Global supply chain: China market

China market news coverage

IN THE NEWS

Friday 17 July 2026

China's DRAM milestone arrives with CXMT IPO; HBM now separates contenders from leaders

ChangXin Memory Technologies (CXMT) opened subscriptions for its STAR Market IPO on July 16, launching one of China's largest A-share listings...

Friday 17 July 2026

China moves to institutionalize its vision for global AI governance as Xi launches cooperation body

China used the opening of the 2026 World Artificial Intelligence Conference (WAIC) in Shanghai to institutionalize its bid to shape global governance of artificial intelligence (AI),...

Friday 17 July 2026

Analysis: Unveiling the low-profile engineer building China's CXMT into a DRAM heavyweight

ChangXin Memory Technologies' (CXMT) STAR Market IPO is more than just one of China's biggest semiconductor listings. It also marks...

Friday 17 July 2026

AI memory squeeze pushes automakers to shield supply chains

AI giants are soaking up memory chips with vast capital, tightening supply for other industries and raising costs worldwide. The pressure...

Friday 17 July 2026

Vietnam opens green power market, clearing the way for Foxconn and suppliers

Vietnam has opened direct access to green electricity for companies, easing a major obstacle for Foxconn and its suppliers as global...

Friday 17 July 2026

Exclusive: PC brands reportedly rush to secure CXMT memory as orders extend to end-2027

Chinese DRAM maker ChangXin Memory Technology's (CXMT) IPO has entered its final stage, drawing close market attention. PC supply chain sources said the US had briefly planned to add...

Friday 17 July 2026

Hygon forecasts higher first-half 2026 revenue and profit

Hygon Information Technology said its first-half 2026 results are expected to rise sharply, signaling continued demand for domestic high-end chips as AI, cloud computing, and localization...

Friday 17 July 2026

TSMC's US$100 billion bet: AI growth, US pressure and the cost of staying ahead

Taiwan Semiconductor Manufacturing Company (TSMC) posted record second-quarter earnings for 2026, issued third-quarter revenue guidance above market expectations, and raised its full-year...

Friday 17 July 2026

Moonshot's free Kimi K3 matches Anthropic's Opus 4.8, closing the gap between open and proprietary AI

Chinese AI developer Moonshot AI released Kimi K3 on July 16, a 2.8-trillion-parameter model the company bills as the first open model in the roughly 3-trillion-parameter class, pushing...

Friday 17 July 2026

Taiwan backs TSMC's US expansion while reaffirming advanced chip leadership at home

TSMC said on July 16 that it will add US$100 billion to its US investment, bringing the total to US$265 billion. Taiwan's Executive Yuan said it respects companies expanding in the...

Friday 17 July 2026

China auto sales slump deepens as exports face rising trade scrutiny

China's passenger vehicle market posted its sharpest slowdown in years in the first half of 2026, with private passenger car sales falling 20% year on year, according to the China...

Friday 17 July 2026

Australia strips voting rights from China-linked holdouts in rare-earths miner, curbing Beijing's mineral leverage

Australia has escalated a two-year campaign to force Chinese investors out of Northern Minerals Ltd., barring three China-linked shareholders...

Friday 17 July 2026

CPU demand rebounds in AI data centers as TSMC stands to benefit across architectures

Taiwan Semiconductor Manufacturing Company (TSMC) held its second-quarter 2026 earnings conference on July 16, where chairman and CEO...

Friday 17 July 2026

Hotai Leasing sees Taiwan auto market stabilizing as leasing demand grows

Hotai Leasing said on July 15 that Taiwan's auto market is expected to return gradually to normal growth in 2026 after tariff uncertainty, vehicle shortages, and tight financing pressured...

Friday 17 July 2026

China's AI chips hit three walls — and bet on 3D memory to break through

China's AI chip industry is moving beyond a contest over process nodes and into a broader race involving memory, advanced packaging, chip interconnects and system architecture.

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