Taipei, May 28-29, 2025 – As the world stands at the threshold of a new era, Artificial Intelligence (AI) and emerging technologies are poised to reshape industries, societies, and economies. The AI with Purpose Global Summit, organized by GeSI, TEEMA, and Taiwan Mobile, set to take place at the Taipei International Convention Center (TICC), will bring together global industry leaders, policymakers, and innovators to explore the transformative power of AI in creating a sustainable and inclusive future.AI-driven innovation is accelerating across all sectors, offering groundbreaking opportunities to enhance human well-being, drive economic transformation, and address urgent global sustainability challenges. From climate action to biodiversity protection, smart cities to healthcare, and energy efficiency to responsible consumption, AI is enabling solutions that were once beyond imagination. However, as we embrace AI's potential, we must also navigate the enormous challenges it presents—ensuring responsible governance, ethical safeguards, and accountability frameworks that enable AI to serve both humanity and the planet effectively.Why this summit mattersAI is revolutionizing industries at an unprecedented scale, yet its governance, sustainability, and societal impacts remain key topics for global discussion. The AI with Purpose Global Summit will serve as a critical platform to examine AI's role in:• The Enabling Role and Promise of AI in Sustainability √ How Do We Want to Live? – Showcasing AI-driven solutions that accelerate carbon reduction, resource efficiency, and sustainable transformation.• Digital Infrastructure √ The Backbone of the Modern World – Highlighting the urgency of creating robust digital foundations to enable AI at scale.• Setting a Global Stage√ Framing and mobilizing global governance, policy, and stakeholder activism to shape AI's role in sustainability.At the end of the summit, we are honored to present the Digital with Purpose Global Awards. These awards recognize outstanding solutions that drive meaningful change across three key areas: Education, Smart Cities, and Biodiversity. They celebrate initiatives that promote learning and inclusion, improve urban efficiency in all its dimensions, and connectivity, and protect natural ecosystems.The summit's format, presentations, and discussions will center on practical digital and AI solutions that drive both sustainability and business impact. This is not a broad, informational program on AI, but a focused exploration of its real-world applications and measurable outcomesPlease visit the website for more information about registration, speakers, and program details.Message from Luís Neves, CEO of GeSI, "AI is reshaping our world at an unprecedented pace, offering transformative solutions for sustainability, economic growth, and human well-being. The AI with Purpose Global Summit is a crucial platform to explore how we can harness AI's potential responsibly—ensuring innovation serves both people and the planet. Collaboration across industries, governments, and society is key to building a future that is not only intelligent but also inclusive and sustainable."Message from Richard Lee, Chairman of TEEMA "Taiwan has a strong industrial foundation in AI, digital infrastructure, and sustainable technology. TEEMA represents Taiwan's ICT industry, and through this global dialogue, we aim to seamlessly integrate Taiwan's expertise into the international market, bringing Taiwan's innovations and solutions to the world while exploring new opportunities for AI-driven sustainability."Message from Iris Liu, Vice President of Sustainability, Brand Development & PR at Taiwan Mobile and Board Director of GeSI"Taiwan Mobile became the first GeSI corporate member in Taiwan in 2016 and has actively participated in international sustainability initiatives since joining the Digital with Purpose (DWP) initiative in 2020.As the only corporate member of GeSI in Taiwan, Taiwan Mobile has leveraged its expertise in AI applications to contribute to the development of SMART project frameworks, including the AI Agent Super Assistant, AI Mentor Gold Coach, and AI Customer Service Solutions, in collaboration with global ICT enterprises.Taiwan Mobile has consistently been at the forefront of AI-driven innovation, demonstrating its commitment to pioneering cutting-edge, sustainable solutions. Its contribution to the AI with Purpose Global Summit extends beyond showcasing innovative AI applications; Taiwan Mobile wants to help businesses navigate through 'AI anxiety' while driving the implementation and feasibility of the AI with Purpose framework."

Global Unichip Corp. (GUC), the Advanced ASIC Leader, today announced the successful launch of the industry's first Universal Chiplet Interconnect Express (UCIe) PHY silicon, achieving a data rate of 32 Gbps per lane, the highest speed defined in the UCIe specification. The 32G UCIe IP, supporting UCIe 2.0, delivers an impressive bandwidth density of 10 Tbps per 1 mm of die edge (5 Tbps/mm full-duplex). This milestone was achieved using TSMC's advanced N3P process and CoWoS packaging technologies, targeting AI, high-performance computing (HPC), xPU, and networking applications.In this test chip, several dies with North-South and East-West IP orientations are interconnected through the CoWoS interposer. The silicon measurements show robust 32Gbps operation with wide horizontal and vertical eye openings. GUC is working aggressively on the full-corner qualification, and the complete silicon report is expected to be available in the coming quarter.To ensure seamless system integration, GUC has developed bridges for AXI, CXS, and CHI buses utilizing the UCIe Streaming Protocol. These bridges are optimized for high traffic density, low power consumption, minimal data transfer latency, and efficient end-to-end flow control – enabling an effortless transition from traditional single-chip Networks-on-Chip (NoC) to chiplet-based architectures. Additionally, the bridges support Dynamic Voltage and Frequency Scaling (DVFS), allowing real-time voltage and frequency adjustments independently of each die without interrupting data flow.GUC's UCIe IP also features advanced reliability capabilities, including UCIe Preventive Monitoring functionality and integrated I/O signal quality monitors from proteanTecs. This technology enables continuous, mission-mode monitoring of signal integrity during data transmission without the need for retraining or disrupting operations. Each signal lane is individually monitored, with real-time detection of power and signal integrity anomalies. Potential defects in bumps and traces are identified early, triggering repair algorithms that replace marginal I/Os with redundant ones to prevent system failures. This proactive approach significantly extends chip lifespan and enhances system reliability.Pushing the boundaries of performance, GUC is committed to further increasing lane speeds while reducing power consumption. GUC has successfully taped out its second-generation UCIe IP, achieving 40 Gbps per lane in late 2024.This new version incorporates Adaptive Voltage Scaling (AVS), delivering approximately 2x power efficiency improvements. In addition, a face-up version of the UCIe-40G IP, designed for 3D integration (SoIC) with Through-Silicon Vias (TSVs), is scheduled for tape-out in the coming months. Looking ahead, GUC's third-generation UCIe IP, capable of 64 Gbps per lane, is currently in development and slated for tape-out in the second half of this year. UCIe product line is optimized for all types of CoWoS and for future TSMC's SoW-X platform. "We are excited to announce the successful silicon bring-up of the world's first UCIe IP supporting 32 Gbps," said Aditya Raina, CMO of GUC."With a comprehensive, silicon-proven 2.5D/3D chiplet IP portfolio across TSMC's 7nm, 5nm, and 3nm process technologies, we deliver robust solutions that go beyond IP. Combined with our expertise in design, package engineering, electrical and thermal simulations, design-for-test (DFT), and production testing for TSMC's 3DFabric technologies, including CoWoS, InFO, TSMC-SoICR, we empower our customers to accelerate design cycles and achieve rapid bring-up of their AI, HPC, xPU, and networking products.""We are committed to delivering the highest performance and lowest power 2.5D/3D chiplet and HBM interface IPs," said Igor Elkanovich, CTO of GUC. "The convergence of 2.5D and 3D packaging technologies, leveraging HBM3E/4/4E, UCIe, and UCIe-3D interfaces, enables the development of highly modular processors that exceed reticle size limitations, paving the way for the next generation of high-performance computing."GUC UCIe-32G Silicon Highlights√ 32Gbps per lane√ Beachfront bandwidth density (full-duplex): 5Tbps/mm√ AXI, CXS and CHI bus bridges√ Dynamic Voltage and Frequency Scaling (DVFS)√ UCIe Preventive Monitoring: per lane, in-mission mode I/O signal quality monitoring by protean Tecs

The Donald Trump tariff policies, implemented during his tenure as President, marked a significant shift in the United States' trade strategy. Historically, tariffs have been used primarily as a source of national revenue or to protect budding domestic industries from foreign competition. However, Trump leveraged tariffs as a tool of economic diplomacy, exerting pressure on nations such as China to address longstanding trade imbalances and unfair practices. These tariffs were positioned as necessary for national security, purportedly safeguarding American jobs and industries from foreign financial threats. They were also part of a broader strategy to control illegal activities such as drug trafficking and illegal immigration, which were tied to economic vulnerabilities. Nonetheless, this aggressive tariff regime led to significant debate regarding its effectiveness and repercussions.Understanding the economic impact on US consumersFrom an economic perspective, the Donald Trump tariff policy has had pronounced effects on American consumers and businesses. Studies indicate that the costs of tariffs are often passed down to consumers in the form of higher prices. Indeed, these tariffs function much like indirect tax increases, raising the cost of imported goods and, consequently, the prices on store shelves. This increase in consumer costs can diminish disposable income, restricting spending power and potentially stifling economic growth across sectors. Additionally, US businesses relying on global supply chains or foreign materials have faced increased operational costs, contributing to market disruptions and inflationary pressures. The Trump administration's tariffs, while designed to protect American interests, have sparked a complex discourse on their long-term economic viability and impact on consumer welfare.Legal and legislative framework of tariff impositionThe imposition of tariffs under the Trump administration was facilitated by mechanisms like the International Emergency Economic Powers Act (IEEPA). This legislative tool allows the President to regulate international commerce after declaring a national emergency in light of an unusual and extraordinary threat. However, the use of such executive authority to impose tariffs has drawn scrutiny, raising questions about the balance of power between legislative oversight and executive action. Legal challenges and debates around the application of national security exemptions in trade policy underscore the broader discussions on the adaptability of current laws to evolving geo-economic landscapes. As global trade dynamics become increasingly complex, including emerging sectors like what's the next big crypto, the precedents set by Trump's tariffs in using national security as a tariff justification could influence future administrations' trade policies. For a more detailed understanding of these frameworks, consider reviewing the U.S. Tariff Policy Overview provided by Congressional Research Service.Global repercussions and geopolitical shiftsThe international response to the Donald Trump tariff measures has varied, with some countries retaliating by imposing their own tariffs on American goods. This has led to an escalation of trade tensions and the specter of prolonged trade wars. Retaliatory tariffs can harm global economic relationships and result in a domino effect of protectionist policies, which might isolate economies rather than fostering cooperation. Additionally, nations like Canada have explored strategies to mitigate the impact of US tariffs, such as emphasizing shared economic interests and dependencies in areas like energy. Meanwhile, these tariff exchanges have the potential to trigger long-term shifts in geopolitical alliances and economic partnerships as countries reconsider their trade and diplomatic strategies. For those exploring potential investment opportunities, understanding these shifts is crucial in predicting market behaviors and identifying.While the Trump administration's tariffs focused on correcting perceived trade inequities, their complex legacy continues to frame discussions on trade policy. Ultimately, as nations adapt to these economic realities, stakeholders must weigh the future implications of such strategies on global supply chains and economic alliances, prompting inquiries into what's the next big crypto investment guided by these market shifts.

SK Hynix Inc. (or "the company") announced today that it has received the 2025 World's Most Ethical Companies® recognition by Ethisphere*, a global leader in defining and advancing the standards of ethical business practices, marking the first case for a Korean semiconductor company to be named as an honoree.* Ethisphere: global leader in defining and advancing the standards of ethical business practices that strengthen corporate brands, build trust in the marketplace, and deliver business success. Ethisphere honors superior integrity programs through the World's Most Ethical Companies® recognitionThe assessment is based on Ethisphere's proprietary Ethics Quotient®, which requires companies to provide 240+ different proof points on practices that support robust ethics and compliance; governance; a culture of ethics; environmental and social impact; and initiatives that support a strong value chain.In 2025, 136 honorees were recognized spanning 19 countries and 44 industries. SK Hynix is one of only four honorees in the semiconductor industry.The international recognition follows years of the company's efforts to set up goals for business ethics and systematic evaluation and implementation of them. SK Hynix expects an ethics management system that the stakeholders can trust and is suitable for a global company to help it and its customers achieve higher corporate values.SK Hynix and its employees have combined efforts to advance business ethics further with members participating in the signing of compliance commitment letters and compliance surveys every year with passion.In 2023, SK Hynix also started a program to share its operation and know-how of the business ethics system with business partners to further grow it into a system for the broader supply chain."Congratulations to SK Hynix for achieving recognition as one of the World's Most Ethical Companies®," Erica Salmon Byrne, Ethisphere's Chief Strategy Officer and Executive Chair, said. "Behind this honor is a true dedication and a commitment to advancing business integrity.""I would like to express my gratitude to our members for their continued efforts to help advance the company's principles for ethical management to be recognized globally," SK Hynix Chief Executive Officer Kwak Noh-Jung said. "We will strive to meet the trust of our stakeholders and do our part to continue as an ethically responsible AI memory provider."Credit: SK Hynix

TAIPEI, TAIWAN – Taiwan is set to host the Best AI Awards 2025, an international competition designed to drive innovation in Artificial Intelligence (AI) and Integrated Circuit (IC) Design. Advised by the Ministry of Economic Affairs (MOEA), organized by the Department of Industrial Technology, and hosted by the Taipei Computer Association (TCA), this event offers a highest grand prize of NT$1,000,000 (approx. US32,000).Open to students and experts worldwide, the competition will accept submissions from early March to April 8, 2025. Winners will be invited to Taipei for a physical presentation for the final round in early May 2025, with top participants receiving a special visa to work in Taiwan and access to expert training opportunities. Taiwanese participants are encouraged to collaborate with local teams, fostering greater industry connections.The Best AI Awards 2025 focuses on two core themes: AI Applications and IC Design. Participants are encouraged to submit groundbreaking proposals with strong potential for real-world industry adoption. This competition serves as a unique platform to showcase talent, connect with industry leaders, and explore career opportunities in Taiwan's thriving tech ecosystem. Full details and application guidelines can be found on the "Best AI Awards 2025" official website.Taiwan's commitment to AI talent & innovationTaiwan's Minister of Economic Affairs, Kuo Jyh-huei, highlighted the nation's global leadership in chip and server manufacturing, with its AI software rankings expected to enter the world's top 14 by year-end. To secure a strong AI workforce, the government aims to cultivate 200,000 AI professionals within four years, driving innovation and industry-academia collaboration.The "2+4" talent program further supports global talent, especially students from Southeast Asia, by offering tuition subsidies, living allowances, and career training in Taiwan's high-tech industries.For AI and IC innovators, the Best AI Awards 2025 is more than a competition—it's a gateway to Taiwan's dynamic tech landscape.

AI semiconductor company DEEPX (CEO: Lokwon Kim) has been steadily increasing its global marketing efforts since introducing sample chips for international customer evaluation. Now, DEEPX is ramping up the supply of mass-production chips, paving the way for broader commercial opportunities across global markets.Last month at CES 2025 - one of the world's largest electronics trade shows - DEEPX was recognized as a "must-visit company" by the event's organizer, the Consumer Technology Association (CTA), shining a spotlight on the global market. During the show, over 16,000 visitors stopped by the DEEPX booth, resulting in more than 100 requests for mass-production chip samples—strong indicators of the company's expanding commercial prospects.During CES, DEEPX showcased various applications of its chips in edge devices for smart cities, smart factories, and robotics, as well as in industrial equipment and edge servers for global enterprises. Demonstrations and on-site meetings were held with a wide range of customers and partners from the United States, Taiwan, Japan, and Europe. In addition, major Korean corporations, government officials, and investors visited the booth on tours to get a firsthand look at DEEPX's technological strengths.Among the highlights, DEEPX successfully ran its first-generation mass-production chips using AI algorithms developed by:–Hyundai-Kia Motor Robotics Lab (robot platform)–Inventec (smart factory)–POSCO DX (smart factory & logistics automation)–LG U+ (industrial and urban security)This demonstration underscored the critical role of on-device AI semiconductors - beyond cloud-based approaches - in ushering in a new era of AI.DEEPX also directly compared its solution to NVIDIA's Jetson Orin, a GPU-based edge platform, demonstrating approximately 10 times the power efficiency and 20 times the price/performance efficiency of its own NPU-based product. By also conducting a 'butter benchmark' test against other leading global NPU technologies, DEEPX demonstrated its advantage in power efficiency, thermal management, and operational stability - critical factors for on-device AI.To illustrate its broad compatibility, DEEPX showcased integrations with application processor (AP) systems-including NXP, Renesas, TI, Broadcom, Rockchip, and Intel-as well as small form factor computing solutions such as the popular Raspberry Pi. The company also demonstrated interoperability with partner industrial PCs and leading workstation and server systems from HP, Dell, Supermicro, Lenovo, Inventec, and others, highlighting the versatility and scalability of its solution.Looking ahead, DEEPX will partner with LG U+ at MWC (Mobile World Congress) in Barcelona from March 3 to demonstrate on-device AI solutions powered by its first-generation chip. DEEPX will also host its own booth to showcase the roadmap for its DX-M2 on-device AI semiconductor, designed for large language models.Following MWC, DEEPX will head to Embedded World on March 11 in Nuremberg, Germany, where its products will be showcased at partner booths - including Micron, Raspberry Pi, AAEON, DFI, Portwell, SEEED, Biostar, Advantech, and Network Optix - as well as DEEPX's own stand. The company will conduct additional live demos and meet with potential customers to explore new business opportunities.

Darveen Co., Ltd., a global provider specializing in rugged industrial computer solutions, is pleased to announce its participation in Embedded World 2025, one of the largest global platforms for the embedded community. The event will take place in Nuremberg, Germany, from March 11 to 13, 2025. Visit Darveen at Hall 3, Booth 3-230 to explore our latest rugged computing solutions designed for a wide range of vertical industries, including in-vehicle environments, marine applications, industrial edge computing, and mobile workforce operations.Stop by our booth to discover our newest product lineup, including:In-vehicle computing solutionsDarveen's in-vehicle solutions are purpose-built for demanding vehicle environments, featuring all-in-one vehicle mount computers with integrated monitors and in-vehicle box PCs. Engineered for reliability, these solutions offer wide temperature and wide voltage support, along with rugged designs, making them ideal for trucks, forklifts, cranes, mining vehicles, agricultural vehicles, and buses. With MIL-STD-810H/G compliance and M12 connectors, our solutions are well-suited for transportation, logistics, warehousing, and port terminal operations.Rugged tablets, RTC seriesDarveen will showcase its rugged RTC Series tablets, available in sizes ranging from 8" to 11.6". A key highlight is the recently launched RTC-I116, featuring a high-brightness 1,000-nit display, hot-swappable dual batteries, and a range of expansion options—perfect for boosting productivity in field operations. The Android OS version of the RTC Series is also available. These versatile tablets are suitable for industries such as manufacturing, law enforcement, firefighting, energy, and logistics.Marine computing solutionsDarveen is introducing a new marine-grade computer powered by a 13th Gen Intel Core processor. Designed for high-performance marine applications, it features 4x NMEA 0183 ports and 8x isolated GPIO ports, ensuring stable connectivity with various ship instruments and systems. Whether managing electronic chart display and information systems (ECDIS) or handling complex vessel-specific applications, this solution delivers exceptional performance and reliability at sea.Industrial edge computing solutionsBeyond vertical-specific solutions, Darveen will also present its latest industrial embedded computers and HMI panel PCs, designed to handle the challenges of edge computing in harsh industrial environments. These high-performance solutions support smart factories and industrial automation, enabling real-time data processing and control.Darveen's comprehensive product portfolio serves diverse industries with customized solutions tailored to specific application needs. As a trusted provider, we are committed to accelerating our customers' time-to-market with innovative, high-quality computing solutions.Join us at Embedded World 2025 and experience the future of rugged computing firsthand!

BIOSTAR, a leading manufacturer of IPC solutions, motherboards, graphics cards, and PC peripherals, is set to showcase its latest industrial computing and edge AI computing solutions at the upcoming Embedded World 2025. The event will take place from March 11-13, 2025, at Nurnberg Messe, Nurnberg, Germany, with BIOSTAR's booth located at 2-321, Hall 2.At Embedded World 2025, BIOSTAR will spotlight its edge computing solutions powered by Intel CPUs, including AI-driven platforms tailored for industrial automation, smart cities, and HMI (Human-Machine Interface) applications. Key highlights will include 3.5" SBCs, NVIDIA Jetson Orin platforms, and industrial-grade systems engineered for scalable, efficient, and robust performance.As an essential player in the IPC and edge AI industries, BIOSTAR continues to lead the way in providing scalable, efficient, and powerful computing solutions. BIOSTAR's diverse portfolio includes products across multiple form factors, including ATX, Mini iTX, SBC, and embedded industrial computers, ensuring versatility and adaptability for various use cases.Credit: BIOSTARIn addition, with the successful cooperation at CES 2025, BIOSTAR will partner with DEEPX again at the exhibition to integrate AI technologies into its edge computing solutions, further solidifying its leadership in Edge AI platforms. The collaboration with renowned AI chip solution providers underscores BIOSTAR's critical role in shaping the future of intelligent computing.Credit: BIOSTARBIOSTAR is excited to welcome industry professionals, IPC innovators, and tech enthusiasts to join them at Embedded World 2025. The exhibition will feature the latest advancements in edge AI and industrial computing technology, showcasing BIOSTAR's commitment to pushing the boundaries of innovation to address the evolving demands of smart industries. Attendees are welcome to apply for FREE tickets using ew25543325, the BIOSTAR invitation code, and invited to visit booth 2-321, Hall 2, to experience firsthand how BIOSTAR's cutting-edge solutions transform industrial applications through enhanced AI computing capabilities.

In recent years, API attacks—especially those involving shadow APIs— have become an increasing concern. Some of the most destructive types of API attacks include command injection and malicious program uploads, which can grant attackers remote control over hosts and have already led to significant cybersecurity incidents.Additionally, AI-driven attacks are rapidly emerging as a major threat. Hackers are now leveraging AI tools to create sophisticated malware and attack vectors, further escalating security risks.Supply chain vulnerabilities have also become a widespread cybersecurity challenge. Supply chain attacks occur when enterprises are infiltrated through compromised third-party software or hardware provided by external partners. In many cases, companies outsource software development, but their vendors inadvertently incorporate compromised third-party components. These issues are difficult to detect yet have severe and far-reaching consequences. In recent years, RayAegis has also identified compromised third-party components in multiple ATM systems.RayAegis: A Pioneer in Cybersecurity InnovationRayAegis has been at the forefront of cybersecurity and artificial intelligence (AI) for years. As early as 2017, at the IEEE conference in San Jose, USA, RayAegis publicly demonstrated an advanced AI theory designed to detect zero-day vulnerabilities. To this day, AI systems deployed across various countries continue to uncover emerging zero-day attacks, providing robust security defenses.RayAegis also integrates this cutting-edge technology into red team exercises and penetration testing services, helping enterprises strengthen their security posture.Key Global Cybersecurity ChallengesRayAegis has identified several pressing cybersecurity challenges facing enterprises today:Shadow APIs remain widespread: Many organizations unknowingly purchase products that contain shadow APIs, which attackers can exploit to upload malware or gain unauthorized access to systems.Obfuscated OWASP TOP 10 attacks bypassing WAFs: Attackers are using advanced obfuscation techniques to evade Web Application Firewalls (WAFs), allowing threats such as obfuscated JavaScript, SQL injection, XSS, and OS command execution to bypass defenses and compromise backend systems.Failure to detect new, customized malware: Traditional antivirus solutions have limitations. RayAegis has observed that once enterprises are infected with new malware, they often struggle to prevent further threats, including data exfiltration, lateral movement, and system intelligence gathering.Inadequate access controls: Attackers can exploit weak access controls to retrieve unauthorized user information, access internal databases, or leverage critical internal services.LLM vulnerabilities in OWASP TOP 10 (https://genai.owasp.org/llm-top-10/): These vulnerabilities may expose sensitive system information and pose new security risks.RayAegis' AI-Driven Security SolutionsTo address the evolving landscape of cybersecurity threats, RayAegis not only provides professional security services but also develops AI-powered solutions to help enterprises mitigate risks:SandSphere: A sandbox solution that scans files and evaluates the security of supply chain software, including detecting embedded backdoors.UTDS-API: An API inventory system that identifies unmanaged APIs and detects zero-day vulnerabilities.Malware Protection Effectiveness Testing: Assesses an organization's ability to defend against cyber threats by simulating attacks to determine if hackers can extract system information or cause further damage.Credit: RayAegisRayAegis is a global cybersecurity leader, providing cutting-edge security solutions to major banks, government agencies, and enterprises worldwide. Visit the website for more information: https://www.rayaegis.com/english/

Semiconductor testing plays a crucial role in the supply chain, with industry players prioritizing factors such as test speed, cost, signal measurement accuracy, one-stop test capabilities, and software support. Chroma ATE holds a key position in the global ATE (Automated Test Equipment) market, offering a diverse range of solutions and maintaining a strong global presence. Recently, the company hosted a Semiconductor Test Equipment User Conference in Hsinchu, Taiwan, where it shared its 2025 hardware and software test solution roadmap with customers.Commitment to growth with customers: A comprehensive solution blueprint for global expansionGeorge Chang, president of Chroma ATE's Semiconductor Test Business Unit, highlighted in his opening speech that Chroma has been engaged in the semiconductor sector for over 20 years. With an installed base of more than 4,300 test systems worldwide, the company serves markets across Asia, Europe, and the Americas. Chroma's product lines can be categorized into five segments: digital, analog, mixed-signal, interface solutions, and software. The company is also actively developing next-generation products for applications in RF, power, and audio testing.George Chang, president of Chroma ATE's Semiconductor Test BU, stated that as of November 2024, Chroma's global installed base of semiconductor ATE exceeds 4,300 systems. Credit: Chroma ATEFocusing on hardware test platforms with wide range of test boards to meet diverse needsFor wireless solutions, Roger Huang, vice director of the Application Engineering Department at Chroma Group subsidiary Adivic Technology Co., introduced the Chroma 3680 HDRF2 test board. Huang noted that the Chroma 3680 platform natively supports testing of a wide range of chips, but when combined with the HDRF2, it can meet extensive wireless and RF (radio frequency) testing needs, including Wi-Fi 6, BT 5.0/BLE, GPS, and wide-area IoT technologies. Chroma is already developing its successor model, the HDRF3, to address standards such as Wi-Fi 6E/7 and 5G FR1. The company has also developed solutions specifically tailored for the 5G mmWave spectrum. The 30GHz range is addressed by the existing Chroma 3680 HDRF2, while the 48GHz range is supported by the MP5808 model paired with the mmWaveBox, catering to 5G FR2, FR3, and low-earth orbit (LEO) satellite applications.For power-related chip testing, Spancer Lee, senior manager of Product Marketing at Chroma's Semiconductor Test BU, highlighted the pivotal role of the Chroma 3650 platform. Lee noted that since launching the 3650 platform back in 2002, Chroma has continuously evolved its solutions to meet market demands for power management. The company introduced various test boards and solutions to complement the 3650, culminating in the release of its successor, the Chroma 3650-S2, in late 2022. Chroma is also preparing to unveil a new product, the HTMU board, further demonstrating its commitment to addressing diverse voltage and current combinations for power chip testing. The testing needs of third-generation semiconductors with high-voltage specifications can be effectively met by stacking Chroma's HVVI boards.Lee also mentioned that as the design of power chips becomes more complex and the manufacturing process evolves, the timing information and related parameters to be measured for power chips become more challenging. Chroma ATE launched these test boards, together with the Chroma 3650-S2, to meet the testing needs of the new generation of power chips.In the mixed-signal domain, Blair Fan, associate product manager at Chroma's Semiconductor Test BU, focused on the company's roadmap for audio mixed-signal solutions. Fan pointed out that the Bluetooth headset and speaker market is expected to grow at a compound annual growth rate (CAGR) of approximately 20% from 2024 to 2029, reaching a total market value of $38.2 billion. From a product design perspective, challenges in Bluetooth and audio applications include the integration of digital and analog testing, as well as cost control to maintain chip profitability. Chroma addresses these challenges with the Chroma 3380 platform paired with the MXADO module board.Minimizing platform conversion time using large language models (LLMs) Beyond hardware, Chroma has also made significant strides in software solutions. Ray Hsu, software engineer at Chroma's Semiconductor Test BU, explained that in the long run, semiconductor manufacturers will inevitably transition between test platforms. This process typically requires around 140 hours of additional software migration time. However, Chroma leverages Large Language Models (LLMs) to reduce this to just 5 hours. He further explained that the conversion process involves two stages: the first uses LLMs for processing and the second uses Retrieval-Augmented Generation (RAG) technology. Parameter adjustments and removal of unnecessary parameters are still required to ensure ideal conversion results.Hsu emphasized that while conversion is not 100% perfect and still requires manual refinement, it saves substantial amounts of time compared to traditional methods, which is of great benefit to customers.In addition to introducing its next generation of semiconductor test solutions, Chroma invited strategic partners Dr. Chen Wei-yang from TMY Technology and Mr. Tai Yu-che of the R&D and simulation department at Keystone Microtech to share relevant insights on their collaborative advancements.To sum up, Chroma ATE offers a diverse range of solutions covering digital, analog, and mixed-signal testing in the global ATE market. At the recent user conference held in Hsinchu, Chroma unveiled its 2025 roadmap for hardware and software solutions. The company showcased an array of test equipment, including the Chroma 3650, 3680, and the newly launched HDRF series, catering to power management, high-frequency testing, and wireless technology applications.Amid evolving US-China trade dynamics, Chroma is deepening its localized services while utilizing AI technologies like LLM and RAG to shorten software migration times and enhance testing efficiency. Looking ahead, Chroma ATE is poised to continue integrating innovative technologies to meet the testing needs of next-generation semiconductors, foster growth alongside customers, and strengthen its global market presence.Live demonstration of the Chroma 3680 Advanced SoC Test System. Credit: Chroma ATEChroma's Semiconductor Test Equipment User Conference attracted nearly 200 industry professionals. Credit: Chroma ATE