Mecademic Industrial Robotics, a Montreal-based robot manufacturer in Canada, is redefining the landscape of precision manufacturing through its pioneering work in micro-automation. At the heart of their innovation is the Meca500, a six-axis industrial robot designed with a footprint so compact that it matches the size of a standard sheet of letter paper when in its shipping pose. "Everything that has gone into this design has been aimed at achieving the highest possible precision," said Naveen Krishnan, Director of Application Engineering at Mecademic. "For us, five microns is the ultimate goal." While traditional industrial robots often rely on bulky external cabinets, Mecademic's architectural simplicity integrates the controller directly into the robot's base. This plug-and-work system eliminates the need for large external hardware, saving critical floor space in capital-intensive environments like clean rooms.Unmatched PrecisionMecademic specializes in micro-automation, addressing a market segment that requires extreme precision in a small footprint. Their flagship Meca500 achieves a repeatability of five microns - thinner than a red blood cell. According to Naveen Krishnan, this level of precision is the result of a "ground-up" design philosophy. Unlike systems built from commercially available off-the-shelf (COTS) components, Mecademic vertically integrates its mechanical, electrical, and software designs, using specialized harmonic drives and high-precision encoder systems to ensure reliability and performance.An Open and Accessible ArchitectureAs noted above, one of the company's most significant innovations is the integration of  the controller directly into the robot's base, eliminating the need for bulky external cabinets. This "plug-and-work" architecture allows system integrators to replace complex, fixed Cartesian systems with a  single, more flexible manipulator.Furthermore, Mecademic has adopted an open, language-agnostic approach to programming. Instead of forcing users to learn proprietary languages, the robot can be operated via a TCP/IP interface using modern languages like Python or C#. This lowers the barrier to entry for New Product Introduction (NPI) teams and process engineers who may not be traditional automation experts. For industrial users with a requirement for industrial real-time fieldbus protocols, there is native support for Ethernet/IP, EtherCAT, and Profinet built into the standard system.Targeted Applications and Market StrategyMecademic targets high-tech verticals where miniaturization is the dominant trend, specifically within the semiconductor, medical device, and optics sectors. The Meca500 is particularly effective for tasks that involve handling very small parts typically managed by human operators using tweezers under a microscope, such as assembling medical implants or characterizing sensors. To further address niche demands, the company introduced the Meca500-OB, which uses specialized finishes and light-absorbing materials to reduce reflectivity during sensitive measurement tasks involving lasers and interferometers.Key industries include: 1. Electronics & Semiconductors: Handling small parts for testing, assembly, characterization, and sensor validation. 2. Life Sciences & MedTech: Lab automation, sample handling (microplates/vials), and medical device assembly. 3. Optics & Photonics: Sensitive measurement tasks using the Meca500-OBto prevent reflectivity during laser interferometry.Looking Toward COMPUTEX 2026As Mecademic prepares for the InnoVEX, the company aims to educate the market on how micro-automation can bridge the gap between manual labor and full-scale industrial robotics. Philippe Beaulieu, CEO, and Ammon Liu, Sales Director ASEAN, are expected to represent the firm in Taipei.By replacing capital-intensive manual processes with repeatable, high-throughput robotic solutions, Mecademic provides the essential hardware platform necessary for the next generation of AI-driven, high-precision manufacturing.

As the global technology industry descends on Taipei for COMPUTEX 2026 this June, a Canadian startup is preparing to challenge the fundamental architecture of modern processing. Irreversible, a Montreal-based firm with deep roots in quantum computing, is unveiling a "physics-first" analog in-memory computing architecture that promises a staggering 1,000x reduction in power consumption compared to conventional digital processors.Unlike many silicon startups that originate in traditional chip design, Irreversible’s journey began in the highly constrained world of quantum physics. The core team originally specialized in quantum computing, where they were forced to solve computing problems within the extreme limitations of a dilution refrigerator - an environment where even the slightest heat or noise can destroy a fragile quantum state. Co-Founder Dominic Marchand explains that this background led them to become a "computing company that found its way to designing chips," rather than the reverse. This unique DNA pushed the team to strip away decades of architectural abstractions and return to the most basic laws of physics to find the most energy-efficient ways to process information.The current industry obsession with massive Large Language Models (LLMs) has created a significant energy crisis, particularly at the "extreme edge" where devices must operate on microwatt-class power. Irreversible addresses this by sidestepping the Von Neumann bottleneck, the energy-intensive movement of data back and forth between memory and the processor. By performing calculations directly in memory and maintaining a fully analog signal path, Irreversible also eliminates the power-hungry digital-to-analog conversions that often limit hybrid AI chips. This approach recognizes that while digital logic offers noise protection, the energy required to strictly maintain ones and zeros is a luxury that edge sensors can no longer afford.A critical point of differentiation is how Irreversible compares to other innovators in this space. Marchand notes that while he is proud of the Canadian leadership in analog in-memory compute, Irreversible maintains several distinct advantages. First, the company is memory-agnostic, meaning they are not tied to a single proprietary memory technology and can instead utilize various non-volatile memories and emerging RRAM roadmaps. Second, the company places extraordinary emphasis on its software and simulation tools, which allow their hardware and software teams to work in lockstep. Their proprietary hardware-aware training ensures that neural networks remain accurate by accounting for the inherent variability of analog circuits during the initial training phase.For their up-coming visit to Taipei, Irreversible has set clear strategic objectives to integrate with the world's leading semiconductor ecosystem. A primary goal is establishing high-level connections with semiconductor foundries to gain privileged access to specific memory cells, which are essential for their "physics-first" custom designs. Additionally, the company is actively seeking partnerships with OEMs and solution integrators. By bringing intelligence directly to the sensor site, Irreversible aims to enable "previously impossible" use cases, such as deploying sophisticated AI on small drones or always-on wearable devices that cannot support a traditional GPU. Ultimately, Irreversible arrives in Taipei not just to showcase a chip, but to advocate for a shift in how the world thinks about intelligence. By trading the rigid certainty of digital bits for the natural efficiency of physics, they are proving that the future of AI isn't just about more power - it's about more efficient computing.

As global manufacturing accelerates its smart-factory transition, computer vision is taking on an increasingly critical role in industrial quality inspection. Canadian AI startup DaoAI, on the strength of its innovative AI vision technology, has secured partnerships with international heavyweights including Siemens and BASF. Co-founder and CTO Xiaochuan Chen explains how DaoAI uses "Feature Cognition Inspection" to solve the high false-call rates and time-consuming programming pain points of traditional Automated Optical Inspection (AOI), and reveals plans to actively pursue deeper partnerships with Taiwanese equipment makers and distributors during COMPUTEX 2026.From Academic Research to Industrial Practice: Bringing AI to the Electronics Manufacturing FloorDaoAI CTO Xiaochuan Chen has been working in AI and vision research in Canada since 2014 - right at the inflection point of deep learning. In 2017, he co-founded DaoAI in Vancouver alongside a partner with a track record of successful entrepreneurship, leading a top-tier AI vision team drawn from University of British and University of Waterloo and focused squarely on industrial automation.Chen sees enormous potential for AI in manufacturing across both North American and Asian markets. DaoAI's technology not only lifts production yield but also protects enterprise data sovereignty through its on-premise data architecture. "We understand that in any digital transformation, the security and ownership of data is a core interest for manufacturers - and that's the foundation our technology is built on," Chen says.Solving the Long Programming Cycles and High False-Call Rates of Traditional AOITraditional AOI algorithms running on PCBA (printed circuit board assembly) inspection lines are notorious for high false-call rates. Chen explains that conventional algorithms rely heavily on color matching or pixel-level comparison - when, for example, a resistor and the board substrate are both black, traditional algorithms struggle to tell them apart.DaoAI's core technology is Feature Cognition Inspection. The model is pretrained on a dataset of more than one million images, abstracting what the AI sees into a specialized feature space. The advantages show up at two levels: 1. Multi-dimensional differentiation: the AI no longer compares colors - it precisely distinguishes whether a defect is present on a component within feature space. 2. Continuous learning: the system mirrors how humans learn. If the AI gets a call wrong on the first pass, the inspector's feedback is fed into its memory system, so the next time a similar component appears, the same mistake doesn't recur."We pretrain a PCBA-specific inspection model on real production-line data," Chen explains. "All the customer needs is a single 'reference board.' Without any CAD file or component library, the AI identifies the location of every component, automatically generates inspection regions, and automatically calculates thresholds. Programming can be done in seconds or minutes - the AI takes over the part of AOI that historically required the most human intervention."This kind of fast programming is especially well-suited to high-mix, low-volume production. It dissolves the bottleneck that NPI (new product introduction) phases used to hit, where modeling was slow and dependent on dedicated programming engineers.Solving the Compute-and-Sovereignty Trade-off Without Cloud DependenceFor data sovereignty and information security issues that customers care about deeply - DaoAI runs 100% on-premise. To deliver high performance within the limited compute budget of edge hardware, DaoAI takes a "pretraining + rapid fine-tuning" approach: customers run a pre-tuned, optimized specialty model locally while keeping their data fully secure.Cross-Border Partnerships and the COMPUTEX Strategy: Complementing Taiwan's Supply ChainDaoAI has already established deep partnerships with Siemens (electronics manufacturing and automation platform integration) and BASF (vision analysis applications in chemicals). Looking ahead, Chen is bullish on the Taiwan market and announced that DaoAI will participate in COMPUTEX for the first time this year.DaoAI positions itself as a vision-AI application company, Chen says, and the trip to Taiwan has two strategic objectives: 1. Hardware integration: partner with local Taiwanese equipment manufacturers to combine DaoAI's AI software algorithms with Taiwan's high-quality hardware, delivering customized solutions. 2. Distribution expansion: identify professional distributors and service partners in Taiwan to get closer to local electronics manufacturing customers.Beyond Surface Mount Technology line inspection, DaoAI is also strongly interested in semiconductor packaging and testing and is looking to co-develop new applications with Taiwanese probe and inspection equipment makers - pushing the boundaries of vision AI further still.

Montreal-based AON3D is setting a new standard through its mastery of high-performance materials and precision 3D printing technology.Co-founded in 2015 by Andrew Walker, Randeep Singh, and Kevin Han - who started the company in his family's basement - AON3D has evolved into a global leader in high-performance additive manufacturing.With an eye on the Taiwan market at COMPUTEX 2026, Han and his team are ready to bridge the gap between complex aerospace technology and the agile SME ecosystem.The Materials Engineer's VisionKevin Han's journey began at McGill University with a background in materials engineering. After operating as a service bureau, Han recognized a gap in the market for machines capable of handling specialized materials. Through multiple product iterations, AON3D today offers it's Hylo High-Temperature 3D Printer, along with Basis, it's advanced physics simulation software for additive manufacturing. Hylo and Basis: AI-Infused and Physics-BasedAON3D's product suite offers an AI-infused manufacturing solution that reduces the trial and error usually experienced in additive manufacturing processes. "What we do is actually model out at the physics level what's going to happen as you run the print job," says Han. "Our technology creates a digital twin of the print, meaning we can use simulation to identify process irregularities that lead to hidden defects, instead of in post-production."Within the Basis platform, simulated data and real data are also compared to offer automatic optimizations. The Power of "Open Materials"AON3D's primary competitive advantage is its "Open Materials" philosophy. Unlike competitors that "lock" users into proprietary, expensive filament spools - much like the cartridges on a paper-based printer - AON3D's platform is supply-agnostic. "We support the full gamut of industrial polymers, but many customers are most interested by high-performance varieties like PEEK, PEKK, and PEI (Ultem)," Han explains. "This includes their carbon and glass-fibre variants, where strength and lightweighting benefits most appeal to demanding industries like aerospace and defense." From NASA to the Factory FloorAON3D's credentials extend to outer space. The company has worked with the Canadian Space Agency (CSA) to print components for the International Space Station, and their parts were aboard the Artemis 1 mission.Closer to home, AON3D's solutions are used by customers like Boeing, Lockheed Martin, Northrup Grumman, and more in aerospace, while also offering benefits to automotive, energy, and general manufacturing. One automotive customer saw full payback under 2 months for their first Hylo purchase, and is eagerly awaiting more. Leveraging Taiwan's EcosystemAt COMPUTEX 2026, AON3D aims to connect with Taiwan's semiconductor packaging and testing sectors. Beyond chips, they see massive potential in Taiwan's drone industry and medical prosthesis field. Hylo's ability to "light-weight" components makes it ideal for rapid drone iteration.  "We want to bring capabilities to a group that didn't have them before," Han concludes. AON3D isn't just selling a printer; they are offering a gateway to the next generation of industrial manufacturing.

Test Research, Inc. (TRI), the leading provider of Test and Inspection solutions for the electronics manufacturing industry, is proud to announce the launch of the TR7950Q SII Series. This highly modular platform is a dedicated solution for Back End Process and Advanced Packaging Inspection, ranging from patterning to wafer saw, and is engineered to set new benchmarks in wafer inspection and micro-measurement metrology.The AI-powered Wafer Metrology and Inspection Platform, TR7950Q SII, is built on a high-stability granite platform and the system supports 6" to 12" wafers. The platform features robust Automated Visual Inspection (AVI) for high-speed detection of surface defects, including particles, scratches, chipping, contamination, and foreign materials.The optional Short-Wave Infrared (SWIR) module allows the system to penetrate silicon to detect hidden inner cracks and subsurface defects invisible to standard sensors. For high-detail requirements, the platform offers 0.5 µm or 1 µm high-resolution imaging via the 3D DFF (Depth from Focus) module.The TR7950Q SII provides high-precision metrology for wafer thickness, top-side warpage, and complex surface topography, alongside high-speed sensing for Through-Silicon Via (TSV) depth, trench dimensions, thin film, and Chiplet metrology. Please visit the link to learn more about the TR7950Q SII.Credit: TRI

Cincoze has unveiled its all-new CV-200 Series slim-bezel industrial displays. The CV-200 Series features a minimalist profile, a narrow bezel, and industrial-grade reliability for industrial panel PCs and industrial touch monitors. Specifically engineered for modern factory HMI and process visualization, they carefully balance the durability required for harsh environments with seamless equipment integration and intuitive operation. The modular design of the CV-200 Series offers screen sizes from 10 to 21.5 inches for over 40 possible configurations. The first release is the 21.5" Full HD models with almost ten configuration options for various application needs.Ultra-Slim Bezel, High Visibility, and an Intuitive User ExperienceThe CV-200 Series offers clear visuals and smooth operation, and integrates easily into production line equipment. Its slim, die-cast aluminum alloy frame has a bezel less than 3mm wide, increasing the display area without changing existing equipment setup. The Full HD screen and 178° wide viewing angle ensure clear and crisp readability from any position. Every model features a projective capacitive (P-Cap) touchscreen with an anti-glare (AG) coating for the clearest images, even in high-brightness indoor lighting conditions. Touch response is fast and precise, making daily HMI operation smoother and more natural.Rugged and Durable for Industrial and Humid EnvironmentsThe CV-200 Series is built to handle harsh, humid industrial environments. It has an IP66-rated front panel and Wet Tracking technology, so the touchscreen works reliably even with wet fingers or splashes of water. The backlight lasts up to 50,000 hours, and a 7H hardness Glass-Glass (GG) panel adds durability. The CV-200 Series meets the IEC 61000-6-4 industrial EMC standard, ensuring stable, long-term operation and giving operators total peace of mind.Flexible Modular DesignCincoze's exclusive Convertible Display System (CDS) technology lets you pair the CV-200 Series with embedded computer modules (P2000/P1000 Series) or monitor modules (M1000 Series). Customers can configure the system as either an industrial panel PC or an industrial touch monitor, depending on display size, computing performance, and functional requirements. This plug-and-play design simplifies deployment and maintenance. If repairs are needed, only a single module needs to be replaced, cutting downtime, lowering maintenance costs, and streamlining future upgrades.

Global Unichip Corp. (GUC), the Advanced ASIC Leader, today announced a strategic technical collaboration with Wiwynn, an innovative cloud IT infrastructure provider for data centers. This collaboration integrates GUC's flagship SoC design and 2.5D/3D advanced packaging with Wiwynn's expertise in rack-scale system integration, liquid cooling and optical interconnect. Together, the collaboration enables hyperscale customers to transition more efficiently from silicon definition to deployment-ready AI infrastructure.AI clusters continue to scale in performance, bandwidth and power density, hyperscalers must increasingly evaluate silicon, packaging, interconnect, thermal and rack-level design choices much earlier in the development cycle. Through this collaboration, GUC and Wiwynn are aligning key technology pillars, including leading-edge ASIC implementation, 2.5D/3D advanced packaging, optical I/O, power delivery, thermal architecture, manufacturability, serviceability and rack-scale integration. By addressing these factors holistically at the outset, the collaboration partners aim to reduce integration complexity, improve development efficiency and accelerate the transition from silicon-ready innovation to system-ready AI infrastructure."As AI infrastructure evolves beyond chip-level optimization and scale-up networks push the limits of conventional electrical interconnects, close alignment across silicon to system architecture become critical," said Aditya Raina, Chief of Marketing of GUC. "By collaborating with Wiwynn, we are helping hyperscale customers evaluate critical system-level tradeoffs earlier, integrating optical I/O to deliver the bandwidth and power efficiency required for next generation AI systems. This partnership establishes a more practical, holistic path from flagship ASIC development to deployable, rack-scale AI infrastructure."With deep expertise across board-level innovation, rack-scale integration, and manufacturing, Wiwynn effectively bridges semiconductor innovation with data center deployment," said Tony Wen, Vice President at Wiwynn. "Together with GUC, we are enabling a comprehensive silicon-tosystem approach that delivers scalable, efficient and serviceable AI infrastructure tailored for nextgeneration hyperscale environments."For more information, please visit.

Chroma ATE Inc. successfully concluded the 3rd Chroma Paper Award on March 19, marking another milestone in the company's ongoing commitment to industry-academia collaboration. Organized in partnership with National Taiwan University of Science and Technology (Taiwan Tech), the Chroma Paper Award provides an exchange platform that accelerates the translation of research into real-world applications, fostering innovation and the cultivation of key talent.As high-performance computing (HPC) and AI applications continue to advance rapidly, demand for test and measurement technologies is rising across AI chips, HPC, and data centers. In this era of lightning-fast iteration, testing and validation have become critical enablers of system performance and reliability. With long-standing expertise in this field, Chroma has built comprehensive AI-related testing capabilities spanning the four core pillars of AI infrastructure: compute and data processing, cooling and thermal management, high-speed communications and data transmission, and power and energy management. Through its test and validation solutions, Chroma helps ensure the performance, stability, and reliability of AI systems, playing a vital enabling role across the AI value chain.Aligned with Chroma's core technology development priorities, this year's competition featured two main categories: Power Electronics-Related Technologies and Semiconductor Testing-Related Technologies. Each category included a Top Prize (NT$200,000), Excellence Prize (NT$100,000), and Merit Prize (NT$20,000), with total prize funding reaching nearly NT$1.5 million. A total of 101 papers were submitted. Following a multi-stage evaluation process comprising preliminary, secondary, and final reviews, the judging committee selected outstanding research projects distinguished by both technical innovation and strong potential for industrial application.In the Power Electronics-Related Technologies category, the Top Prize was awarded to a team from Taiwan Tech for the project "Development of a High Power Density Power Module for AI Server Applications." Supervised by Associate Professor Yu-Chen Liu and completed by student Yu-Jun Li, the project directly addresses the growing need for high-efficiency, high-power-density power systems in AI data centers.In the Semiconductor Testing-Related Technologies category, the Top Prize went to a team from National Taiwan University for the project "A Novel Full-Chip Afterpulsing Evaluation Technique for 116 x 160 Ge-on-Si SPAD Array." Supervised by Professor Chao-Hsin Wu and jointly completed by students Jia-Zhen Cai, Ren-Hong Zhang, and Qi'en Chen, the research presents innovative achievements in advanced sensing and semiconductor testing technologies.Following the award ceremony, Chroma invited finalist teams into its R&D labs and testing facilities to see firsthand how research outcomes are transformed into real systems and industrial applications. The visit further strengthened ties between academia and industry.As the AI era continues to evolve at speed, test and measurement serves not only as a gatekeeper of quality but also as a key engine of innovation. Looking ahead, Chroma will continue to deepen its engagement with the global academic community through the Chroma Paper Award and a range of industry-academia collaboration initiatives, building an open and impactful platform that advances key technologies and sustains innovation momentum across the industry.For the full list of award winners, please visit the official Chroma Paper Award website.President Jia-Yush Yen of National Taiwan University of Science and Technology delivers remarks. Credit: ChromaCredit: ChromaFinalist students pose for a group photo with Chroma Foundation Chairman Paul Ying. Credit: ChromaChroma ATE Chairman Leo Huang (left) poses with the Top Prize-winning student Yu-Jun Li. Credit: ChromaChroma ATE Chairman Leo Huang (left) poses with the Top Prize-winning student Jia-Zhen Cai. Credit: ChromaFinalist teams visit Chroma headquarters. Credit: ChromaGroup photo at the 3rd Chroma Paper Award ceremony and banquet. Credit: ChromaChroma ATE Chairman Leo Huang delivers remarks. Credit: ChromaChroma Foundation Chairman Paul Ying delivers remarks. Credit: Chroma

The rapid growth of the global low Earth orbit (LEO) satellite communications sector, coupled with intensifying competition in next-generation communications technologies, is driving strong demand across the supply chain and reshaping the global space economy.Under a startup development program led by Taiwan's Ministry of Economic Affairs, the Industrial Technology Research Institute (ITRI), through its Commercialization and Industry Services Center, organized the "2026 Taiwan-UK-France Next-Generation Communications & Space Industry Delegation." From March 3 to 12, 2026, the delegation brought together over 11 Taiwanese space and communications startups, established companies, and industry representatives to London, Oxford, Toulouse, and Paris.During the visit, the delegation attended major industry events, including Space-Comm Expo and Paris Space Week, and engaged with key European stakeholders such as the UK Department for Business and Trade (DBT), Eutelsat OneWeb, Thales Alenia Space, Airbus Defence and Space, and CNES. These engagements enabled Taiwanese companies to establish linkages across the European space supply chain, from components to system integration.Building on the foundation established during its 2025 UK visit, ITRI further strengthened international collaboration by signing a memorandum of understanding (MOU) with Space South Central, a leading space cluster in southern England. The partnership focuses on advancing aerospace supply chain integration, promoting bilateral industry engagement, and supporting startup selection and international expansion. It also aims to establish a long-term Taiwan-UK collaboration platform for the space industry, reinforcing ITRI’s role in accelerating the global reach of Taiwan's SpaceTech startups.Expanding Opportunities at Space-Comm ExpoSpace-Comm Expo, one of Europe's leading commercial space exhibitions, was held from March 4 to 5, 2026, at ExCeL London, attracting over 250 companies and approximately 6,900 industry and academic professionals.The Taiwan Pavilion, "Taiwan Space," was prominently located at the center of the exhibition hall and served as a key engagement hub. On the opening day, a Taiwan-UK Cultural Exchange Tea Reception welcomed international partners, government representatives, and industry experts, fostering dialogue in a relaxed setting and drawing strong visitor interest.One-on-one meetings were arranged between the delegation and leading UK satellite companies, including BAE Systems and Filtronic, focusing on collaboration opportunities in the satellite component supply chain. Additional engagements were conducted with the Space Denmark delegation and companies affiliated with Space South Central, enhancing the visibility of Taiwanese startups in Europe and laying the groundwork for future partnerships.On March 5, ITRI convened the Taiwan-UK Space Industry Roundtable in collaboration with Satellite Applications Catapult (SA Catapult). CEO John Abbott delivered a keynote on UK satellite application market trends. The roundtable brought together representatives from ESA Business Incubation Centre, Airbus Launchpad, and Open Cosmos, facilitating direct engagement on technology applications and supply chain integration while strengthening prospects for international collaboration.Taiwan Pavilion Takes Center StageIn addition to facilitating direct engagement between the delegation and the UK space sector, ITRI hosted the "Taiwan Country Showcase" on the main stage of Space-Comm Expo on March 4, highlighting Taiwan's comprehensive space industry capabilities.The session was moderated by Jessi Fu, Manager of the Strategic Alliances & Marketing Department at ITRI's Startup Ecosystem & Incubation Division. Featured speakers included Julien Hennequin, Senior Business Development Manager at Tensor Tech; Henry Chen, Senior Manager at BaseTech; and Lloyd Jacob Lopez, Co-Founder of HEX20. Together, they presented a systematic overview of Taiwan's space industry, spanning from key components to system-level integration. The session attracted nearly 100 European industry participants and sparked lively on-site discussions, significantly enhancing the global visibility of Taiwan's space sector.On March 5, ITRI further organized the "Global Industry Showcase," a dedicated technology forum for Taiwanese startups. This session enabled delegation members to directly present their latest technological advancements to European industry stakeholders, covering forward-looking domains such as B5G/6G communications, satellite manufacturing, and space applications. The forum effectively demonstrated Taiwan's unique competitiveness and innovation capabilities within the global space industry.Harwell Campus, located on the outskirts of Oxford, is a key hub in the global space sector. Following the conclusion of Space-Comm Expo, ITRI arranged a visit on March 6 to the UK Satellite Applications Catapult, followed by a tour of RAL Space, the UK's national satellite testing facility. These visits provided delegation members with deeper insights into the UK's capabilities in satellite applications and testing and validation.An additional exchange session was held at the Magdrive Lab, where delegation members engaged with representatives from more than 10 UK space companies. The session further strengthened existing networks and facilitated follow-up discussions on potential collaborations and business opportunities.In addition, the delegation visited Eutelsat OneWeb in London's West End, where they held in-depth discussions with Neha Idnani, Regional Vice President for APAC. The exchanges focused on exploring cross-border collaboration opportunities in low Earth orbit satellite communications, wireless communications, Internet of Things (IoT), and artificial intelligence (AI) applications.Toulouse Engagements Highlight France's Aerospace EcosystemFollowing the conclusion of Space-Comm Expo, ITRI organized the delegation’s visit to France from March 9 to 11. The group first traveled to Toulouse - widely recognized as France's "Silicon Valley" for aerospace and one of Europe's leading aerospace hubs - to engage with key players in the regional space industry ecosystem. During Paris Space Week 2026, the delegation also conducted business meetings with international buyers and investors from more than 150 companies across over 40 countries, expanding collaboration opportunities beyond those initiated at Space-Comm Expo.Upon arrival in France on March 9, ITRI arranged visits to satellite mission service provider Loft Orbital and nanosatellite manufacturer U-Space. In addition, a joint matchmaking and exchange session was organized with GIFAS (the French Aerospace Industries Association) and Aerospace Valley, facilitating technical exchanges and one-on-one business meetings between Taiwanese and French companies. These engagements enabled delegation members to explore multiple potential collaboration opportunities and establish follow-on business collaborations.On the following day, the delegation visited Thales Alenia Space, one of the world's leading satellite system manufacturers; Univity, a French startup; Eutelsat, a major low Earth orbit satellite communications operator based in Toulouse; and Airbus Defence and Space, Europe's largest space and defense systems provider. These visits provided valuable insights into the technological developments and supply chain requirements of major European system integrators. Direct engagement with key decision-makers also enabled in-depth discussions on product applications and partnership models, further strengthening the feasibility of Taiwanese companies entering international markets.During Paris Space Week 2026, ITRI continued to facilitate business matchmaking and engagement with global space industry stakeholders, supporting delegation members in expanding potential collaboration pipelines. Notably, prior to the main delegation itinerary, Taiwan’s Small and Medium Enterprise and Startup Administration (SMESA), together with ITRI, visited Station F - Europe's largest startup incubator - to proactively establish an international network for space startups and deepen connections between Taiwan and Europe's innovation ecosystems.Overall, the initiative effectively enabled Taiwanese companies to access the European supply chain, delivering tangible outcomes in business matchmaking, technology exchange, and brand visibility. The visit not only generated concrete orders and follow-up collaboration opportunities, but also provided deeper insights into the European space industry landscape, laying a solid foundation for long-term international partnerships.Strengthening Taiwan's Global Space PositionThe delegation included nine startups and SMEs from the TAcc+ program, along with two major industry associations, covering key areas such as satellite manufacturing, communication subsystems, ground equipment, payload applications, and system integration.The initiative resulted in multiple high-level business matchmaking engagements and the signing of the MOU with Space South Central, marking a significant milestone in advancing the internationalization of Taiwan's space industry.Looking ahead, ITRI will continue to build on its strengths in international engagement and delegation planning, aligned with the TAcc+ program, to follow up on collaboration opportunities generated during the visit. It will also actively attract high-potential European space startups to establish a presence in Taiwan, further enhancing the global competitiveness and long-term development of Taiwan’s space sector.TAcc+ hosted the Taiwan Country Showcase at Space-Comm Expo, highlighting Taiwan's space industry. Credit: ITRI

Global Unichip Corp. (GUC), the advanced ASIC leader, today announced the successful demonstration of a 12 Gbps HBM4 IP platform implemented on TSMC's 3nm process technology at the Partner Pavilion of the TSMC 2026 North America Technology Symposium. The platform features GUC's in-house full functional HBM4 Controller and PHY IP, integrated with a partner's HBM4 memory, and used TSMC's industry-leading CoWoS advanced packaging technology.GUC's previous-generation HBM3E PHY and Controller, deployed in customers'3nm products, have achieved speeds 15% above specification in production. JEDEC continues to drive an aggressive HBM roadmap, increasing memory throughput and capacity while further doubling the data bus width in HBM4. Comparing with HBM3E, GUC's HBM4 IP delivers 2.5x bandwidth, while improving power efficiency by 1.5x and area efficiency by 2x.In line with GUC's previous HBM, GLink, and UCIe IP solutions, the HBM4 IP integrates proteanTecs' interconnect monitoring solution to provide high visibility for PHY testing and characterizing, while enhancing in-field performance and reliability for end products.To address the growing demand for 3DIC architectures, GUC's HBM4 PHY also supports a face-upconfiguration, enabling integration with TSMC's SoIC face-to-face technology. The PHY macrointegrates TSVs for PHY's I/O signals, power, and ground connections, and also reserves TSVs forpower feedthrough to the top die, supporting the power distribution requirements of the upper logic die."We are proud to be the first company to demonstrate a 12 Gbps HBM4 IP to customers at theTSMC Symposium" said Igor Elkanovich, CTO of GUC. "Together with GUC's UCIe and GLink-3D IPs, we offer a complete 2.5D/3D IP solution for modern 3.5D system architectures, includingTSMC SoIC-X on CoWoS."For more information,please visit our website.12 Gbps Eye Diagram. Credit:Guc