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Monday 21 September 2026
Syensqo showcased advanced materials enabling AI-era semiconductor manufacturing at SEMICON Taiwan 2026
Syensqo, a leading global supplier of advanced materials and chemical solutions, showcased its advanced materials portfolio for next-generation semiconductor manufacturing, with a particular focus on its latest Tecnoflon FFKM innovations, at SEMICON Taiwan 2026.
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Monday 21 September 2026
Syensqo showcased advanced materials enabling AI-era semiconductor manufacturing at SEMICON Taiwan 2026
Syensqo, a leading global supplier of advanced materials and chemical solutions, showcased its advanced materials portfolio for next-generation semiconductor manufacturing, with a particular focus on its latest Tecnoflon FFKM innovations, at SEMICON Taiwan 2026.
Monday 14 September 2026
Hauman Unveils Micro LED Testing Breakthrough for AI Optical Interconnects
As AI-driven high-performance computing (HPC) and chip-to-chip optical interconnects continue to see rapid growth, Hauman Technologies, a leader in test and measurement solutions, has introduced a breakthrough GHz-class, massively parallel bandwidth testing technology in collaboration with AUO Corporation...
Monday 14 September 2026
Scaling Photonics: Assembly, Test and Fiber Automation at SEMICON Taiwan
As AI continues to accelerate demand for high-speed optical connectivity, technologies such as silicon photonics, CPO, LPO, NPO and OCS are moving rapidly toward commercial deployment. The next challenge is turning these technologies into scalable, high-yield production.
Friday 11 September 2026
Toward Technologies Redefines Relay Solutions at SEMICON Taiwan 2026
Toward Technologies, Inc. concluded its participation in SEMICON Taiwan 2026, held from September 2 to 4 at Taipei Nangang Exhibition Center Hall 1. Under the theme "RELAY, REDEFINED.," the company showcased a broader switching technology portfolio at booth K3168 and demonstrated its transition from a traditional relay supplier to an advanced switching solution partner.
Friday 11 September 2026
DAS Expands in Taiwan and Unveils World First at SEMICON
DAS Environmental Experts continues to expand its capabilities in Taiwan and is presenting another new product at SEMICON Taiwan...
Wednesday 2 September 2026
World Diamond Technology accelerates mass production of 300 mm diamond wafers
As AI, high-performance computing (HPC), and advanced packaging continue to move toward higher levels of power integration, chip power consumption is rising rapidly. Thermal management has therefore become a critical factor affecting performance, reliability, and system design...
Wednesday 2 September 2026
Take Control of Your Process: Onto Innovation at SEMICON Taiwan 2026
This year's SEMICON Taiwan will be packed with discussions about artificial intelligence and the on-wafer challenges it's creating, where the advanced node and emerging technology worlds collide. And at the center of it all is the need for better process control at a reduced cost-of-ownership (CoO).
Wednesday 2 September 2026
DAS Introduces ALCEA for Integrated NOx Treatment in Semiconductor Fabs
DAS Environmental Expert GmbH today announced the launch of ALCEA, a new secondary abatement solution for nitrogen oxide (NOx) emissions in semiconductor manufacturing. Installed downstream of NOx-generating waste gas treatment units, ALCEA can reduce NOx by up to 95 percent while its catalyst stage is integrated directly into the exhaust duct, minimizing additional floor space in the subfab...
Wednesday 2 September 2026
SiliconAuto Expands into Physical AI at SEMICON Taiwan 2026
At SEMICON Taiwan 2026 Booth T9116, SiliconAuto will showcase automotive-grade silicon solutions for Physical AI, developed through collaboration across Taiwan's world-leading semiconductor ecosystem. Visitors can experience live demonstrations of technologies designed to power future robotics and autonomous driving applications...
Wednesday 2 September 2026
Manz Asia Broadens ECD Platform for Mass Panel-Level Packaging
Rapid evolution of High-Performance Computing (HPC) and artificial intelligence chips for Hyperscalers and tech giants continue pushing large sized silicon demands...