As AI workloads scale across global cloud infrastructure, chip designers face a persistent challenge: balancing compute throughput, bandwidth, and power efficiency amid escalating design complexity.Emerging architectures built around UCIe-based chiplets, PCI Express 7.0 and CXL 3.1 interconnects, and 2.5D/3D memory-integrated packaging have made integration-not computation-the new bottleneck.Progate Group Corporation (PGC, TPEx: 8227), a member of TSMC DCA, leverages its long-term partnership with Synopsys to solve that bottleneck.Through a unified ASIC turnkey flow, PGC enables innovators to design, verify, and manufacture advanced-node SoCs and chiplet-based accelerators for cloud and AI applications with greater efficiency and lower risk.PGC integrates the latest generation of Synopsys Interface IP, spanning high-speed interconnects, memory, and networking subsystems critical to modern cloud and AI processors.The portfolio includes UCIe 40G Die-to-Die, CXL 3.x, and PCI Express 7.0 controllers that enable seamless chiplet-based compute integration for next-generation server processors.It also incorporates HBM4 and DDR5 Gen2 memory subsystems optimized for multi-stack 2.5D and 3D integration, as well as 224G Ultra Ethernet PHY solutions designed for high-throughput data-center networking.Validated across TSMC 3nm to 2nm process nodes, these silicon-proven IPs address the cloud industry's most demanding bandwidth and power-efficiency challenges while maintaining full compatibility with Synopsys EDA and PDK environments.Through its TSMC Design Center Alliance (DCA) membership, PGC provides a verified turnkey service covering RTL design, APR layout, wafer fabrication, 2.5D/3D packaging, and final test coordination.By integrating Synopsys EDA tools (Design Compiler, Fusion Compiler, ICC2, PrimeTime) and complete IP deliverables (Lib, LEF, GDS, and testbench models), PGC helps customers accelerate RTL-to-signoff cycles through pre-verified IP subsystems, SIPI (signal and power integrity) analysis, and IP hardening support-as described in Synopsys' IP Accelerated methodology.This unified approach reduces integration risk, minimiclozes manual iteration, and ensures design closure consistency across advanced-node ASIC projects."Cloud and AI systems are evolving into distributed compute platforms built on multiple dies and protocol layers," said Fred Lai, CEO of PGC."By aligning Synopsys' IP Accelerated methodology with TSMC's leading-edge processes, PGC helps customers scale performance while maintaining design predictability and manufacturing reliability."Unlike large turnkey providers that concentrate solely on a handful of mega-scale clients, PGC combines advanced-node design capability with engineering agility, making it a trusted partner for both hyperscalers and rapidly growing AI startups.Beyond simplifying multi-vendor coordination, the company maintains unified technical accountability across design, IP integration, and manufacturing, ensuring that every stage of development proceeds seamlessly.PGC's engineers perform SIPI co-optimization using Synopsys EDA and PDK models to guarantee signal and power stability, while TSMC-certified signoff flows deliver predictable yield and reliability.Supported by cross-regional teams in Taiwan, Japan, China, and the United States, PGC provides rapid collaboration and execution across the entire ASIC turnkey cycle.PGC's ecosystem extends from design integration to manufacturing, combining TSMC's advanced-node foundry services, Synopsys' comprehensive IP portfolio, and partnerships with leading OSAT partners for 2.5D/3D packaging enablement.Together, this network provides a complete foundation for high-bandwidth, energy-efficient ASIC innovation across AI, HPC, and cloud computing markets.

Global Unichip Corp. (GUC), the Advanced ASIC leader, and Ayar Labs, a leader in co-packaged optics (CPO) for large-scale AI workloads, have announced a strategic partnership to integrate CPO into GUC's advanced ASIC design services.This collaboration paves the way for high-bandwidth, low-latency, power-efficient optical interconnects in next-generation AI, HPC and networking applications where electrical signaling is reaching its limits. By integrating Ayar Labs'TeraPH optical engines into GUC's advanced packaging and ASIC workflow, the companies are exploring critical areas to enable future CPO deployment."The CPO revolution is at our doorstep. Integrating Ayar Labs'optical engines into our advanced packaging flows is a critical step," said Igor Elkanovich, CTO of GUC. "Our new joint design allows us to address the challenges of CPO integration - architectural, power and signal integrity, mechanical and thermal - ensuring our future customers have access to a robust, high-bandwidth and power-efficient solution."The new XPU multi-chip package (MCP) design replaces traditional electrical interconnects with Ayar Labs'optical engines attached directly to the MCP organic substrate. This architecture enables more than 100 Tbps full-duplex optical interface from the XPU package, more than an order of magnitude improvement over current XPUs.UCIe-S (64 Gbps) provides bandwidth between the optical engines and I/O chiplets over the MCP substrate, while UCIe-A (64 Gbps) is used for communication between the I/O chiplet to the main AI die over local silicon interconnect (LSI) bridges. The design also addresses signal and power integrity challenges associated with the large-scale package. Thermal optimization is done at the XPU MCP level, and a new stiffener design incorporates optical engines' requirements and enables detachable fiber connections while meeting mechanical stress and warpage requirements."The future of AI and data center scale-up will not be possible without optics to overcome the electrical I/O bottleneck," said Vladimir Stojanovic, CTO and co-founder of Ayar Labs. "Working with GUC on advanced packaging and silicon technologies is an important step in demonstrating how our optical engines can accelerate the implementation of co-packaged optics for hyperscalers and AI scale-up."GUC will share more about these technology advancements during a presentation titled "Advanced Packaging Technologies for Modular and Powerful Compute" at the 2025 TSMC Open Innovation Platform (OIP) Ecosystem Forum in Hsinchu, Taiwan, on Tuesday, Nov. 18, 2025.For more information about GUC.For more information about Ayar Labs.

As Taiwan faces demographic challenges from a declining birthrate, the food and beverage (F&B) industry is struggling with severe labor shortages. While digital technologies and automation offer solutions for improving operational efficiency and customer satisfaction, many small and medium-sized eateries - such as breakfast shops and family-run restaurants - still rely on manual processes due to limited budgets. This manual process is slow, error-prone, and struggles to meet rising consumer expectations, making it difficult for small businesses to compete with major chains.DotDot Global addresses these challenges with its one-stop F&B technology solution, integrating online ordering, self-checkout, AI queue management, multiple payment options, membership management, and data analytics. This solution enables restaurants to embrace mobile payment trends, streamline workflows, reduce staffing needs, and enhance customer experiences. To date, DotDot Global has successfully implemented its system in more than 15,000 restaurants across Taiwan.According to Ting Hsieh, CEO of DotDot Global, the company's AI Store Manager replaces traditional manual ordering and checkout procedures, enabling restaurants to achieve front-of-house automation. The AI Store Manager includes intelligent ordering, AI-powered queue calling, and Taiwan's first unified cross-domain payment platform that integrates "points, cash, and coupons." It allows flexible use of loyalty points and discounts while seamlessly connecting credit cards, cash, and digital payments. As a result, restaurants can operate efficiently with minimal staffing - sometimes even with just one person running the entire store.Leveraging AWS cloud services to accelerate innovationDotDot Global's solutions are powered by Amazon Web Services (AWS) and built on AWS IoT Core, which provides two-way communication for real-time monitoring of connected devices worldwide. Through Over-the-Air (OTA) remote updates, the company can upgrade system functions or apply security patches to all devices across Taiwan in under 30 minutes - without dispatching engineers. This significantly reduces maintenance costs while ensuring that every client location has immediate access to the latest features, helping restaurants maintain a competitive edge in the fast-evolving F&B technology landscape.Hsieh explained that since entering the F&B technology space, DotDot Global has continuously gathered feedback from restaurant operators to guide product development. The newly launched AI Store Manager integrates multiple AI applications such as voice queue announcements, on-screen notifications, and adaptive prompt customization based on call frequency or style. Additionally, the system can analyze customer behavior and restaurant sales data using AI, providing insights for menu optimization and combo meal recommendations to improve profitability.Building a cross-domain ecosystem with the Unified Payment Interface (UPI)As mobile payment tools continue to diversify, DotDot Global introduced its Unified Payment Interface (UPI) to foster a new, cross-domain payment ecosystem. With a single integration, business partners can support all payment scenarios - from online to offline, cash to digital. DotDot Global is collaborating with POS system providers, vending machine operators, self-checkout solutions, currency exchange kiosks, and claw machine vendors to expand the ecosystem, generating new traffic and value for its partners.Hsieh added that through participation in the Startup Terrace Kaohsiung AWS Joint Innovation Center (JIC) project, DotDot Global has strengthened collaboration with local industries in Kaohsiung, including parking operators, vending businesses, and F&B brands. The company has also integrated with Agrigo, a cloud-based agricultural e-commerce platform, to enable innovative supply chain payment scenarios. Furthermore, DotDot Global is actively promoting its AI Store Manager and smart restaurant solutions in southern Taiwan, with notable adoption by the well-known Kaohsiung eatery Lao Er Pork Hock on Rice.

The rise of generative AI is accelerating digital transformation across traditional industries, and the construction sector is no exception. In an industry long dependent on hands-on expertise and experience sharing, construction companies face mounting challenges including labor shortages, rising costs, project delays, and increasingly stringent regulatory requirements. To address these issues, Shipeng Technology has developed an end-to-end smart construction solution centered on a "Digital Twin + AI Platform," powered by the robust computing capabilities of Amazon Web Services (AWS).Integrating AI, cloud, and digital twin technologies to drive smart constructionAccording to Shibo Lin, founder of Shipeng Technology, the company's core solution revolves around three key pillars: visibility, precision, and control. Covering the entire project lifecycle - from design and construction to operation and maintenance - it establishes a comprehensive digital twin management process. By replacing traditional 2D blueprints with 3D BIM (Building Information Modeling), design conflicts can be identified and resolved before construction begins. The AI platform integrates material and scheduling data, allowing on-site teams to query project progress and cost details using natural language. In addition, AR and sensor technologies enable real-time comparison between physical structures and digital models, ensuring quality and progress remain aligned. The result is a significant reduction in human error and delay risks, along with enhanced data-driven decision-making capabilities.Shipeng Technology leverages AWS cloud computing, AI/ML platforms, and IoT services to handle the massive volume of construction data and 3D model computations. By integrating sensor, image, and progress data in the cloud, the company builds high-precision digital twins that remain perfectly synchronized with the physical site. This architecture not only ensures flexibility, scalability, and security but also enables rapid model updates and data processing within minutes - greatly reducing operational costs and accelerating project delivery. Lin emphasized that AWS's global cloud infrastructure allows the team to focus on application innovation and AI model optimization, truly realizing the vision of bringing "smart construction from cloud to job site."Real-world projects demonstrate efficiency gainsIn a recent major construction project, regulatory changes required a complete redesign. Traditionally, the revision process would take four months. With Shipeng Technology's BIM solution and AWS support, the team completed the entire update and validation in just one week, reducing the timeline by over tenfold and saving substantial downtime costs.In another project, the Startup Terrace A6 Tower in Linkou adopted Shipeng Technology's digital asset management system. Tasks that once took three months - such as inventory verification - are now completed within five to ten minutes. Supported by AWS's real-time data integration and high-performance computing, the platform enables project managers to monitor on-site progress and asset conditions seamlessly. Lin noted that Shipeng Technology aims to make every data point from construction sites actionable, turning real-time insights into the foundation for smarter decisions.From Taiwan to the world: building a cloud ecosystem for smart constructionThrough its participation in the Startup Terrace Kaohsiung AWS Joint Innovation Center (JIC) project, Shipeng Technology established a presence in Kaohsiung's Startup Terrace and gained access to extensive local industry resources. The project's matchmaking and mentoring programs have helped the company connect with construction partners in southern Taiwan and refine its business presentation and client engagement capabilities. Lin remarked that this industry collaboration model - combining local partnerships with cloud-based coordination - not only accelerates digital transformation in southern Taiwan's construction industry but also strengthens Shipeng Technology's local market foothold.While deepening its presence in Taiwan, Shipeng Technology is actively expanding internationally. Following its strategy of "Taiwan R&D, Japan validation, and global deployment" , the team recently participated in a global startup competition and secured collaboration opportunities with Japanese partners to deploy smart construction solutions overseas. Given Japan's strong demand for construction automation and ESG management, the market serves as the company's first step toward globalization. Moving forward, Shipeng Technology will continue to establish international standards for smart building practices and bringing its digital construction technologies to the world.

Axelera AI is a startup targeting Edge AI applications. Leveraging its Metis AI Processing Unit (AIPU) chip, embedded hardware AI inference acceleration cards, and Voyager SDK software solutions, the company specializes in imaging application solutions for applications in edge nodes. Unlike AI systems developed in high-density cloud data centers, Edge AI computing offers energy efficiency, information security, low latency, and fast speed of response, rapidly powering real-time vision and smart detection applications for embedded AI systems.Axelera AI's technology offerings span 4K/8K image resolution real-time image recognition, security surveillance, campus safety, and drone imaging, pioneering a new model for the development of high-performance AI inference in diverse fields. The company's Metis chip boasts a computing performance of up to 214 TOPS (TeraOPS) of inference performance at INT8 precision. For example, using ResNet-50 Convolutional Neural Network (CNN) model doing object segmentation and analysis, a single Metis chip can achieve a high processing speed of 3200 frames per second (FPS), providing stable, real-time analysis capabilities while consuming only approximately 10W. This balance of performance and environmental benefits has attracted significant market attention.Meanwhile, the AI inference acceleration cards integrated with Metis chips are also a major product line. There are two types of accelerator cards that support M.2 and PCIe interfaces, which can quickly meet the needs of system integrators, OEM customers and industrial PC (IPC) makers. With these flexible connection interface, Axelera could engage the business with various embedded AI system makers.In addition to the hardware lineups, Axelera's software support is also a key factor in its success. The Voyager SDK software suite facilitates hardware and software integration for system integrators. There are open source software framework currently available on GitHub for computer vision and enabling customers to solve their AI business requirements. This Voyager SDK comes with a Model Zoo, a catalog of turnkey AI models, allowing customers either to import their own AI models or choose from Model Zoo models. These offerings significantly reduce developing time and excels in functional completeness and efficiency.Axelera AI's business model is based on collaboration with system integrators and OEM clients, encompassing joint development of AI projects and customized data architectures, providing clients with one-stop, high-performance Edge AI solutions. Axelera AI is working closely with major Taiwanese industrial PC vendors and OEM/ODM clients to develop key applications for financial and research institutions, medical solution providers and other public facilities that prioritize data security, privacy, and safety. This initiative aims to create emerging applications for Edge AI and unlock its significant value.

Empowered by the Startup Terrace Kaohsiung AWS Joint Innovation Center (JIC), eNeural is redefining the landscape of edge AI with two flagship innovations - AI-Craft, an automated AI development platform, and an edge AI self-learning solution. These breakthroughs aim to make AI truly self-learning and self-evolving, helping industries overcome long-standing barriers in deploying AI at the edge.As AI applications rapidly expand across industries, enterprises have realized that beyond computing power, the biggest barriers to AI implementation lie in the high cost and lengthy cycle of model training. For system integrators, success increasingly depends on the ability to integrate optimized AI models into lightweight edge devices to deliver reliable inference services in real time.A spin-off startup from National Yang Ming Chiao Tung University (NYCU), eNeural combines strong academic research foundations with practical AI R&D experience. The company has already forged partnerships with major electronics manufacturers including Quanta, Compal, and Lite-On, and is collaborating with a North American e-commerce logistics fleet on developing an AI-based collision warning system.According to eNeural CEO Eric Huang, edge devices are typically designed to be small, lightweight, and energy-efficient, which makes AI model optimization particularly challenging. "Our AI-Craft platform provides a one-stop, modular, and standardized AI development workflow," said Huang. "It allows developers to automatically generate optimized models as efficiently as products rolling off an intelligent production line."Edge AI self-learning accelerates model optimization and reduces costsFounded in 2022, eNeural focuses on proprietary AI technology R&D, with AI-Craft serving as the backbone of its innovation. The platform integrates four key technology modules - automated annotation, model pruning, model quantization, and generative AI data augmentation - to make AI development faster, more scalable, and more energy-efficient.Using pre-trained AI models and advanced image analysis algorithms, AI-Craft boosts data labeling efficiency by 10 to 100 times, significantly shortening AI project launch time. Model pruning removes redundant parameters to enhance computational efficiency by up to 90% without compromising accuracy, while reducing the memory and processor load.Model quantization converts floating-point operations into 8-bit, 4-bit, or even 2-bit precision, dramatically lowering power consumption and enabling smooth deployment of AI models on compact edge devices. Meanwhile, generative AI data augmentation automatically creates training data for rare yet critical conditions - such as night, rain, snow, or backlight - improving AI model robustness and generalization.Traditionally, AI models deployed on edge devices must send large amounts of data back to the cloud for retraining - a process that consumes time and resources. eNeural's Edge AI Self-Learning technology allows models to learn and recalibrate autonomously in real time, reducing the need for cloud data transfer."For example," Huang explained, "when fleet vehicles operate under different weather, lighting, or road conditions, the AI model can automatically adjust its decision logic to maintain accuracy. With federated learning, training results are securely shared across thousands of vehicles." This innovation reduces retraining cycles from months to weeks and significantly lowers AI operation and maintenance costs.AWS JIC Accelerates cloud transformation and strategic collaborationSince joining the AWS JIC in 2025, eNeural has leveraged the expertise of AWS specialists to upgrade its AI-Craft platform using Amazon SageMaker, a fully managed machine learning (ML) service, and Amazon Elastic Compute Cloud (Amazon EC2) GPU computing power. This transformation has turned AI-Craft into a cloud-based development solution, enabling developers to perform automated annotation, model pruning, and quantization in the cloud. With dynamic AWS resource allocation, eNeural can efficiently run multiple AI projects in parallel with greater scalability and cost efficiency.Participation in the AWS JIC program has also opened doors for new business collaborations. Huang shared that while earlier partnership talks with Advantech did not progress, joining the AWS JIC program led to the successful signing of a Memorandum of Understanding (MOU) between the two companies in 2025. Under this collaboration, eNeural will feature its two flagship AI solutions on Advantech's Marketplace, paving the way for deeper engagement with system integrators worldwide.Beyond Taiwan, eNeural is actively expanding into the U.S., Japan, and India. Leveraging AWS's global cloud infrastructure and innovation ecosystem, the company is pursuing a "software-driven core + hardware collaboration" strategy, collaborating with global players to unlock new opportunities in the rapidly growing edge AI market.

As businesses face dramatic changes in the global market environment, companies worldwide are accelerating their digital transformation efforts, seeking competitive advantages through innovative technologies. Yet, while many departments have embraced automation, legal teams often remain the slowest to digitalize. Manual contract review still dominates daily operations, with a single document taking one to two weeks to pass from sales to legal approval.Such delays not only disrupt decision-making but also affect overall business performance. Addressing this long-standing challenge, LegalSign.ai has launched an end-to-end generative AI legal workflow management platform that accelerates contract and document review with precision and transparency, fundamentally redefining corporate legal operations.According to Chih-Tung Chen, CEO of LegalSign.ai, lengthy manual reviews often force companies to ship products before contracts are finalized - taking on significant legal risk just to maintain business momentum. To tackle these inefficiencies, LegalSign.ai's cross-disciplinary team of legal and AI experts has created a one-stop generative AI legal workflow platform that resolves these long-ignored bottlenecks. The solution is already trusted by leading enterprises such as Acer, CTBC Bank, Cathay Financial Holdings, and ezTravel, proving its value across industries.Integrating legal expertise and generative AI to address three core challengesFounded in 2019 by experienced lawyers and patent attorneys with over 25 years of combined practice, LegalSign.ai operates across Taiwan, the United States, and China. The company's founding mission is to ensure that "legal work is no longer an island buried in paperwork." By combining deep legal expertise with generative AI, LegalSign.ai transforms legal operations into a streamlined, digital, and automated process, helping enterprises manage contracts and risks more efficiently and intelligently.LegalSign.ai's all-in-one platform addresses three major pain points for legal departments - workflow management, compliance auditing, and risk control. Through generative AI, the platform digitalizes the entire contract lifecycle, covering drafting, review, negotiation, signing, execution, archiving, retrieval, and risk management. This comprehensive approach enables enterprises to significantly improve productivity while cutting costs and mitigating legal exposure.Chen explained that the platform integrates three core capabilities: generative AI-powered compliance management, legal workflow lifecycle management, and electronic signature services. For instance, the AI assistant draws on a library of over 400 contract templates to generate legally sound drafts, minimizing hallucinations or logic errors. It can also translate and compare documents, automatically highlighting high-risk clauses to assist in compliance monitoring.Building trustworthy legal AI services on AWSFollowing its recognition with the AWS Generative AI Rising Star Award in 2024, LegalSign.ai joined the Startup Terrace Kaohsiung AWS Joint Innovation Center (JIC) program in 2025 to further expand its visibility and pursue new business collaborations. The company is implementing Amazon Elastic Compute Cloud (Amazon EC2) to leverage cloud GPUs for enhanced AI computation and inference efficiency, aiming to deliver trusted, enterprise-grade legal AI cloud services globally through AWS cloud infrastructure.Chen emphasized that legal AI differs from typical generative AI applications due to its high data sensitivity and territorial restrictions. Given ongoing data security and regulatory concerns in China, Taiwan has emerged as a trusted hub for legal AI solutions serving international enterprises. Leveraging AWS's global cloud infrastructure, LegalSign.ai is executing a "Chinese-language legal AI + AWS Cloud" strategy to bring Taiwan's legal technology to the world. The company's initial overseas expansion targets Japan and the United States, with current collaboration focused on a bilingual legal AI platform serving multinational corporations.

HQ Pack is a global leader in high-tech packaging solutions. The company is expert at designing, producing, (precision) cleaning, and making packaging solutions reusable again after use, as well as manage the packaging logistics of high-quality industrial products. They do so for clients in the semiconductor and other high-tech industries.The process procedures and packaging solutions ensure the parts, modules or components of highly sophisticated equipment are fully protected during transportation and logistical arrangements. And at the same time, the system will meet the customer demand for protection of valuable products during transit while adhering to environmental, social, and governance (ESG) principles. The packaging design incorporates features like sustainable materials, waste reduction strategies, and carbon footprint minimization, alongside ensuring the integrity of high-value goods through robust physical protection.The company provides complete packaging solutions, starting with the development and sourcing of customized packaging materials. HQ Pack's regional Service Centers ensure that reusable packaging materials are ready to use again by cleaning and repairing them to like-new condition. They can also support reuse of parts by harvesting them before scrapping for new build packaging. If there is material destined for waste management, HQ Pack supports this at the same time. Because most of its high-tech clients operate on a global scale, HQ Pack operates not only at its headquarters in Eindhoven, the Netherlands, but also in Johor and Penang in Malaysia, Taiwan, Singapore, Germany, and in the United States (locations in Brookfield (CT), Newark (CA), and San Diego (CA)) providing the same quality and service at each location. With their Service Centers they support both their customers' sustainability goals as well as their own.Their slogan "We Create to Protect" is exactly what they do. The high-quality packaging solutions ensure that valuable and fragile products, modules, components and/or parts can be safely transported worldwide. With over 40 years of experience and global presence, no compromission on quality, flexibility at the heart of our organization, they are a full-service provider with fast, reliable and sustainable packaging solutions.

Founded in 1993, Prodrive Technologies designs and manufactures mission-critical products that combine advanced engineering, innovative manufacturing, and global expertise. The company empowers semiconductor equipment manufacturers and customers across multiple industries to accelerate innovation and achieve operational excellence.Headquartered in the Netherlands, with regional hubs in the USA, Japan, and China, Prodrive Technologies serves the semiconductor, medical, life sciences, energy, infrastructure, and industrial markets. Its customer-centric approach, deep engineering expertise, and vertically integrated manufacturing enable fast time-to-market, superior quality, and scalable systems.The company's portfolio spans optical and e-beam cameras, embedded computing systems, high-precision motion control and drives, and RF plasma power solutions. These offerings are available as off-the-shelf products, customized systems, or turnkey solutions.With its broad product range, flexible business model, and decades of experience in the semiconductor sector, Prodrive Technologies is now also exploring opportunities in Taiwan. As home to the world's largest semiconductor foundry and a growing ecosystem of equipment manufacturers, Taiwan represents a potentially strategic market where Prodrive's innovation, quality, and speed-enabled by its unique vertical integration-can create significant value.

Founded in 1987, Boschman Technologies B.V. is a manufacturer of sintering equipment and transfer molding technology for advanced packaging of automotive and industrial power modules, MEMS sensors. In addition to its headquarters in the Netherlands, the company has operations in Singapore and China Suzhou. The key technologies of Boschman are silver sintering and Film Assisted Molding (FAM). Boschman uses a pressurized silver sintering process in module packaging to address the stringent challenges and difficulties of power module interconnect technology.The power module market is experiencing substantial growth in Europe and China, driven by the accelerating adoption of electric vehicles (EVs), expansion of renewable energy systems, and increased demand for energy-efficient industrial and consumer electronics. The power modules require sophisticated packaging for high-temperature, high-power, and high-reliability connections. The FAM technologies for protection against harsh environments like high humidity and vibration, as well as to manage thermal and electrical stress. On the other hand, silver sintering offers superior thermal and electrical conductivity compared to traditional soldering process, while FAM with its vacuum-assisted films prevents voids during molding, leading to more reliable and high-performing power modules with better thermal management.Boschman began its journey by developing and manufacturing module packaging molds, then expanded into the research and development of silver sintering packaging equipment. And the company continues to invest in and develop advanced packaging technologies. Boschman specializes in serving the global electronics assembly and semiconductor back-end packaging industries, providing advanced sintering equipment using advanced high-pressure sintering technology. Specifically tailored to the needs of customers of varying sizes and production scales, Boschman's sintering equipment offers a variety of solutions suitable for R&D doing small batches, small- to medium-volume pilot production, and large volume manufacturing environments.Boschman has many years of experience in cooperation with Taiwanese industries, especially in power electronics and components manufacturing service vendors that provide power management, power electronics, and thermal solutions. Among the new business opportunities, OSAT (Outsourced Semiconductor Assembly and Test) companies serve a broad range of semiconductor clients, is one of the key types of customers in Taiwan for Boschman. OSAT customers are providing back-end packaging services such as Tire Pressure Monitor Sensors (TPMS) and other automotive sensors for customers, which has enabled Boschman to gain the benefits.Talking about the business model, Boschman provides customers with packaging design and development, as well as silver sintering process equipment to meet the needs of the automotive supply chains and power system industries. It also provides design proofing and small-batch assembly production services to customers. One more thing, Boschman and Powertrim Technologies, another Dutch company exhibiting at the Netherlands Pavilion, have a collaborative upstream and downstream relationship. These two companies collaborate in the manufacturing of automotive and power module systems in Europe, jointly serving leading Auto and industrial customers.