Global supply chain: China market

China market news coverage

IN THE NEWS

Thursday 10 September 2026

Taiwan EV charging operators face profit squeeze despite rapid network expansion

Taiwan's EV charging industry remains in a fiercely competitive, fragmented phase, according to Blockcert chairman Chang Chung-I. While charging stations may appear to offer an unattended...

Thursday 10 September 2026

Samsung pushes into display-equipped smart glasses as Meta leads market

Samsung Electronics has begun developing its first smart glasses with an in-lens display, asking Samsung Display in August to develop a microdisplay that meets requirements for form...

Thursday 10 September 2026

Navigating economies of scale: how South Korea and China are reshaping the OLED market

Economies of scale occur when a company's average cost per unit falls as overall production volume increases. In the competitive display industry, reaching this state relies on either...

Thursday 10 September 2026

Foxsemicon hits record 2Q26 revenue on Thailand ramp-up

Foxsemicon Integrated Technology (FITI) posted record consolidated revenue of NT$6.3 billion (approx. US$200.0 million) in the second quarter of 2026, up 13.3% quarter-over-quarter...

Thursday 10 September 2026

Shinkong Synthetic Fibers partners with Earthbook, Jedsy to tap Taiwan's medical drone logistics market

Shinkong Synthetic Fibers Corporation (SSFC) is stepping into Taiwan's emerging low-altitude economy, partnering with Taiwan-based drone-data and AI platform Earthbook and Swiss medical...

Thursday 10 September 2026

Gem Terminal rides China plug rule shift for 8.8% sales growth

Gem Terminal Industry said its August 2026 consolidated revenue continued to show steady growth, helped by the approaching conversion deadline for China's new insulation requirements...

Thursday 10 September 2026

AUO matching glass substrate size stokes TSMC collab speculation

AUO is accelerating its transformation by extending its established large-format panel manufacturing capabilities into advanced semiconductor packaging.

Thursday 10 September 2026

China's Nvidia rivals raise prices as HBM shortage bites

Chinese chipmakers challenging Nvidia are sharply raising prices for current and next-generation accelerators as high-bandwidth memory (HBM) becomes scarcer and more expensive, adding...

Thursday 10 September 2026

Intelligo targets double-digit 2027 revenue growth on AI IP, ASICs

Intelligo said it is aiming for double-digit revenue growth in 2027 as AI IP licensing and AI edge-computing ASICs expand its reach into smartphones, notebooks, earbuds, gaming consoles...

Thursday 10 September 2026

Enflame to list on Septemper 11 as China's four major domestic GPU makers complete IPOs

Chinese AI chipmaker Enflame will list on the STAR Market of the Shanghai Stock Exchange on September 11, 2026, becoming the last of...

Thursday 10 September 2026

India's fraud office seeks a Xiaomi probe as the market it once led shrinks around it

A recommended corporate-fraud investigation would reach Xiaomi at the weakest point its India business has known. India's Serious Fraud...

Thursday 10 September 2026

China sets clear limits on payment terms to auto suppliers

China's government is formally imposing rules on long payment terms in the auto supply chain, with the Ministry of Industry and Information Technology (MIIT) and the State Administration...

Thursday 10 September 2026

Taiwan chipmakers target humanoid robots beyond the 'brain,' focusing on vision, motor control

Taiwanese IC design companies have recently begun highlighting opportunities in physical AI and robotics. Arm's recently announced expansion...

Thursday 10 September 2026

DeepSeek reportedly advances Shanghai IPO plans as it cuts Flash model API prices

Chinese AI startup DeepSeek has taken a concrete step toward a domestic stock-market debut while continuing to adjust its commercial strategy, including another reduction in API prices...

Thursday 10 September 2026

Spirox TGV inspection capable of scanning entire substrate in 20 minutes

As advanced packaging moves toward higher-density stacking, demand is rising for glass through-glass via (TGV) and through-silicon via (TSV) inspection, while glass core substrates...

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