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CONNECT WITH US
Sep 1, 07:41
Commentary: Why America fell behind on Open models — and how Nvidia plans to close the gap
Sep 1, 07:08
Analysis: Tim Cook hands Ternus a slower-growing but far richer Apple than the one Steve Jobs left him
Sep 1, 07:40
Nvidia targets HBM race with custom NVHBM, expands NVLink Fusion
Sep 1, 07:40
Samsung weighs HBM4 bonuses as memory, foundry teams align
Sep 1, 08:54
Nvidia's MediaTek investment signals a broader push to shape AI infrastructure
LATEST STORIES
7 days news
China reportedly moves space computing from concept towards commercial deployment
Sep 1, 09:42
AEROSPACE
Taiwan clears Lam Research's NT$9.8 billion subsidiary injection as etch leader scales R&D worldwide
Sep 1, 09:41
SEMICONDUCTORS
Taiwan's G2C+ Alliance members target global markets
Sep 1, 09:28
SEMICONDUCTORS
SEMICON Taiwan 2026 to spotlight AI-driven semiconductor supply chain shifts
Sep 1, 09:16
SEMICONDUCTORS
Nvidia and MediaTek link AI technologies in bid to accelerate custom data center chip adoption
China's Xenomi LLM brings quantum computing into AI agent decision-making
AI server cooling specialist Nidec expands Vietnam capacity, forms liquid-cooling team
AI Macs, Part 2: Mac mini, Mac Studio gain enterprise AI ground; Apple still lacks the platform
Buima returns to profit in the second quarter on battery module demand
Taiwan workplace AI use reaches 96% as employers push skills upgrades
Humanoid robots gain a sense of touch, lifting tactile sensor adoption above 60%
Taiwan manufacturing moves into the prosperity zone as US export growth slows
Acme sees years of SiC growth as data center demand builds
OpenAI compresses Jalapeno design to 9 months
Luxnet eyes orders through 2028, DCI revenue set to double in 2027
Kaimei sees 2H26 momentum strengthen as AI demand lifts orders and resistor price hikes take effect
Silergy data center business surges as new products scale up
LGD launches PFAS exit roadmap, targets full phaseout by 2035
Samsung is said to develop 8-layer HBM4E for Nvidia's NVHBM push
Chinese OSAT earnings surge on AI packaging demand, but recurring profit tells a narrower story
China specialty foundry XMC plans fourfold capacity growth around 3D integration, silicon photonics
SK Hynix explores Intel as second source for HBM base dies
John Ternus takes over an Apple with one growth engine, no obvious second
Nvidia takes US$3.5 billion of MediaTek's record US$3.9 billion convertible bond
China urges pragmatism over hype in rapidly expanding humanoid robotics market
Smart manufacturing, robotics drive renewed growth in industrial PCs
Taiwan drone bill dispute leaves NT$240 billion procurement plan in limbo
Gudeng sees double-digit advanced packaging growth from 2027
U-Best races to launch PFAS-free coatings by 1Q27
Marvell sees 2027 acceleration in scale-up optics
More news
BIZ FOCUS
Aug 31, 08:00
NewPower Worldwide expands credit facility to $750M for growth
Monday 31 August 2026
Tescan Connects Buried Defect Localization to Nanoscale Analysis at SEMICON
Thursday 27 August 2026
ASMPT Showcases Advanced Packaging Innovation at SEMICON Taiwan 2026
Tuesday 25 August 2026
Conquer Advances Circuit Protection for AI Power With 50 Years of Expertise
MOST-READ
Exclusive: Musk pushes US solar supply chain upstream as polysilicon ambitions emerge
2027 memory capacity reportedly sold out as buyers quietly lock in supply
Tungsten prices surge sixfold as US-China restrictions tighten supply for chips, aerospace, defense
Interview: Nvidia exec on progress of CPO production and pluggable optics
OCP APAC 2026: TSMC tackles CoWoS material risks while cutting 3DIC development cycle to one year
Google's v10 TPU opens door to AMD without sidelining Broadcom, MediaTek
Nvidia Feynman pushes TSMC A16 and CPO ramp
MULTIMEDIA
Jensen Huang in Seoul: Faker, BBQ and one very awkward LG chairman
The end of the Tim Cook era at Apple
After a 15-year tenure, Apple CEO Tim Cook is stepping down on September 1, 2026, and handing the reins to hardware veteran John Ternus.
John Ternus takes over an Apple with one growth engine, no obvious second
The architect of Apple's China machine also built its hardest problem
Cook made sustainability an Apple feature; the ledger he leaves John Ternus is mixed
...More
EV
Wednesday 29 July 2026
Chinese brands seize 25% of Europe midsize SUV sales as BEV demand surges
The 72.4% dominance: China's battery lead is now a chemistry problem for South Korea
Monday 31 August 2026
Commentary: Malaysia's China dilemma sits at the heart of GATE 2026
Monday 31 August 2026
Chinese robotaxis head for Seoul as Pony.ai and FutureLink plan a 200-vehicle fleet
Monday 31 August 2026
TECH
Monday 31 August 2026
The architect of Apple's China machine also built its hardest problem
Apple is only the test: Chinese memory makers CXMT, YMTC target North American cloud market
Wednesday 26 August 2026
Samsung, SK Hynix step up China NAND upgrades as US tool risks grow
Tuesday 25 August 2026
MediaTek wins Google TPU deal on three key strengths
Monday 24 August 2026
ASIA
Thursday 30 July 2026
China's 28nm DUV lithography enters fab validation, reportedly guided by State Council-level experts
Unimicron stock prices fall 10% daily limit, says origin probe covers PCBs, not substrates
Monday 31 August 2026
SK Hynix explores Japanese expansion to meet global AI chip demand
Monday 31 August 2026
The 72.4% dominance: China's battery lead is now a chemistry problem for South Korea
Monday 31 August 2026
OPINIONS
Monday 31 August 2026
Commentary: Malaysia's China dilemma sits at the heart of GATE 2026
Interview: Taiwan's National Atomic Research Institute eyes SMRs for AI power shift
Monday 31 August 2026
Commentary: China's robot games offer Taiwan a reality check
Saturday 29 August 2026
Exclusive Interview: Turning scale into value — AUO chair's post-LCD ambition
Saturday 29 August 2026
TOPICS
THE END OF THE TIM COOK ERA AT APPLE
TSMC UPDATES
STEVE JOBS
TRENDS IN INDUSTRIAL COMPUTING
SPECIAL REPORTS
Friday 28 August 2026
AI data center 800VDC power architecture takes shape; future hurdles require balancing multiple key factors
DIGITIMES believes that 2026 will be a pivotal year in the stabilization of 800VDC power architectures for AI data centers.
Wednesday 26 August 2026
Growth in low-Earth-orbit satellite communications accelerates; further boosts demand for GaN components
DIGITIMES has observed that since SpaceX began using reusable rockets for launch missions, its payload capacity has continued to rise.
Tuesday 25 August 2026
Chinese automakers expand to humanoid robotics with technology, supply chain and scenario advantages
DIGITIMES observes that the humanoid robot market is expanding rapidly, supported by global labor shortages and advances in artificial intelligence (AI), and Chinese automakers are also moving aggressively into this emerging field.
Monday 24 August 2026
Siri AI taps Google Gemini LLM technology, with future development focused on deep third-party app integration
DIGITIMES has observed that Siri AI is built around four core layers - devices, models, reasoning, and applications - and is designed to transform Siri from a voice assistant into an AI agent capable of executing tasks.
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