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NPC to relocate wirebond capacity to China

Ingrid Lee, Taipei; Esther Lam, DIGITIMES Asia Tuesday 29 July 2008 0

Having already identified flip-chip (FC) substrates as a key sales driver in 2008, Nan Ya Printed Circuit Board (NPC) plans to relocate its low-margin production to China in order to focus on high-margin goods, such as FC substrates, in Taiwan, according...

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