Leadframe makers rebuilding inventory to meet demand for wireless chips

Ingrid Lee, Taipei; Meiling Chen, DIGITIMES Asia Wednesday 20 May 2009 0

Tight supply of leadframes used in quad-flat-pack-no lead (QFN) packaging for network and communication chips is expected to ease at the end of May 2009, as Japan-based material suppliers have begun to rebuild inventory levels after seeing increased...

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