Slower-than-expected monetization of smart cockpits is prompting a global reassessment of in-car payments, with implications for automakers, tech platforms, and financial institutions...

Tongtai Machine & Tool's chairman warned that shifts caused by the Russia-Ukraine war and China's industrial growth have global implications for supply chains and industrial sourcing,...

Dell Taiwan general manager Terence Liao said enterprise adoption of AI will continue expanding in scope and scale through 2026. Dell has shipped Nvidia's B300 and GB300 AI servers,...

When TSMC chairman C.C. Wei recently dismissed the hype around Chinese robots as "just for show," it sparked heated debate across the tech sectors on both sides of the Taiwan Strait...

Ritek's warning that geopolitical tensions, petrochemical volatility, and rising manufacturing costs have tightened polycarbonate supplies points to global impacts: recordable optical...

MicroIP unveiled automotive AI advances at AI EXPO Taiwan 2026, signaling wider availability of driver monitoring and electronic rearview mirror solutions for global fleets and aftermarket...

Europe's new car market posted modest growth in February 2026. BEV and PHEV sales drove the gains, while internal combustion engine (ICE) models continued to lose ground. Chinese automakers...

Samsung SDI has secured a multi-year supply of LFP cathode materials from L&F, strengthening its North American energy storage system (ESS) strategy and reducing reliance on Chinese...

SEMICON China 2026 opened on March 25 in Shanghai, as the global semiconductor industry enters a new expansion cycle fueled by the rapid rise of artificial intelligence.

As countries tighten controls on advanced chips and AI computing demand surges, how China secures compute resources matters globally. DIGITIMES Research reports H3C, a top Chinese...

Samsung Electronics and SK Hynix are significantly increasing capital expenditures at their factories in China to expand chip supply and enhance profitability. According to Seoul...

As advanced packaging pushes toward 3D integration and high-bandwidth computing, hybrid bonding has emerged as a critical battleground for semiconductor equipment makers.

SK Hynix is actively evaluating whether to adopt TSMC's 3nm process for the logic die of its seventh-generation high-bandwidth memory (HBM4E), aiming to close Samsung Electronics'...

Taiwan is accelerating its robotics strategy to address a rapidly aging population and capture emerging global demand, with the Robotics Innovation Alliance (RIA) mobilizing cross-industry...

Broadcom recently announced that it completed development of a 400G single-lane PAM4 digital signal processor (DSP) at the Optical Fiber Communication Conference (OFC) 2026, signaling...