP Roots to Dominate ASEAN Server Markets
Chinese top-3 server exporter, the New H3C, is seeing server export value expand, leveraging two major export routes to target ASEAN and Central Asian markets.
Thursday 9 April 2026
OpenClaw development and market status
OpenClaw craze accelerates personalized edge AI agent applications, driving demand for VPS and personal workstations.
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