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Winbond and Infineon clinch deal for 0.11-micron DRAM technology

Hans Wu, Taipei; Jane Wang, DIGITIMES Asia Friday 3 May 2002 0

Following a memorandum of understanding (MOU) in March, Taiwan-based Winbond Electronics announced on May 2 the signing of a definitive agreement to license 0.11-micron DRAM technology from Infineon Technologies.

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