DIGITIMES: News and Insight of the Global Supply Chain

LATEST STORIES

7 days news

SpaceXAI to use Nvidia Vera CPUs for faster agentic AI at scale

Aug 25, 09:02

SEMICONDUCTORS

IBM unveils dual-architecture mainframe chip to run Arm, z/OS, Linux workloads

Aug 25, 08:49

SEMICONDUCTORS

Nvidia memory demand widens the gap between SK Hynix and Samsung

Aug 25, 08:02

SEMICONDUCTORS

Broadcom's debt push signals AI compute is becoming Wall Street asset class

Aug 25, 08:06

ICT

AIDC eyes 2H26 lift from drones, jets

Zhongji Innolight's 1.6T surge shows AI networking is becoming next hyperscaler bottleneck

Inergy server share hits 47% on cooling, BBU demand

CNFI White Paper outlines solutions as labor, transformation, and energy headline Taiwan's industry hurdles

Hotai and Nan Yang cut Taiwan auto market outlook as risks linger

YouTube offers funding to keep creators from streaming with Netflix

Xiaomi taps TSMC to make chips for foldables, AI and autonomous driving

Etron chair sees memory boom extending to 2028-2030

TPK TGV pilot line to start by September, Thailand plant eyes 2027 ramp

AI energy bottleneck is driving semiconductor materials innovation, says Applied Materials

Advanced packaging substrates hit limits; ceramic cores rise to challenge glass materials

Nvidia's strikes US$6B licensing deal with Poolside to accelerate Nemotron models

Samsung's DRAM capacity lead shrinks as SK Hynix expands faster

Taiwan's Iron Force shifts airbag output to Poland, targets AI server component ramp in 2027

UAE weighs investment in 500 MW AI data center plan in Japan

Pixel 11 preorder surge lifts Google's Taiwan smartphone share

Nvidia reportedly weighs Perplexity investment as AI strategy expands beyond chips

German auto industry hardens stance against Chinese competition

Taiwan semiconductor materials hit golden opportunity

SK Hynix charts advanced HBM packaging path: hybrid bonding, Intel EMIB and 3D integration

Europe's struggling auto industry turns to China, drawing US scrutiny

Analysis: SK Hynix pushes beyond HBM with HBF and CPO

Rapidus 2nm ramp stays on track as Japan readies JPY150 billion investment

Fujifilm opens new post-CMP cleaner plant at Oita to meet AI chip demand

India weighs new capital subsidies to build domestic polysilicon capacity

Notebook brands shift production back to China as Southeast Asia costs rise

More news

BIZ FOCUS

Aug 24, 08:00

STMicroelectronics Unveils ISO 21780-Compliant 48V Pre-Driver with 8-Channel Flexibility

MOST-READ

MULTIMEDIA

Jensen Huang in Seoul: Faker, BBQ and one very awkward LG chairman

DIGITIMES has observed that Siri AI is built around four core layers - devices, models, reasoning, and applications - and is designed to transform Siri from a voice assistant into an AI agent capable of executing tasks.

In the second quarter of 2026, global server shipments were below prior expectations, growing 3.8% quarter-over-quarter. The main reason was tight supply of key components such as memory, CPU, and IC substrate, which curbed overall system shipment momentu

DIGITIMES notes that BYD Semiconductor's portfolio has expanded from the IGBTs and SiC power chips developed to meet early electric vehicle (EV) demand into high-computing-power smart-driving SoCs.