SK Hynix Inc. (or "the company", www.skHynix.com) announced today that it presented a new DRAM technology roadmap for the next 30 years and the direction for a sustainable innovation at the IEEE VLSI symposium 20251 held in Kyoto, Japan.1IEEE VLSI (Institute of Electrical and Electronics Engineers Very Large Scale Integration) symposium: One of the most prestigious academic events in the field of semiconductor circuit and process technology, presenting academic achievement in next-generation semiconductors, AI, memory chips, and packaging. The symposium is held in turn in the US and Japan annually.Cha Seon Yong, CTO (CTO) of SK Hynix, delivered on June 10th a plenary session on "Driving Innovation in DRAM Technology: Towards a Sustainable Future".In his speech, CTO Cha explained that it is increasingly difficult to improve performance and capacity with scaling through the current technology platform2. "In order to overcome such limitations, SK Hynix will apply the 4F² VG (Vertical Gate) platform and 3D DRAM technology to technologies of 10nm level or below with innovation in structure, material, and components," he said.2Tech Platform: A technological framework that can be applied to various generations of productsThe 4F²3 VG4 platform is a next-generation memory technology that minimizes the cell area of DRAM and enables high integration, high speed, and low power through a vertical gate structure.34F²: The area occupied by one cell, a unit to store data, is indicated as F2. F indicates the minimum feature size of a semiconductor. Therefore, 4F2 is an integration technology to put more cells in a chip in which one cell occupies an area of 2F by 2F.4VG (Vertical Gate): A structure in which a gate, which acts as a switch of a transistor, is vertically placed and surrounded by channels. Currently, it is a flat structure where a gate is laid horizontally on top of channels.Currently, 6F2 cells are common, but by applying 4F2 cell and wafer bonding technology that puts the circuit part below the cell area, cell efficiency and electrical characteristics can be improved.CTO Cha also introduced 3D DRAM as the main pillar for the future DRAM along with VG. CTO Cha said that although some in the industry warn of cost increase according to the number of layers stacked, it can be solved by constant technological innovation.Along with structural breakthroughs, the company will also strive to find a new growth engine by sophisticating technologies of critical materials and components of DRAM to lay the foundation for the next 30 years."Until around 2010, DRAM technology was expected to face limitations at 20nms, but with constant innovation, we have made it this far," said CTO Cha. "SK Hynix will continue to guide the future of long-term technological innovation to be a milestone for young engineers in the field of DRAM and maintain cooperation within the industry to bring the future of DRAM into reality."On the last day of the event, Joodong Park, vice president who leads the Next Gen DRAM TF, will present his findings from a recent research on how VG and wafer bonding technology affect the electrical characteristics of DRAM.

Linxens, a global leader in component-based solutions for authentication and traceability, and Dracula Technologies, a pioneer in ambient light energy harvesting, have announced a strategic collaboration to develop next-generation autonomous IoT solutions for traceability and smart labelling applications. This collaboration paves the way for smarter and more sustainable connected devices.Dracula Technologies has developed a breakthrough organic photovoltaic (OPV) technology, LAYER®, capable of harvesting energy even in low or intermittent indoor light. In this collaboration, its OPV modules will be integrated into Linxens' smart label and traceability solutions. Linxens contributes its expertise in the design and industrial production of electronic inlays and flexible components, which are key elements in RFID tags, to create fully battery-free, reusable, and energy-autonomous smart labels.Together, the two companies are addressing one of the key limitations of today's connected labels: reliance on batteries, which reduces lifespan and increases environmental impact. This collaboration represents a technological leap forward, enabling long-lasting, cost-effective, and sustainable traceability solutions for logistics and other industries where durability and energy independence are essential."At Linxens, our goal is to develop technological solutions that meet our clients' needs while anticipating tomorrow's challenges. We believe that innovation only makes sense if it goes hand in hand with responsibility. That's why we consider environmental impact at every stage—from design to end-of-life," said Quentin Pretet, VP of Linxens IoT Solutions. "By integrating Dracula's innovative energy-harvesting technology into our devices, we reinforce our unique ability to deliver fully autonomous solutions that reduce environmental footprint without compromising performance.""Jérôme Vernet, VP Sales of Dracula Technologies, commented, "Our strategic collaboration with Linxens is a natural fit. The complementarity of our technologies and shared vision for a more responsible IoT industry make this collaboration particularly meaningful. By combining Linxens' design and manufacturing expertise with our OPV energy harvesting capabilities, we are enabling a new generation of sustainable, autonomous, and reusable connected devices."About Linxens: Linxens is a global leader in the design and manufacture of smartcard components and innovative electronic solutions. With over 40 years of experience, Linxens has delivered more than 120 billion micro-connectors and 6 billion RFID antennas used in payment and access cards, passports and ID documents worldwide.Operating 8 production facilities and 7 R&D centers across Europe and Asia, Linxens employs nearly 3,000 people and serves key industries including banking, telecommunications, transportation, healthcare, and government. Linxens also provides comprehensive IoT solutions, combining hardware and software for real-time traceability and authentication.For more information: www.linxens.comAbout Dracula Technologies: Dracula Technologies, headquartered in Valence, France, pioneers sustainable energy solutions with its LAYER® technology, revolutionizing power sources for low-power electronics. Its organic photovoltaic (OPV) modules, manufactured using patented digital printing, harvest ambient light, eliminating reliance on traditional batteries. LAYER®Vault complements the company's existing OPV harvesting product line, transforming it into a 2-in-1 product, combining low-light energy harvesting and storage on a single, flexible film ensuring uninterrupted device functionality, empowering Smart Buildings, Smart Homes, Smart Asset Tracking, and other related applications. With a commitment to clean, renewable energy, Dracula Technologies leads the charge towards a greener future by providing long-lasting, and cost-effective energy solutions. Supporting its mission is its new "Green Micropower Factory"—a state-of-the-art, fully automated facility, the largest of its kind in the world with a capacity of up to 150 million cm² of printed OPV devices per year.